Sony XR-C4100 Bedienungsanleitung

MICROFILM

SERVICE MANUAL

FM/MW/LW CASSETTE CAR STEREO

AEP Model

UK Model

Model Name Using Similar Mechanism XR-5800R

Tape Transport Mechanism Type MG-25G-136

SPECIFICATIONS

XR-C4100

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location of Controls ....................................................... 3

Resetting the Unit ........................................................... 4

Detaching the Front Panel............................................... 4

Preparing the Rotary Commander .................................. 4

Setting the Clock ............................................................. 4

Installation....................................................................... 5

Connections ..................................................................... 6

2. DISASSEMBLY ......................................................... 9

3. ASSEMBLY OF MECHANISM DECK........... 11

4. MECHANICAL ADJUSTMENTS....................... 14

5. ELECTRICAL ADJUSTMENTS

Test Mode ........................................................................ 14

Tape Deck Section .......................................................... 14

Tuner Section .................................................................. 15

6. DIAGRAMS

6-1. IC Pin Function Description ........................................... 18

6-2. Printed Wiring Boards –MAIN Section– ....................... 21

6-3. Schematic Diagram –MAIN Section–........................... 25

6-4. Printed Wiring Board –PANEL Section– ...................... 29

6-5. Schematic Diagram –PANEL Section– ......................... 31

7. EXPLODED VIEWS................................................ 35

8. ELECTRICAL PARTS LIST ............................... 38

Flexible Circuit Board Repairing

•Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

•Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

•Be careful not to apply force on the conductor when soldering

or unsoldering

Notes on chip component replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section is extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –

– 9 –

Note: Follow the disassembly procedure in the numerical order given.

SECTION 2

DISASSEMBLY

FRONT PANEL ASS’Y

COVER ASS’Y

Push the button

(release).

Remove the front panel ass'y

to the direction of the arrow

cover ass'y

– 10 –

SUB PANEL, MECHANISM DECK (MG-25G-136)

MAIN BOARD, HEAT SINK

screw

(PTT2.6

connector

(CN351)

sub panel

flexible flat cable

(CN301)

mechanism deck

(MG-25G-136)

three screws

(PTT2.6

three screws

(PTT2.6

screw (PTT2.6

10)

screw (PTT2.6

10)

screw (PTT2.6

heat sink

main board

two ground point

screws

six screws

(PTT2.6

10)

rubber cap (25)

two screws

(PTT2.6

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