Silicon Laboratories XG27 Bedienungsanleitung

UG554: xG27 Dev Kit User's Guide

The xG27 Dev Kit is a low-cost, small form factor prototype and

development platform for the EFR32BG27 Wireless Gecko Sys-

tem-on-Chip.

The board is a small and cost-effective, feature-rich, prototype and development platform

based on the EFR32™ Wireless Gecko System-on-Chip. The xG27 Dev Kit is an ideal

platform for developing energy-friendly connected IoT devices.

The xG27 Dev Kit ships with a Bluetooth demo that works with a cloud connected smart-

phone app, showcasing easy collection of environmental and motion sensor data, as well

as button and LED control.

A built in SEGGER J-Link debugger ensures easy debugging through the USB Micro-B

connector.

TARGET DEVICE

• EFR32 Wireless Gecko System-on-Chip

(EFR32BG27C140F768IM40)

•Cortex-M33 w/FPU with 76.8 MHz

maximum operating frequency

• 512 kB flash and 32 kB RAM

• Energy-efficient radio core with low

active and sleep currents

• Bluetooth 5.2 Direction Finding

• Integrated PA with up to 8 dBm

(2.4 GHz) TX power

• Secure Boot with Root of Trust and

Secure Loader (RTSL)

KIT FEATURES

• 2.4 GHz ceramic chip antenna

•Power control of on-board peripherals for

ultra-low-power operation

•Relative humidity and temperature sensor

• Ambient light sensor

• Hall effect sensor

• 6-axis inertial sensor

• PDM stereo microphones

• 8 Mbit flash for OTA programming and

data logging

• User LED and push button

• 20-pin 2.54 mm breakout pads

• SEGGER J-Link on-board debugger

• Virtual COM port

• Packet Trace Interface (PTI)

• Mini Simplicity connector for AEM and

packet trace using external Silicon Labs

debugger

• USB or coin cell battery powered.

SOFTWARE SUPPORT

• Simplicity Studio™

Table of Contents

1. Introduction ................................

1.1 Kit Contents ...............................4

1.2 Getting Started ..............................4

1.3 Hardware Content .............................4

1.4 Kit Hardware Layout ............................5

2. Specifications ...............................6

2.1 Recommended Operating Conditions ......................6

2.2 Current Consumption ............................7

3. Hardware .................................9

3.1 Block Diagram ..............................9

3.2 Power Supply ..............................10

3.3 EFR32BG27 Reset ............................10

3.4 Peripherals ...............................11

3.4.1 Si7021 Relative Humidity and Temperature Sensor ................12

3.4.2 Si7210 Hall Effect Sensor .........................12

3.4.3 VEML6035 Ambient Light Sensor ......................13

3.4.4 PDM Stereo Microphones .........................13

3.4.5 ICM-20648 6-Axis Inertial Sensor ......................14

3.4.6 Push Button and LED ..........................15

3.4.7 External Memory ............................15

3.5 On-board Debugger ............................16

3.6 Connectors ...............................17

3.6.1 Breakout Pads ............................18

3.6.2 Mini Simplicity Connector .........................19

3.6.3 Debug USB Type-C Connector .......................19

4. Debugging ...............................20

4.1 On-board Debugger ............................21

4.2 External Debugger.............................21

4.3 Virtual COM Port .............................21

5. Radio .................................22

5.1 RF Section ...............................22

5.1.1 Description of the RF Matching .......................22

5.1.2 RF Section Power Supply .........................22

5.1.3 RF Matching Bill of Materials ........................22

5.1.4 Antenna ...............................23

5.1.5 Antenna Matching Bill of Materials ......................23

5.2 EMC Regulations for 2.4 GHz .........................24

5.2.1 ETSI EN 300-328 Emission Limits for the 2400-2483.5 MHz Band ...........24

5.2.2 FCC15.247 Emission Limits for the 2400-2483.5 MHz Band .............24

silabs.com | Building a more connected world. Rev. 1.0 | 2

5.2.3 Applied Emission Limits .........................24

5.3 Relaxation with Modulated Carrier .......................24

5.4 Radiated Power Measurements ........................25

5.4.1 Maximum Radiated Power Measurement ...................25

5.4.2 Antenna Pattern Measurement .......................26

5.5 EMC Compliance Recommendations ......................28

5.5.1 Recommendations for 2.4 GHz ETSI EN 300-328 Compliance ............28

5.5.2 Recommendations for 2.4 GHz FCC 15.247 Compliance ..............28

6. Schematics, Assembly Drawings, and BOM ...................29

7. Kit Revision History ............................30

8. Board Revision History and Errata ......................31

8.1 Revision History .............................31

8.2 Errata .................................31

9. Document Revision History .........................32

silabs.com | Building a more connected world. Rev. 1.0 | 3

1. Introduction

The xG27 Dev Kit (OPN: xG27-DK2602A) has been designed to inspire customers to make battery-operated IoT devices with the Sili-

con Labs EFR32BG27 Wireless Gecko System-on-Chip. The highlights of the board include four different environmental sensors and

stereo PDM microphones accessible to the EFR32BG27 wireless MCU. The peripherals have been grouped into power domains that

can be turned on and off by the application code as needed.

Programming the xG27 Dev Kit is easily done using a USB Micro-B cable and the on-board J-Link debugger. A USB virtual COM port

provides a serial connection to the target application, and the Packet Trace Interface (PTI) offers invaluable debug information about

transmitted and received packets in wireless links. Included on the board is an 8 Mbit serial flash that can be used for Over-The-Air

(OTA) firmware upgrade, or as a general purpose non-volatile memory. The xG27 Dev Kit is supported in Simplicity Studio™, and a

Board Support Package (BSP) is provided to give application developers a flying start.

Energy profiling and advanced wireless network analysis and debugging tools are available through the provided Mini Simplicity Con-

nector using an external Silicon Labs debugger.

Connecting external hardware to the xG27 Dev Kit can be done using the 20 breakout pads, which present peripherals from the

EFR32BG27 Wireless Gecko such as I2C, SPI, UART, and GPIOs. The breakout pads follow the same pinout as the expansion head-

ers (EXP) on other Silicon Labs Starter Kits.

1.1 Kit Contents

The following items are included in the box:

• 1x xG27 Dev Kit board (BRD2602A).

1.2 Getting Started

Detailed instructions for how to get started with your new xG27 Dev Kit can be found on the Silicon Labs web page: https://

www.silabs.com/dev-tools

1.3 Hardware Content

The following key hardware elements are included on the xG27 Dev Kit:

• EFR32BG27 Wireless Gecko SoC with 76.8 MHz operating frequency, 512 kB flash, and 32 kB RAM

• 2.4 GHz ceramic antenna for wireless transmission

• Silicon Labs Si7021 relative humidity and temperature sensor

• Silicon Labs Si7210 hall effect sensor

• Vishay VEML6035 ambient light sensor

• TDK InvenSense ICM-20689 6-axis inertial sensor

• Two Knowles SPK0641HT4H-1 MEMS microphones

• Macronix ultra low power 8 Mbit SPI flash (MX25R8035F)

• One LED and one push button

• Power enable signals and isolation switches for ultra-low power operation

• On-board SEGGER J-Link debugger for easy programming and debugging, which includes a USB virtual COM port and Packet

Trace Interface (PTI)

• Mini Simplicity connector for access to energy profiling and advanced wireless network debugging

• Breakout pads for GPIO access and connection to external hardware

• Reset button

• Automatic switchover between USB and battery power

• CR2032 coin cell holder

UG554: xG27 Dev Kit User's Guide

Introduction

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1.4 Kit Hardware Layout

xG27 Dev Kit layout is shown below.

Top View Bottom View

Push Button

30.4 mm

45.4 mm

Reset Button

20-pin EXP-header

Breakout Pads

6-axis

Inertial Sensor

USB Micro-B Connector

- Virtual COM port

- Debug access

- Packet trace

Hall Effect

Sensor

Humidity and

Temperature Sensor

Mini Simplicity

Connector

Ambient

Light

Sensor

EFR32BG27

Wireless Gecko

2.4 GHz

Chip Antenna

On-board USB

J-Link Debugger

CR2032 Coin Cell

Holder

Left PDM

Microphone

Right PDM

Microphone

LED

Figure 1.1. xG27 Dev Kit Hardware Layout

UG554: xG27 Dev Kit User's Guide

Introduction

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2. Specifications

2.1 Recommended Operating Conditions

The following table provides guidelines for correct use of the xG27 Dev Kit, indicating typical operating conditions and some design

limits.

Table 2.1. Recommended Operating Conditions

Parameter Symbol Min Typ Max Unit

USB Supply Input Voltage VUSB — 5.0 — V

Battery Supply Input Voltage VVBAT 2.0 3.0 3.3 V

Supply Input Voltage (VMCU supplied externally)1,2 VVMCU 2.0 3.0 3.6 V

Operating Temperature TOP — 20 — ˚C

Note:

1. The maximum supply voltage may be less under certain conditions when using the EFR32BG27's dc-dc converter. For more in-

formation, see the EFR32BG27 data sheet.

2. Not recommended for use with rechargeable Lithium batteries. Most Li-Ion and Li-Po cells exceed 3.6 V when fully charged.

UG554: xG27 Dev Kit User's Guide

Specifications

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2.2 Current Consumption

The table below summarizes the data sheet current consumption of the various components on the board. The operating current of the

board greatly depends on the application. The number of enabled sensors, how often they are sampled, and how often the radio is

transmitting or receiving are examples of factors that influence the operating current. In many cases the given conditions differ from the

operating conditions on the xG27 Dev Kit, but the table can still be used as an indication of how much each feature contributes to the

total current consumption. More details can be found in the specific data sheet for each device.

Table 2.2. Current Consumption

Parameter Symbol Condition Typ Unit

EFR32BG27 Current Con-

sumption1

IEFR32 MCU current consumption in EM0 mode with all peripher-

als disabled (dc-dc converter at 3.0 V input and 1.8 V out-

put, VSCALE1, 38.4 MHz crystal, CPU running Prime from

flash at 25 ˚C)

30 µA/MHz

EM4, no BURTC, no LF oscillator 0.18 µA

Radio system current consumption in receive mode, active

packet reception (dc-dc converter at 3.0 V input and 1.8 V

output, MCU in EM1 and all MCU peripherals disabled,

HCLK = 38.4 MHz, 1Mbit/s, 2GFSK, f = 2.4 GHz,

VSCALE1 at 25 ˚C)

4 mA

Radio system current consumption in transmit mode (dc-

dc converter at 3.0 V input and 1.8 V output, MCU in EM1

and all MCU peripherals disabled, HCLK = 38.4 MHz, f =

2.4 GHz, CW, 8 dBm output power, VSCALE1 at 25 ˚C)

11.5 mA

Ambient Light Sensor Cur-

rent Consumption 2

IVEML6035 Shutdown at 1.8 V 0.5 µA

Operation mode at 1.8 V (ALS only) 170 µA

RH/Temp Sensor Current

Consumption3

ISi7021 Standby, -40 to +85˚C 0.06 µA

RH conversion in progress 150 µA

Temperature conversion in progress 90 µA

Peak IDD during I2C operations 3.5 mA

Hall Effect Magnetic Sensor

Current Consumption 4

IDD Sleep mode at 3.3 V 50 nA

Average current for periodic activation at 3.3 V, sleep tim-

er enabled, 200 msec sleep time

0.4 µA

Conversion in progress at 3.3 V 5 mA

Microphone Current Con-

sumption5

IMIC Sleep mode current (Fclock = 0 Hz, VDD = 3.6 V) 26 µA

Supply current in performance mode (VDD = 3.6 V, Fclock

= 2.4 MHz)

700 µA

IMU Current Consumption6IIMU Full-chip sleep mode at 1.8 V supply 6 µA

Gyroscope only, 100 Hz update rate at 1.8 V supply 1.6 mA

Accelerometer only, 100 Hz update rate at 1.8 V supply 57 µA

Gyroscope + Accelerometer, 100 Hz update rate at 1.8 V

supply

1.9 mA

Serial Flash Memory Cur-

rent Consumption 7

IFlash Deep power-down current in ultra-low-power mode at 1.8

0.007 µA

Standby current in ultra-low-power mode at 1.8 V 5 µA

Write status register current in ultra-low-power mode at

1.8 V

3.1 mA

UG554: xG27 Dev Kit User's Guide

Specifications

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Parameter Symbol Condition Typ Unit

On-board Debugger Sleep

Current Consumption 8

IDBG On-board debugger current consumption when USB cable

is not inserted (EFM32GG12 EM4S mode current con-

sumption)

80 nA

Minimum Board Current

Consumption

IBOARD Minimum total board current consumption for VMCU = 3.0

V with EFR32BG27 in EM4S, the USB cable disconnec-

ted, and all peripherals either in sleep mode or disconnec-

ted

0.4 µA

Note:

1. From EFM32BG27 data sheet

2. From VEML6035 data sheet

3. From Si7021-A20 data sheet

4. From Si7210 data sheet

5. From SPK0641HT4H-1 data sheet

6. From ICM-20648 data sheet

7. From MX25R8035F data sheet

8. From EFM32GG12 data sheet

UG554: xG27 Dev Kit User's Guide

Specifications

silabs.com | Building a more connected world. Rev. 1.0 | 8

3. Hardware

The core of the xG27 Dev Kit is the EFR32BG27 Wireless Gecko System-on-Chip. The board also contains several peripherals con-

nected to the EFR32BG27. Refer to section 1.4 Kit Hardware Layout for hardware component placement and layout information.

3.1 Block Diagram

An overview of the xG27 Dev Kit is illustrated in the figure below.

Memory

Sensors

Radio

Device Connectivity & Debugging

J-Link

Debugger

USB Micro-B

Connector

2.4 GHz

Antenna

8 Mbit

MX25R

Button and LED

EFR32BG27

Wireless SoC

Breakout Pads

(EXP-Header pinout)

Si7021 Si7210

VEML6035

Temperature

& Humidity

Sensor

Ambient

Light

Sensor

Hall Effect

Sensor

SPK0641HT4H-1 ICM-20648

2x PDM

Microphones

6-axis Inertial

Sensor

User Button

& LED

Mini-Simplicity

Connector

Serial Flash

Figure 3.1. Kit Block Diagram

UG554: xG27 Dev Kit User's Guide

Hardware

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3.2 Power Supply

The kit can be powered through one of these interfaces:

• USB Type-C

•Battery

• Mini Simplicity connector

The figure below shows the power options available on the kit and illustrates the main system power architecture.

USB Micro-B LDO

5V0

IN OUT

Automatic

Switchover

3V0

VMCU

Battery

EFR32BG27

Wireless SoC

Peripherals

Mini Simplicity

Connector

Figure 3.2. xG27 Dev Kit Power Architecture

Power is normally applied either through the USB cable or a CR2032 battery. When the USB cable is connected, VBUS is regulated

down to 3.0 V. An automatic switchover circuit switches the main system power from battery power to USB power when the USB cable

is inserted and protects the battery from reverse current.

Power can also be applied through the Mini Simplicity connector. This requires that no other power sources are present on the kit, as

power is injected directly to the VMCU net. It is important to follow this process to avoid power conflicts and backfeeding the battery.

Powering the xG27 Dev Kit through the Mini Simplicity connector allows current measurements using the Advanced Energy Monitoring

(AEM) as described in section 4.2 External Debugger.

Important: When powering the board through the Mini Simplicity connector, the USB and battery power sources must be removed.

The power supply options are summarized in the table below.

Table 3.1. xG27 Dev Kit Power Options

Supply Mode Typical Input Voltage VMCU Source 3V0 5V

USB power 5.0 V On-board regulator On-board regulator USB VBUS

CR2032 battery 3.0 V Battery voltage Disconnected No voltage present

Mini Simplicity 3.3 V Debugger dependent Disconnected No voltage present

3.3 EFR32BG27 Reset

The EFR32BG27 can be reset by a few different sources:

• A user pressing the RESET button.

•The on-board debugger pulling the #RESET pin low.

• An external debugger pulling the #RESET pin low.

UG554: xG27 Dev Kit User's Guide

Hardware

silabs.com | Building a more connected world. Rev. 1.0 | 10

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