Sony XR-C8200 Bedienungsanleitung

MICROFILM

SERVICE MANUAL

FM/AM CASSETTE CAR STEREO

US Model

Model Name Using Similar Mechanism NEW

Tape Transport Mechanism Type MG-25D-136

SPECIFICATIONS

XR-C8200

Dolby noise reduction manufactured under license

form Dolby Laboratories Licensing Corporation.

“DOLBY” and the double-D symbol aare trade-

marks of Dolby Laboratories Licensing Corporation.

For RM-X2S (Remote Commander),

please refer to RM-X2S/X3S Service

Manual(9-960-039-∏)previouslyissued.

– 2 –

TABLE OF CONTENTS

1. GENERAL

Location of Controls ....................................................... 3

Resetting the Unit ........................................................... 4

Detaching the Font Panel ................................................ 4

Preparing the Rotary Commander .................................. 4

Setting the Clock ............................................................. 4

Installation....................................................................... 5

Connections ..................................................................... 6

2. DISASSEMBLY ......................................................... 8

3. ASSEMBLY OF MECHANISM DECK........... 11

4. MECHANICAL ADJUSTMENTS....................... 14

5. ELECTRICAL ADJUSTMENTS

Test Mode ........................................................................ 14

Tape Deck Section .......................................................... 14

Tuner Section .................................................................. 15

6. DIAGRAMS

6-1. IC Pin Function Description ........................................... 18

6-2. Printed Wiring Board – MAIN Section – ...................... 25

6-3. Schematic Diagram – MAIN Section –.......................... 29

6-4. Printed Wiring Boards – PANEL Section – .................. 33

6-5. Schematic Diagram – PANEL Section –....................... 35

7. EXPLODED VIEWS................................................ 41

8. ELECTRICAL PARTS LIST ............................... 44

Flexible Circuit Board Repairing

• Keep the temperature of the soldering iron around 270 ˚C dur-

ing repairing.

• Do not touch the soldering iron on the same conductor of the

circuit board (within 3 times).

• Be careful not to apply force on the conductor when soldering

or unsoldering.

Notes on chip component replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be dam-

aged by heat.

– 3 –

SECTION 1

GENERAL This section is extracted from

instruction manual.

– 4 –

– 5 –

– 6 –

– 7 –

– 8 –

COVER ASS’Y

FRONT PANEL ASS’Y

Note: Follow the disassembly procedure in the numerical order given.

SECTION 2

DISASSEMBLY

claw

cover ass’y

three claws

claw

front panel ass’y

Push the bearing (L).

Push the bearing (R).

Push the button (OPEN).

– 9 –

SUB PANEL ASS’Y

MECHANISM DECK (MG-25D-136)

claw

two claws

screw

(PTT2.6

)

sub panel ass’y

two screws

(PTT2.6

two screws

(PTT2.6

flexible flat cable

(

CN231

)

mechanism dec

(MG-25D-136)

two screws

(2.6

connector

(CN201)

– 10 –

HEAT SINK

MAIN BOARD

insulator

main boar

ground point screw

two ground point screws

connector

(CN302)

two screws

(PTT2.6

screw

(PTT2.6

cord (with connector)

(SUB w. out)

four screws

(PTT2.6

three screw

(PTT2.6

screw

(PTT2.6

heat sink

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