Sony XM-3001SXD - Stereo Power Amplifier Bedienungsanleitung

Input level adjustment range

0.2 – 6.0 V (RCA pin jacks)

0.4 – 12.0 V (High level input)

Low-pass filter 50 – 300 Hz, -18 dB/oct

Low boost 0 – 10 dB (40 Hz)

Phase shift adjustment range (XM-6001GXD)

0° – 180° (at 40 Hz)

Power supply voltage 10.5 – 16 V

Current drain at rated output : 40A (4 Ω)

Remote input : 2 mA

Dimensions Approx. 358 ×50 ×264 mm

(w/h/d) (14 1/8 ×2 ×10 1/2 in.) not incl.

projecting parts and controls

Mass Approx. 3.5 kg (7 lb. 11 oz.) not incl. accessories

Supplied accessories Mounting screws (4)

Design and specifications are subject to change without

notice.

Ver 1.1 2003. 08

SERVICE MANUAL

US Model

XM-3001SXD/6001GXD

Other Specifications

Circuit system PWM (pulse width modulation) circuit

Pulse power supply

Inputs RCA pin jacks

High level input connector

Outputs Speaker terminals

Through out pin jacks

Speaker impedance 1 – 8 Ω

Maximum outputs 600 W (at 4 Ω)

1200 W (at 2 Ω)

Rated outputs (supply voltage at 14.4 V)

300 W (20 Hz – 300 Hz, 0.1% THD, at 4 Ω)

600 W (20 Hz – 300 Hz, 0.4% THD, at 2 Ω)

1000 W (20 Hz – 300 Hz, 0.8% THD, at 1 Ω)

Frequency response 5 Hz – 300 Hz ( dB)

Harmonic distortion 0.06% or less (at 100 Hz, 4 Ω)

SPECIFICATIONS

MONAURAL POWER AMPLIFIER

Sony Corporation

e Vehicle Company

Published by Sony Engineering Corporation

9-873-513-12

2003H04-1

Photo: XM-6001GXD

Notes on Chip Component Replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be

damaged by heat.

+0.5

–3

AUDIO POWER SPECIFICATIONS

POWER OUTPUTAND TOTAL HARMONIC DISTORTION

300 watts minimum continuous average power into 4 ohms, 20 Hz to

300 Hz with no more than 0.1% total harmonic distortion per Car

Audio Ad Hoc Committee standards.

TABLE OF CONTENTS

1. GENERAL

XM-3001SXD:

Features ................................................................................ 3

Location and Function of Controls....................................... 3

Installation ............................................................................ 3

Connections .......................................................................... 4

XM-6001GXD:

Features ................................................................................ 6

Location and Function of Controls....................................... 6

Installation ............................................................................ 6

Connect................................................................................. 7

2. DISASSEMBLY

2-1. Plate, Bottom ....................................................................... 9

2-2. Main Board Section ............................................................ 9

2-3. Main Board ......................................................................... 9

2-4. LED Board .......................................................................... 9

3. DIAGRAMS

3-1. Block Diagram .................................................................. 10

3-2. Printed Wiring Board –Main Section– .............................. 12

3-3. Schematic Diagram –Main Section (1/2)– ........................ 14

3-4. Schematic Diagram –Main Section (2/2)– ........................ 15

4. EXPLODED VIEWS

4-1. Heat Sink (Main) Section.................................................. 17

4-2. Main Board Section .......................................................... 18

5. ELECTRICAL PARTS LIST ........................................ 19

XM-3001SXD/6001GXD

SECTION 1

GENERAL This section is extracted

from instruction manual.

XM-3001SXD:

XM-3001SXD/6001GXD

XM-6001GXD:

XM-3001SXD/6001GXD

BTP 3x6

LED board

heat sink (main

)

P 3x8

MAIN board

panel, front (1ch)

BTP 3x6

plate, bottom

sheet, insulating

BTP 3x6

P 2.6x2.8

SECTION 2

DISASSEMBLY

Note : This set can be disassemble according to the following sequence.

Note : Follow the disassembly procedure in the numerical order given.

2-1. PLATE, BOTTOM

2-3. MAIN BOARD

2-4. LED BOARD

Plate,Bottom Main Board

Set Main Board Section Led Board

2-2. MAIN BOARD SECTION

CN1

B.TT. 3x14

MAIN board

1010

XM-3001SXD/6001GXD SECTION 3

DIAGRAMS

3-1. BLOCK DIAGRAM

275

5751

37 3

DRIVE

AMP

Q23-26

DRIVE

AMP

Q27-30

GND

CHANGE

Q5,PTC2

POWER

AMP

FET10-12

LPF

POWER

AMP

FET7-9

AMP

Q18,19

21,22,31

8 4

OSC

POWER

LED4

LEVEL

VR1-1

LEVEL

VR1-2

FILTER

VR3-3VR3-2VR3-1 VR3-4

PHASE

(40Hz)

VR4

OFF SET

LED2

THERMAL

LED1

OVER

CURRENT

LED3

LPF

B+ REG

B- REG

Q32,33

TEST

TONE

LOW BOOST

(40Hz)

VR2

GND

CHANGE

Q36,PTC1

LED

DRIVE

Q39,42

OFFSET

DETECT

Q10

OVER LOAD

DETECT

Q35

AMP

Q17,34

LED

DRIVE

Q11,43

LED

DRIVE

Q14,15

THERMAL

AMP

Q7–9

ON/OFF

DRIVE

FET4-6

ON/OFF

DRIVE

FET1-3

B- REG

ON/OFF

CONTROL

ON/OFF

CONTROL

PWN

CONTROL

POWER

CONTROL

Q12,13

VCC

DC-DC CONVERTER

IC6

T1 PT1

OUT

CTL

JK1-1

L(MONO)

INPUT

JK1-3

OUTPUT

(THROUGH)

JK1-2

INPUT

JK1-4

OUTPUT

(THROUGH)

HIGH LEVEL

INPUT

L+R

R+L

SPEAKER

OUT

+12V

GND

REV

TM1

CNT1

TM2 13V

B-

B+

+17V

-17V

B+

OVER LOAD

DETECT

IC8

THR1 THR2 THR3

PRE AMP

IC1(2/2)

13V

LOW BOOST AMP

IC2(2/2) AMP

IC4(2/2) PHASE AMP

IC4(1/2)

LINE AMP

IC5(2/2)

LINE AMP

IC5(1/2)

FILTER AMP

IC2(1/2)

AMP

IC3(2/2)

PRE AMP

IC1(1/2)

TEST TONE GEN

IC3(1/2)

B+ CHECK

IC7(1/4),(2/4)

THERMAL DETECT

IC7(3/4)

Q16

TM3

TM4

SW1

XR-6001GXD ONLY

FAULT DETECT

IC7(4/4)

Signal path

: AUDIO

FUSE 1-3

B+ REG

Q20

2 3

149

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