TDK T5919 Bedienungsanleitung

T5919

Bottom Port PDM Digital Output Multi-Mode Microphone

TDK, Inc. reserves the right to change the detail

specifications as may be required to permit

improvements in the design of its products.

TDK Corporation

1745 Technology Drive, San Jose, CA 95110 U.S.A

+1(408) 988–7339

www.tdk.com

Document Number: DS-000363

Revision: 1.0

Release Date: 3/9/2021

GENERAL DESCRIPTION

The T5919 is a multi-mode, low noise digital MEMS

microphone in a small package. The T5919 consists of a

MEMS microphone element and an impedance converter

amplifier followed by a fourth-order Σ-Δ modulator. The digital

interface allows the pulse density modulated (PDM) output of

two microphones to be time multiplexed on a single data line

using a single clock.

The T5919 has multiple modes of operation: High Quality,

Low-Power (AlwaysOn), and Sleep. The T5919 has high SNR in

all operational modes. It has 135 dB SPL AOP in High Quality

Mode and 120 dB SPL AOP in Low-Power mode.

The T5919 is available in a standard 3.5 × 2.65 × 0.98 mm

surface-mount package. It is reflow solder compatible with

no sensitivity degradation. The package integrates a Particle

Ingress Filter (PIF) for enhanced robustness to environmental

contaminants such as water and dust.

APPLICATIONS

•Smartphones

•Microphone Arrays

•Tablet Computers

•Cameras

FEATURES

SPEC

HIGH QUALITY MODE

LOW-POWER MODE

Sensitivity

−41 dB FS ±1 dB

−26 dB FS ±1 dB

SNR

64.5 dBA

62 dBA

Current

590 µA

220 µA

AOP

135 dB SPL

120 dB SPL

Clock

2.0 MHz to 3.3 MHz

400 kHz to 800 kHz

•3.5 × 2.65 × 0.98 mm surface-mount package

•Extended frequency response from 40 Hz to >20 kHz

•Sleep Mode: 9 µA

•Fourth-order Σ-Δ modulator

•Digital pulse density modulation (PDM) output

•Compatible with Sn/Pb and Pb-free solder processes

•RoHS/WEEE compliant

•Features PIF (Particle Ingress Filter) to enhance

product robustness to water & dust

FUNCTIONAL BLOCK DIAGRAM

ORDERING INFORMATION

PART

TEMP RANGE

PACKAGING

MMICT5919-00-012

−40°C to +85°C

13” Tape and Reel

ICS-51360

ADC

POWER

MANAGEMENT

CLK

DATA

VDD

GND

PDM

MODULATOR

CHANNEL

SELECT

T5919

 
T5919
 
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Document Number: DS-000363 
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TABLE OF CONTENTS 
General Description..................................................................................................................................................................... 1 
Applications ................................................................................................................................................................................. 1 
Features ....................................................................................................................................................................................... 1 
Functional Block Diagram ............................................................................................................................................................ 1 
Ordering Information................................................................................................................................................................... 1 
Table of Contents.................................................................................................................................................................................... 2 
Specifications .......................................................................................................................................................................................... 4 
Table 1. Acoustical/Electrical Characteristics –General.............................................................................................................. 4 
Table 2. Acoustical/Electrical Characteristics –High Quality Mode ............................................................................................ 4 
Table 3. Acoustical/Electrical Characteristics –Low-Power Mode.............................................................................................. 5 
Table 4. Digital Input/Output Characteristics .............................................................................................................................. 5 
Table 5. PDM Digital Input/Output.............................................................................................................................................. 6 
Timing Diagram............................................................................................................................................................................ 6 
Absolute Maximum Ratings.................................................................................................................................................................... 7 
Table 6. Absolute Maximum Ratings ........................................................................................................................................... 7 
ESD Caution ................................................................................................................................................................................. 7 
Soldering Profile........................................................................................................................................................................... 8 
Table 7. Recommended Soldering Profile*.................................................................................................................................. 8 
Pin Configurations And Function Descriptions ....................................................................................................................................... 9 
Table 8. Pin Function Descriptions............................................................................................................................................... 9 
Typical Performance Characteristics..................................................................................................................................................... 10 
Theory Of Operation ............................................................................................................................................................................. 12 
PDM Data Format ...................................................................................................................................................................... 12 
Table 9. T5919 Channel Setting ................................................................................................................................................. 12 
PDM Microphone Sensitivity ..................................................................................................................................................... 12 
Applications Information ...................................................................................................................................................................... 14 
Low-Power Mode....................................................................................................................................................................... 14 
Dynamic Range Considerations ................................................................................................................................................. 14 
Connecting PDM Microphones.................................................................................................................................................. 14 
Sleep Mode................................................................................................................................................................................ 16 
Start-Up Time............................................................................................................................................................................. 16 
Supporting Documents ......................................................................................................................................................................... 17 
Application Notes –General...................................................................................................................................................... 17 
PCB Design And Land Pattern Layout ................................................................................................................................................... 18 
PCB Material And Thickness ...................................................................................................................................................... 18 
Handling Instructions............................................................................................................................................................................ 19 
Pick And Place Equipment ......................................................................................................................................................... 19 
Reflow Solder............................................................................................................................................................................. 19 

T5919

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Document Number: DS-000363

Revision: 1.0

Board Wash................................................................................................................................................................................ 19

Outline Dimensions............................................................................................................................................................................... 20

Ordering Guide .......................................................................................................................................................................... 20

Revision History ......................................................................................................................................................................... 21

Compliance Declaration Disclaimer ...................................................................................................................................................... 22

T5919

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Document Number: DS-000363

Revision: 1.0

SPECIFICATIONS

TABLE 1. ACOUSTICAL/ELECTRICAL CHARACTERISTICS GENERAL

TA= 25°C, VDD = 1.8 V, SCK = 2.4 MHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

PERFORMANCE

Directionality

Omni

Output Polarity

Input acoustic pressure vs. output

data

Non-Inverted

Supply Voltage (VDD)

1.65

1.8

1.98

Sleep Mode Current (IS)

SCK < 200 kHz

µA

TABLE 2. ACOUSTICAL/ELECTRICAL CHARACTERISTICS HIGH QUALITY MODE

TA= 25°C, VDD = 1.8 V, SCK = 2.4 MHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

Sensitivity

1 kHz, 94 dB SPL

−42

−41

−40

dB FS

Signal-to-Noise Ratio (SNR)

20 kHz bandwidth, A-weighted

64.5

dBA

Equivalent Input Noise (EIN)

20 kHz bandwidth, A-weighted

29.5

dBA SPL

Acoustic Dynamic Range

Derived from EIN and acoustic

overload point

105.5

Total Harmonic Distortion (THD)

94 dB SPL

0.15

Low Frequency Roll Off

-3dB, relative to 1kHz Sensitivity

Power Supply Rejection (PSR)

20 Hz, 100 mVpp applied to VDD

1 kHz, 100 mVpp applied to VDD

5 kHz, 100 mVpp applied to VDD

10 kHz, 100 mVpp applied to VDD

20 kHz, 100 mVpp applied to VDD

-89

-116

-93

-98

-87

dB FS(A)

Power Supply Rejection (PSR)

217 Hz, 100 mV p-p squarewave

superimposed on VDD = 1.8 V, A-

weighted

-106

dB FS (A)

Power Supply Rejection—Swept Sine

1 kHz sine wave

−116

dB FS

Acoustic Overload Point

10% THD

135

dB SPL

Supply Current (IS)

VDD = 1.8 V, no load

590

µA

Note 1: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density.

T5919

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Document Number: DS-000363

Revision: 1.0

TABLE 3. ACOUSTICAL/ELECTRICAL CHARACTERISTICS LOW-POWER MODE

TA= 25°C, VDD = 1.8 V, SCK = 768 kHz, CLOAD = 30 pF unless otherwise noted. Typical specifications are not guaranteed.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

Sensitivity

1 kHz, 94 dB SPL

−27

−26

−25

dB FS

Signal-to-Noise Ratio (SNR)

8 kHz bandwidth, A-weighted

dBA

Equivalent Input Noise (EIN)

8 kHz bandwidth, A-weighted

dBA SPL

Acoustic Dynamic Range

Derived from EIN and acoustic overload point

Total Harmonic Distortion (THD)

105 dB SPL

0.15

Power Supply Rejection (PSR)

217 Hz, 100 mV p-p square wave superimposed on

VDD = 1.8 V, A-weighted

−90

dB FS

Power Supply Rejection—Swept Sine

1 kHz sine wave

−99

dB FS

Acoustic Overload Point

10% THD

120

dB SPL

Supply Current (IS)

VDD = 1.8 V, no load

220

µA

Note 2: Sensitivity is relative to the RMS level of a sine wave with positive amplitude equal to 100% 1s density and negative amplitude equal to 0% 1s density.

TABLE 4. DIGITAL INPUT/OUTPUT CHARACTERISTICS

TA= 25°C, VDD = 1.8 V, unless otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

Input Voltage High (VIH)

0.65 × VDD

Input Voltage Low (VIL)

0.35 × VDD

Output Voltage High (VOH)

ILOAD = 0.5 mA

0.7 × VDD

VDD

Output Voltage Low (VOL)

ILOAD = 0.5 mA

0.3 × VDD

Output DC Offset

Percent of full scale

T5919

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Document Number: DS-000363

Revision: 1.0

TABLE 5. PDM DIGITAL INPUT/OUTPUT

TA= 25°C, VDD = 1.8 V, unless otherwise noted.

PARAMETER

CONDITIONS

MIN

TYP

MAX

UNITS

NOTES

MODE SWITCHING

Sleep Time

Time from fCLK falling <200 kHz

Wake-Up Time

High Quality mode, Sleep Mode to fCLK >1.2

MHz, output within 0.5 dB of final sensitivity,

power on

Wake-Up Time

Low-Power Mode, Sleep Mode to fCLK >400

kHz, output within 0.5 dB of final sensitivity,

power on

Switching time

Between Low-Power and High Quality Mode

INPUT

tCLKIN

Input clock period

303

2500

Clock Frequency (CLK)

Sleep Mode

200

kHz

Low-Power Mode

400

800

kHz

High Quality Mode

2.0

3.3

MHz

Clock Duty Cycle

fCLK <3.3 MHz

tRISE

CLK rise time (10% to 90% level)

tFALL

CLK fall time (90% to 10% level)

OUTPUT

t1OUTEN

DATA1 (right) driven after falling clock edge

t1OUTDIS

DATA1 (right) disabled after rising clock edge

t2OUTEN

DATA2 (left) driven after rising clock edge

t2OUTDIS

DATA2 (left) disabled after falling clock edge

Note 3: Guaranteed by design

TIMING DIAGRAM

Figure 1. Pulse Density Modulated Output Timing

tCLKIN

CLK

DATA2

DATA1

t2OUTDIS

t1OUTDIS

t2OUTEN

t1OUTEN

tRISE tFALL

T5919

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Document Number: DS-000363

Revision: 1.0

ABSOLUTE MAXIMUM RATINGS

Stress above those listed as Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only

and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for

extended periods may affect device reliability.

TABLE 6. ABSOLUTE MAXIMUM RATINGS

PARAMETER

RATING

Supply Voltage (VDD)

−0.3 V to +3.63 V

Digital Pin Input Voltage

−0.3 V to VDD + 0.3 V or 3.63V, whichever is less

Mechanical Shock

10,000 g

Vibration

Per MIL-STD-883 Method 2007, Test Condition B

Temperature Range

Operating

−40°C to +85°C

Storage

−55°C to +150°C

ESD CAUTION

ESD (electrostatic discharge) sensitive device.

Charged devices and circuit boards can

discharge without detection. Although this

product features patented or proprietary

protection circuitry, damage may occur on

devices subjected to high energy ESD.

Therefore proper ESD precautions should be

taken to avoid performance degradation or

loss of functionality.

T5919

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Document Number: DS-000363

Revision: 1.0

SOLDERING PROFILE

Figure 2. Recommended Soldering Profile Limits

TABLE 7. RECOMMENDED SOLDERING PROFILE*

PROFILE FEATURE

Sn63/Pb37

Pb-Free

Average Ramp Rate (TLto TP)

1.25°C/sec max

Preheat

Minimum Temperature

(TSMIN)

100°C

Maximum Temperature

(TSMAX)

150°C

200°C

Time (TSMIN to TSMAX), tS

60 sec to 75 sec

Ramp-Up Rate (TSMAX to TL)

1.25°C/sec

Time Maintained Above Liquidous (tL)

45 sec to 75 sec

~50 sec

Liquidous Temperature (TL)

183°C

217°C

Peak Temperature (TP)

215°C +3°C/−3°C

260°C +0°C/−5°C

Time Within +5°C of Actual Peak

Temperature (tP)

20 sec to 30 sec

Ramp-Down Rate

3°C/sec max

Time +25°C (t25°C) to Peak Temperature

5 min max

*The reflow profile in Table 7 is recommended for board manufacturing with TDK MEMS microphones. All microphones are also

compatible with the J-STD-020 profile

t25°C TO PEAK TEMPERATURE

PREHEAT

CRITICAL ZONE

TLTO TP

TEMPERATURE

TIME

RAMP-DOWN

RAMP-UP

TSMIN

TSMAX

T5919

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Document Number: DS-000363

Revision: 1.0

PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS

Figure 3. Pin Configuration (Top View, Terminal Side Down)

TABLE 8. PIN FUNCTION DESCRIPTIONS

NAME

FUNCTION

DATA

Digital Output Signal (DATA1 or DATA2)

SELECT

Left Channel or Right Channel Select:

DATA 1 (right): SELECT tied to GND

DATA 2 (left): SELECT tied to VDD. In this setting, SELECT should be tied to the same voltage

source as the VDD pin.

GND

Ground

CLK

Clock Input to Microphone

VDD

Power Supply. For best performance and to avoid potential parasitic artifacts, place a 0.1 µF

(100 nF) ceramic type X7R capacitor between Pin 5 (VDD) and ground. Place the capacitor as

close to Pin 5 as possible.

T5919

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Document Number: DS-000363

Revision: 1.0

TYPICAL PERFORMANCE CHARACTERISTICS

Figure 4. Typical Audio Frequency Response, High Quality Mode

Figure 5. THD + N High Quality Mode

Figure 6. THD + N Low-Power Mode

Figure 7. Linearity

-20

-10

10 100 1000 10000

NORMALIZED AMPLITUDE (dB)

FREQUENCY (Hz)

0.01

0.1

90 95 100 105 110 115 120 125 130 135

THD+N (%)

INPUT AMPLITUDE (dB SPL)

High Quality Mode

0.01

0.1

90 95 100 105 110 115 120

THD+N (%)

INPUT AMPLITUDE (dB SPL)

Low Power Mode

-50

-40

-30

-20

-10

90 100 110 120 130

OUTPUT AMPLITUDE (dB FS)

INPUT AMPLITUDE (dB SPL)

High Quality Mode

Low-Power Mode

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