Sony XR-C6090 Bedienungsanleitung

MICROFILM

XR-C6090

E Model

SERVICE MANUAL

FM/AM CASSETTE CAR STEREO

SPECIFICATIONS

Model Name Using Similar Mechanism XR-C450

Tape Transport Mechanism Type

MG-25J-136

Dolby noise reduction manufactured under license

from Dolby Laboratories Licensing Corporation.

“DOLBY” and the double-D symbol aare trade-

marks of Dolby Laboratories Licensing Corporation.

Photo: XR-5800R

For RM-X4S (Remote Commander),

please refer to RM-X4S Service Manual

(9-925-698-∏) previously issued.

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location of Controls ....................................................... 3

Setting the Clock ............................................................. 3

Installation....................................................................... 4

Connection ...................................................................... 6

2. DISASSEMBLY ......................................................... 8

3. ASSEMBLY OF MECHANISM DECK........... 10

4. MECHANICAL ADJUSTMENTS....................... 13

5. ELECTRICAL ADJUSTMENTS

Tape Deck Section .......................................................... 13

Tuner Section .................................................................. 13

6. DIAGRAMS

6-1. Printed Wiring Board – Main Section – ........................ 15

6-2. Schematic Diagram – Main Section – ............................ 17

6-3. Printed Wiring Board – Panel Section –........................ 21

6-4. Schematic Diagram – Panel Section – .......................... 23

6-5. IC Pin Function Description ........................................... 27

7. EXPLODED VIEWS................................................ 30

8. ELECTRICAL PARTS LIST ............................... 33

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section is extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –

FRONT PANEL ASS’Y, COLLAR

COVER ASS’Y

Note: Follow the disassembly procedure in the numerical order given.

SECTION 2

DISASSEMBLY

1

Push the button

(release).

3

claw

3

claw

4

collar

2

Remove the front panel ass’y

to the direction of the arrow

cover ass’y

– 9 –

SUB PANEL, MECHANISM DECK (MG-25J-136)

MAIN BOARD, HEAT SINK

3

connector

(CN351)

2

sub panel

1

three screws

(PTT2.6

1

three screws

(PTT2.6

5

screw

(PTT2.6

6

mechanism dec

(MG-25F-136)

4

flexible flat cable

(CN301)



3

two ground point

screws

5

three screws

(PTT 2.6

10)

5

two screws

(PTT 2.6

10)

1

screw

(PTT2.6

5

two screws

(PTT 2.6

10)

6

heat sink

2

rubber cap (25)

1

two screws

(PTT2.6

4

main board

– 10 –

HOUSING

ARM (SUCTION)

Note: Follow the assembly procedure in the numerical order given.

SECTION 3

ASSEMBLY OF MECHANISM DECK

Move the arm (suction) in the arrow

direction and fit on profection.

Fit the arm (suction) on the shaft.

projection

part

Hold the hanger by

bending the claw.

Fit projection on

part.

Fit claw on

part.

Put the housing

under

part.

Fit projection on

part.

Install the catch to the hanger.

Install the hanger onto

two claws of the housing.

Holder the hanger by bending the claw.

hanger

housing

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