Sony XM-1902GX Bedienungsanleitung

SERVICE MANUAL

US Model

XM-1502SX/1902GX

Canadian Model

AEP Model

UK Model

E Model

XM-1502SX

XM-1502SX/1902GX

STEREO POWER AMPLIFIER

Other Specifications

Circuit system OTL (output transformerless) circuit

Pulse power supply

Inputs RCA pin jacks

High level input connector

Outputs Speaker terminals

Through out pin jacks

Speaker impedance 2 – 8 Ω(stereo) (XM-1502SX)

1.3 – 8 Ω(stereo) (XM-1902GX)

4 – 8 Ω(when used as a bridging amplifier)

Maximum outputs 300 W ×2 (at 4 Ω)

760 W (monaural) at 4 Ω

Rated outputs (supply voltage at 14.4 V)

150 W ×2 (20 Hz – 20 kHz, 0.04% THD,

at 4 Ω)

190 W ×2 (20 Hz – 20 kHz, 0.1% THD,

at 2 Ω)

190 W ×2 (20 Hz – 20 kHz, 0.1% THD,

at 1.3 Ω) (XM-1902GX)

380 W ×1 (20 Hz – 20 kHz, 0.1% THD,

at 4 Ω) (XM-1902GX)

380 W (monaural) (20 Hz – 20 kHz, 0.1% THD,

at 4 Ω) (XM-1502SX)

Frequency response 5 Hz – 100 kHz ( dB)

Harmonic distortion 0.005% or less (at 1 kHz, 4 Ω)

Input level adjustment range

0.2 – 6.0 V (RCA pin jacks)

0.4 – 12.0 V (High level input)

High-pass filter 50 – 300 Hz, –12 dB/oct

Low-pass filter 50 – 300 Hz, –12 dB/oct

Low boost 0 – 10 dB (40 Hz)

Phase shift adjustment range (XM-1902GX)

0° – 180° (at 40 Hz)

Power supply voltage 10.5 – 16 V

Current drain at rated output : 40 A (at 4 Ω)

Remote input : 2 mA

Dimensions Approx. 358 ×50 ×264 mm

(14 1/8 ×2 1/4 ×10 1/2 in.)

(w/h/d) not incl. projecting parts and controls

Mass Approx. 3.5 kg (7 lb. 11 oz.) not incl. accessories

Supplied accessories Mounting screws (4)

Design and specifications are subject to change without

notice.

SPECIFICATIONS

AUDIO POWER SPECIFICATIONS

POWER OUTPUT AND TOTAL HARMONIC DISTORTION

150 watts per channel minimum continuous average power into

4 ohms, both channels driven from 20 Hz to 20 kHz with no more

than 0.04% total harmonic distortion per Car Audio Ad Hoc

Committee standards.

+0.5

–3

Photo: XM-1902GX

Ver 1.1 2001.06

9-870-239-12

2001F0400-1

Sony Corporation

e Vehicle Company

Shinagawa Tec Service Manual Production Group

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TABLE OF CONTENTS

1. GENERAL

Location and Function of Controls.......................................... 3

Connections ............................................................................. 3

2. DISASSEMBLY

2-1. Plate, Bottom....................................................................... 6

2-2. Main Board ......................................................................... 6

2-3. Front Panel .......................................................................... 7

2-4. Led Board ............................................................................ 7

3. ELECTRICAL ADJUSTMENT...................................... 8

4. DIAGRAMS

4-1. Block Diagram .................................................................... 9

4-2. Printed Wiring Boards –Main Section– ............................ 11

4-3. Schematic Diagram –Main Section (1/2)– ........................ 12

4-4. Schematic Diagram –Main Section (2/2)– ........................ 13

5. EXPLODED VIEWS

5-1. Heat Sink Section .............................................................. 14

5-2. Main Board Section .......................................................... 14

6. ELECTRICAL PARTS LIST......................................... 15

Notes on Chip Component Replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

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SECTION 1

GENERAL This section is extracted

from instruction manual.

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SECTION 2

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. PLATE, BOTTOM

2-2. MAIN BOARD

1BTP 3x6

5plate, bottom

7sheet, insulating

2BTP 3x6

3BTP 3x6

4P 2.6x2.8

1BTP 3x6 8CN808

2BTP 3x6

3B.TT. 3x14 4B.TT. 3x14

5B.TT. 3x14

7MAIN board section

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2-3. FRONT PANEL

2-4. LED BOARD

1BTP 3x6

2LED board

heat sink (main

)

1P 3x8

2P 3x8

3panel (2ch), front

4MAIN board

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Bias Adjustment

Note : In Bias Adjustment, adjust RV105 if any of Q108 through

Q113 are replaced. Adjust RV205 if any of Q208 through

Q213 are replaced.

Condition : This adjustment should be performed about one minute

after the remote mode is turned on at a room tempera-

ture of about 25°C.

Setting :

SECTION 3

ELECTRICAL ADJUSTMENT

– MAIN BOARD (COMPONENT SIDE) –

RV105

BIAS ADJUSTMENT

RV205

BIAS ADJUSTMENT

Procedure :

1. Turn the variable resistors RV105 (L-CH) and RV205 (R-CH)

full clockwise as seen from the component side to minimize the

bias current.

2. The input signal is to be no signal.

3. Apply the voltage to the B+ and REM terminals from the stabi-

lized power supply and gradually increase it up to 14.4 V while

checking for any unusual current.

4. For the XM-1502SX, adjust each of RV105 (L-CH) and RV205

(R-CH) so that the power current of the stabilized power supply

is increased in steps of 500 mA (total of 1 A). For the XM-

1902GX, adjust each of RV105 (L-CH) and RV205 (R-CH) so

that the power current is increased in steps of 600 mA (total of

1.2 A).

5. After adjustment, check that the power current is at 1.3 to 2.0 A.

Adjustment Location : Main board (component side)

Stabilized

Power suppy

B+,REM terminal

set

GND termina

Ver 1.1 2001.06

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XM-1502SX/1902GX

4-1. BLOCK DIAGRAM

SECTION 4

DIAGRAMS

216

57 5 7 2 1 6 7

PRE AMP

IC101(1/2) PRE AMP

IC101(2/2)

673

LOW BOOST

IC104(2/2) LINE AMP

IC104(1/2)

H.L.F

IC102(2/2)

L.P.F

IC102(1/2)

L.P.F

IC103(2/2)

DIFFERENTIAL

AMP

Q103

POWER

AMP

Q108,110,112

OVER CURRENT

DET

Q114-116

DRIVE

AMP

Q105

DIFFERENTIAL

AMP

Q104

POWER

AMP

Q109,111,113

DRIVE

AMP

Q106

BIAS

Q107

LEVEL

SHIFT

Q101

LEVEL

FILTER

S801-1

LPF

OFF

HPF

LEVEL

RV103-1

LOW

BOOST

+14.2V

(B+)

-14.2V

(B–)

CNJ801-1

INPUT

RV101-1

FILTER

XM-1902GX

RV801-1

FILTER

RV801-2

FILTER

OUTPUT

(THROUGH)

OUTPUT

(THROUGH)

SPEAKER

OUT

SPEAKER

OUT

RV104-1

LINE

SWITCH

Q102

REM

12V

GND

57 5 7 2 1 2 1

PRE AMP

IC201(1/2) PRE AMP

IC201(2/2)

673

LOW BOOST

IC204(1/2) LINE AMP

IC204(2/2)

H.P.F

IC202(2/2)

L.P.F

IC202(1/2)

L.P.F

IC103(1/2)

DIFFERENTIAL

AMP

Q203

POWER

AMP

Q208,210,212

OVER CURRENT

DET

Q214-216

DRIVE

AMP

Q205

DIFFERENTIAL

AMP

Q204

POWER

ON/OFF

Q903

LINE SWITCH

CONTROL

Q801,802

POWER

AMP

Q209,211,213

DRIVE

AMP

Q206

BIAS

Q207

LEVEL

SHIFT

Q201

RV103-2

LOW

BOOST

+14.2V

(B+)

-14.2V

(B–)

CNJ801-2

CNJ803

INPUT

RV101-2

FILTER

RV801-3

FILTER

RV801-4

FILTER

HI LEVEL

INPUT

RV104-2

LINE

SWITCH

Q202

RV205

BIAS

RV105

BIAS

DC OFFSET

DET

Q803-805

B+

SWITCH

Q901,902

TEMP.DET

TH801

THP802,803

DC DET

IC901

REF.

REG

LED DRIVE

Q813

LED DRIVE

Q809

PROTECT LATCH

Q812

LED DRIVE

Q811

CN802

CN801 F901

DECT

D909

DECT

D905

DECT

D907

DECT

D906

DECT

D911,917

DECT

D908

DECT

D910

+53V

(B+)

+51V

(B+)

+53V

(B+)

-51V

(B–)

-51V

(B–)

-53V

(B–)

-14.2V

(B–)

-20.3V

(B–)

+14.2V

(B+)

+20.3V

(B+)

INVERTER

Q904,905

INVERTER

Q906,907

HI-CURRENT

/HI-VOLTAGE

DET

IC903,Q912

B+

REG

Q910

B+

REG

Q911

DRIVER

Q908

DRIVER

Q909

+14.2V

(B+)

+14.2V

(B+)

D811

THERMAL

D810

OFFSET

D809

OVER

CURRENT

D808

POWER

+20.3V

(B+)

-20.3V

(B–)

D922

D919

D920

D921

DECT

D912,918

DC-DC

CONVERTER

TRANSFORMER

T901

+14.2B

(B+)

-14.2B

(B–)

S301

TEST TONE

GENERATOR

IC301(2/2)

TEST TONE

GENERATOR

IC301(1/2)

D301

D302

DC-DC CONVERTER

IC901

Q808

D808 D807

• Signal path

: AUDIO

CN804

CN805

PROTECT LATCH

Q810

XM-1902GX FILTER

S801-2

LPF

OFF

HPF

(Q110,111,115:XM-1902GX)

(Q210,211,215:XM-1902GX)

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10 10

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS

AND SCHEMATIC DIAGRAMS.

(In addition to this, the necessary note is

printed in each block.)

for schematic diagram:

Note:

• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolytics

and tantalums.

• All resistors are in Ωand 1/4W or less unless otherwise

specified.

• % : indicates tolerance.

•2: nonflammable resistor.

•U: B+ Line.

•V: B– Line.

• Powervoltageisdc14.4Vand fed with regulated dc power

supply from +12V and REMOTE terminals.

• Voltage is dc with respect to ground under no-signal

condition.

• Voltagesaretakenwith a VOM (Input impedance 10 MΩ).

Voltage variations may be noted due to normal produc-

tion tolerances.

• Signal path.

F: AUDIO

for printed wiring boards:

Note:

•X: parts extracted from the component side.

•b: Pattern from the side which enables seeing.

(The other layer’s patterns are not indicated.)

• IC Block Diagram

IC901 µPC494GS

16 15 14 13 12 11 10 9

1 2 3 4 5 6 7 8

OSC

REF. REG.

ERROR

0.1V

IC902 F-9

IC903 A-10

Q101 F-4

Q102 E-7

Q103 F-9

Q104 F-9

Q105 E-10

Q106 E-10

Q107 G-11

Q108 C-11

Q109 D-11

(Q110) E-11

(Q111) F-11

Q112 F-11

Q113 G-11

Q114 C-12

(Q115) D-12

Q116 F-12

Q201 G-4

Q202 E-5

Q203 E-3

Q204 E-4

Q205 E-3

Q206 E-3

Q207 G-1

Q208 C-1

Q209 D-1

(Q210) E-1

(Q211) E-1

Q212 F-1

Q213 G-1

Q214 D-1

(Q215) D-1

Q216 F-1

Q801 D-7

Q802 D-7

Q803 B-1

Q804 B-1

Q805 B-1

Q809 A-11

Q810 A-12

Q811 A-11

Q812 B-11

Q813 B-11

Q901 F-10

Q902 F-10

Q903 G-10

Q904 A-8

Q905 A-7

Q906 A-5

Q907 A-6

Q908 A-7

Q909 A-6

Q910 B-2

Q911 B-2

Q912 B-3

D101 E-9

D102 E-9

D103 E-9

D104 E-9

D201 E-4

D202 E-3

D203 E-4

D204 E-4

D301 F-8

D302 G-7

D801 D-7

D802 D-7

D803 B-11

D804 D-12

D805 A-11

D806 D-1

D807 B-11

D820 C-12

D821 D-12

(D822) E-12

(D823) F-12

D824 F-12

D825 G-12

D826 C-1

D827 D-1

(D828) E-1

(D829) F-1

D830 F-1

D831 G-1

D901 G-10

D902 G-10

D905 A-4

D906 A-4

D907 A-9

D908 A-8

D909 D-5

D910 D-5

D911 D-6

D912 D-5

D913 B-2

D914 B-2

D915 B-3

D917 D-6

D918 D-5

D919 D-10

D920 D-10

D921 E-3

D922 E-3

IC101 F-6

IC102 F-5

IC103 F-5

IC104 F-3

IC201 F-6

IC202 G-5

IC204 G-3

IC301 F-8

IC901 B-10

• Semiconductor Location (MAIN SECTION)

Ref. No. Location Ref. No. Location

( ) : XM-1902GX only

• Waveform

IC901 5

11V/DIV, 5µsec/DIV

15µsec

3.4Vp-p

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