Sony MDR-IF5000 Bedienungsanleitung

– 1 –

Notes on Chip Component Replacement

• Never reuse a disconnected chip component.

• Notice that the minus side of a tantalum capacitor may be

damaged by heat.

SERVICE MANUAL

E Model

MDR-IF5000

MICROFILM

CORDLESS STEREO HEADPHONES

SPECIFICATIONS

Modulation System Frequency modulation

Carrier wave frequency Right channel 2.8 MHz

Left channel 2.3 MHz

Frequency response 12 – 24,000 Hz

Power requirements Rechargeable Ni-Cd

batteries (supplied) or

R6 (size AA) batteries

(dry-cell or

rechargeable, sold

separately)

Mass Approx. 280 g

(including the

supplied rechargeable

Ni-Cd batteries)

Design and specifications are subject to

change without notice.

•MDR-IF5000 is the component model block one in

MDR-DS5000.

COMPONENT MODEL NAME FOR MDR-DS5000

DIGITAL SURROUND PROCESSOR DP-IF5000

CORDLESS STEREO HEADPHONES MDR-IF5000

Ver 1.0 1998. 11

– 2 –

SECTION 1

GENERAL This section is extracted

from instruction manual.

– 3 –

– 4 –

SECTION 2

DISASSEMBLY

pad (outer), ear

pad (inner), ear

driver assy

plate, front

claws

P 2.6X6

claws

frame assy

hanger

plate, fron

hanger

frame assy

spread

Set Frame assy

Frame assy

Hanger (L)

Hanger (R)

Band Assy, Head

Band Assy, HeadRX board

P 2.6X6

RX PD2

board (L-CH)

RX PD1 board (L-CH

)

hanger (L)

P 2.6X6

RX PD2

board

(R-CH)

RX PD1 board (R-CH)

hanger (R)

2-1. FRAME ASSY

2-2. HANGER (L) 2-3. HANGER (R)

• The equipment can be removed using the following procedure.

Note : Follow the disassembly procedure in the numerical order given.

• Remove the left and right ear

pads in the same manner.

– 5 –

band assy, head

stopper, PC board

RX SW board

wire

When installing,

take care to avoid extrusion

of wire from the hanger.

claws

P 2.6X6

RX board

2-4. RX BOARD

2-5. BAND ASSY, HEAD

– 6 –

SECTION 3

ELECTRICAL ADJUSTMENTS

Notes:

1. These adjustments are performed in the order that they are

discribed.

2. Adjustment and measurement are performed for each channel

unless otherwise specified.

3. Adjustment is made for right channel first and then the left

channel.

4. The power voltage at the headphones section is supplied with

1.2 V.

5. The processor section is used as jig to adjust the headphones

section (MDR-IF5000).

6. Adjustment is made with the RX SW board and RX PD1 and

RX PD2 boards (for both L-ch and R-ch) connected to the RX

board with wires (normal part).

0 dB=0.775V

Tuning Adjustment

Preparation:

processor

(DP-IF5000) headphones

(MDR-IF5000

)

1. Set the processor section (DP-IF5000) in test mode and operate

the set to generate a signal of 1 kHz and –10 dB. (Refer to

DP-IF5000 service manual page 7.)

2. Supply 1.2 V to between VCC and ground on the RX board.

3. Adjust RV11 (volume control) on the RX board to the minimum

level.

Adjustment Location:

TP9

TP11

L34

L35

TUNING

ADJUSTMENT

(L-ch)

TUNING

ADJUSTMENT

(R-ch)

L54

L55

– RX board (component side)

–

Setting:

–

distortion mete

RX board

TP11 (L-ch)

TP9 (R-ch)

1. Connect a distortion meter to TP11 (L-ch) and TP9 (R-ch) on

the RX board.

2. Adjust L34 and 35 for L-ch and L54 and 55 for R-ch on the

RX board so that the reading on the distortion meter is

minimized.

4-1. BLOCK DIAGRAM

– 7 – – 8 –

SECTION 4

DIAGRAMS

OSCILLATOR

MIXER DEMODULATOR

MIXER

OUT

LIMITER

2.3MHz BPF

L33

2.8MHz BPF

L53

LIMITER

AMP

VCC

GND

OUT -1

-2

MUTE

SQUELCH TRIGGER

WITH

HYSTERESIS

GND

MUTE

SQUELCH TRIGGER

WITH

HYSTERESIS

AUDIO (L) MIXER LIMITER

IC31

AUDIO (R) MIXER LIMITER

IC51

BPF

L34,35

TUNING

(L)

BUFFER

RF AMP

Q1-3 3 5 9

DEMODULATOR

LIMITER

AMP

OUT 9

VCC 4

QUAD COIL

OSC

MIXER

OUT

MIXER

OSC

3 5

B+

(+3.0V)

B+

(+1.7V)

B+

(+3.0V)

RV10

BALANCE

RV11

VOL

–

BIAS

CIRCUIT

VCC

FC2

FC1

VIN

VO1

VO2

SP31

L-CH

–

BIAS

CIRCUIT

VCC

FC2

FC1

VIN

VO1

VO2

SP51

R-CH

D10

POWER

B+

(+1.8V)

B+

(+1.7V)

S10

(POWER)

DRY BATTERY

SIZE "AA"

(IEC DESIGNATION R6)

2PCS, 3V

NICKEL CADMIUM

BATTERY

(NC-AA)

700mAh 2.4V

DRIVER AMP (R-CH)

IC52

DRIVER AMP (L-CH)

IC32

B+

(+3.0V)

INFRARED

SENSOR

D1-4

QUAD COIL

• Signal path

: RF

: ANALOG

L54,55

TUNING

(R)

B+

(+3.0V)

MDR-IF5000

– 9 – – 10 –

Note:

•X: parts extracted from the component side.

•®:Through hole.

•: Pattern from the side which enables seeing.

•: Pattern of the rear side.

4-2. PRINTED WIRING BOARDS

DRY BATTERY

SIZE "AA"

(IEC DESIGNATION R6)

2PCS, 3V

NICKEL CADMIUM

BATTERY

(NC-AA)

700mAh 2.4V

B+

GND

R-CH L-CH

-1

L TP11

TP9

-2

R-CH

L-CH

INFRARED

SENSOR

( )

2345678910111213

D1 C-13

D2 F-13

D3 C-10

D4 F-10

D10 D-2

D51 D-5

D52 D-5

IC31 D-3

IC32 F-3

IC51 D-4

IC52 F-4

Q1 B-3

Q2 B-4

Q3 B-4

Q4 B-5

• Semiconductor

Location

Ref.No. Location

– 11 –

4-3. SCHEMATIC DIAGRAM • Refer to page 13 for IC Block Diagrams.

– 12 –

Note:

• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolytics

and tantalums.

• All resistors are in Ωand 1/4W or less unless otherwise

specified.

•¢: internal component.

•C: panel designation.

•U: B+ Line.

•H: adjustment for repair.

• Power voltage is dc 3V and fed with regulated dc power

supply from battery terminal.

MDR-IF5000

• Total current is measured with POWER ON (no-sig-

nal) mode.

• Voltage is dc with respect to ground under no-signal

condition.

no mark : POWER ON

• Voltagesaretakenwith aVOM(Inputimpedance10MΩ).

Voltage variations may be noted due to normal produc-

tion tolerances.

• Signal path.

J: RF

F: ANALOG

– 13 –

–

SQUELCH TRIGGER WITH

HYSTERESIS

MIXER

OSCILLATOR

CRYSTAL

OSC

MIXER

OUTPUT VCC

SCAN

CONTROL SQUELCH

IN FILTER

OUTPUT FILTER

INPUT RECOVERD

AUDIO

MIXER

INPUT GND MUTE

QUAD

COIL

LIMITER

INPUT DECOUPLING

FILTER

AMP

LIMITER

AMP

DEMODULATOR

1 2 3 4 7 865

1516 14 13 12 11 10 9

8 7 6 5

4321

VO2

CF 2

CF 1

V in

GND

Vcc

VO1

BIAS

CIRCUIT

• IC Block Diagrams

IC31, 51 SC111711DR2

IC32, 52 MC34119DTBEL

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