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Certification Details
SnapNrack TopSpeed™ mounting system has been evaluated by Underwriters Laboratories (UL) and
Listed to UL Standard 2703 for Grounding/Bonding, and Fire Classification.
Grounding/Bonding
Only specific components have been evaluated for bonding, and are identified as being in the ground
path. The TopSpeed™ components that have been evaluated for bonding are the Mount Assembly
(Mount Clamp Top, Module Clamp Tower, Angle Bracket), Clamp Assembly, Universal Skirt, Universal
Skirt Clamp, Ground Lugs, and Smart Clips.
Universal Skirt Spacers, Mount Channel Nut, and Mount Base are not required to be bonded to the
system based on the exceptions in clause 9.1 of UL 2703 1st Ed. Wire management clips are utilized to
route conductors away from these components and must be assembled according to the instructions.
This mounting system may be used to ground and/or mount a PV module complying with UL 1703
or UL 61703 only when the specific module has been evaluated for grounding and/or mounting in
compliance with the included instructions. See Appendix A for the list of modules tested for use with
the TopSpeed™ System for integrated grounding.
Ground Lugs have been evaluated to both UL 467 and UL 2703 Listing requirements. The following
ground lugs have been approved for use: SnapNrack model 242-92202, and Ilsco models GBL-4DBT
and SGB-4.
The following components have been evaluated for bonding as the fault current ground path:
TopSpeed™ Mount Assembly, (Mount Clamp Top, Module Clamp Tower, Angle Bracket), Clamp
Assembly, Wire Management Clips, and Ground Lugs. In order to maintain the Listing for bonding,
wire management clips must be assembled to route conductors away from parts that have not been
evaluated for bonding.
A Listed (QIMS) and Unlisted Component (KDER3) grounding lug, SnapNrack part no. 242-92202, is
attached to the module frame flange for the normal attachment of a Grounding Electrode Conductor,
which provides bonding within the system and eventual connection to a Grounding Electrode, as
required by the U.S. NEC. Details of part no. 242-92202 can be found in Volume 1, Section 4, and
Volume 2, Section 2. When this method is used, the grounding symbol is stamped onto the body of the
ground lug to identify the grounding terminal.
An alternate method of grounding, a UL Listed (KDER and QIMS) grounding lug, Ilsco (E34440
and E354420) model SGB-4 is attached to the module frame flange. When this method is used, the
grounding terminal is identified by the green colored screws of the lug.
An alternate method of grounding, a UL Listed (KDER and QIMS) grounding lug, Ilsco (E34440 and
E354420) model GBL-4BDT is attached to the module frame flange through the specified hardware and
torque values. When this method is used, the grounding terminal is identified by the green colored set
screw of the lug.
An alternate method of grounding, Enphase R/C (QIKH2)(QIMS2) model M250, M215 & C250 is bonded
to the Listed PV module frame by the Enphase R/C (QIMS2) Model EFM-XXMM anodization piercing
mounting/clamping kit. The total roof-mounted PV system is bonded (modules and microinverters)
together and the assembly is bonded to ground through the Enphase R/C (QIMS2) Engage Cables;
Model ETXX-240, ETXX-208 or ETXX-277, when properly grounded at the service entrance.
R/C (QIMS2), Dynoraxx (E357716) photovoltaic bonding device cat. no. Dynobond is an optional
component that may be used with this system. The Dynobond device has been evaluated to provide
module to module bonding. The Dynobond device attaches to the frame flange of adjacent modules
Listed (QIMS), SnapNrack MLPE Frame Attachment Kit model 242-02151 has been investigated to bond
approved MLPE device back plates to frames of modules.
