Telit Wireless Solutions LE910C1 Series Installationshandbuch

LE910C1

Hardware User Guide

1VV0301298 Rev. 1.08 - 2017-11-14

LE910C1 Hardware User Guide

1VV0301298 Rev. 1.08 - 2017-11-14

Telit Confidential Information, provided under NDA Page 2 of 119

Applicability Table

This documentation applies to the following products:

Table 1: Applicability Table

Module Name Description

LE910C1-NA North America – AT&T with global

roaming

LE910C1-NS North America - Sprint variant

LE910C1-AP APAC variant

LE910C1 Hardware User Guide

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Telit Confidential Information, provided under NDA Page 3 of 119

SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE

Notice

While reasonable efforts have been made to assure the accuracy of this document, Telit assumes

no liability resulting from any inaccuracies or omissions in this document, or from use of the

information obtained herein. The information in this document has been carefully checked and is

believed to be entirely reliable. However, no responsibility is assumed for inaccuracies or

omissions. Telit reserves the right to make changes to any products described herein and reserves

the right to revise this document and to make changes from time to time in the content hereof with

no obligation to notify any person of revisions or changes. Telit does not assume any liability arising

out of the application or use of any product, software, or circuit described herein; neither does it

convey any license under its patent rights or the rights of others.

It is possible that this publication may contain references to, or information about Telit products

(machines and programs), programming, or services that are not announced in your country. Such

references or information must not be construed to mean that Telit intends to announce such Telit

products, programming, or services in your country.

Copyrights

This instruction manual and the Telit products described in this instruction manual may be, include,

or describe copyrighted Telit material, such as computer programs stored in semiconductor

memories or other media. Laws in Italy and other countries preserve for Telit and its licensors

certain exclusive rights for copyrighted material, including the exclusive right to copy, reproduce in

any form, distribute, and make derivative works of the copyrighted material. Accordingly, any

copyrighted material of Telit and its licensors contained herein or in the Telit products described in

this instruction manual may not be copied, reproduced, distributed, merged, or modified in any

manner without the express written permission of Telit. Furthermore, the purchase of Telit

products shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any

license under the copyrights, patents or patent applications of Telit, as arises by operation of law

in the sale of a product.

Computer Software Copyrights

Telit and third-party software (SW) products described in this instruction manual may include

copyrighted Telit and other third-party computer programs stored in semiconductor memories or

other media. Laws in Italy and other countries preserve for Telit and other third-party SW certain

exclusive rights for copyrighted computer programs, including the exclusive right to copy or

reproduce in any form the copyrighted computer program. Accordingly, any copyrighted Telit or

other third-party SW computer programs contained in the Telit products described in this

instruction manual may not be copied (reverse engineered) or reproduced in any manner without

the express written permission of Telit or the third-party SW supplier. Furthermore, the purchase

of Telit products shall not be deemed to grant either directly or by implication, estoppel, or

otherwise, any license under the copyrights, patents or patent applications of Telit or other third-

party SW, except for the normal non-exclusive, royalty free license to use that arises by operation

of law in the sale of a product.

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Telit Confidential Information, provided under NDA Page 4 of 119

Usage and Disclosure Restrictions

License Agreements

The software described in this document is the property of Telit and its licensors. It is furnished by

an express license agreement only and may be used only in accordance with the terms of such an

agreement.

Copyrighted Materials

Software and documentation are copyrighted materials. Making unauthorized copies is prohibited

by law. No part of the software or documentation may be reproduced, transmitted, transcribed,

stored in a retrieval system, or translated into any language or computer language, in any form or

by any means, without prior written permission of Telit.

High Risk Materials

Components, units, or third-party products used in the product described herein are NOT fault-

tolerant and are NOT designed, manufactured, or intended for use as on-line control equipment in

the following hazardous environments requiring fail-safe controls: the operation of nuclear

facilities, aircraft navigation or aircraft communication systems, air traffic control, life support, or

weapons systems (“high risk activities"). Telit and its supplier(s) specifically disclaim any expressed

or implied warranty of fitness for such high-risk activities.

Trademarks

TELIT and the stylized T logo are trademarks and/or registered trademarks of Telit Communications

S.p.A. in the Unites States and/or other countries. All other product or service names are the

property of their respective owners.

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Telit Confidential Information, provided under NDA Page 5 of 119

Contents

1. Introduction..................................................................................................... 13

1.1. Scope................................................................................................................13

1.2. Audience ..........................................................................................................13

1.3. Contact Information, Support..........................................................................13

1.4. Text Conventions .............................................................................................14

1.5. Related Documents..........................................................................................15

1.6. Abbreviations...................................................................................................16

2. General Product Description ............................................................................ 17

2.1. Overview ..........................................................................................................17

2.2. Applications .....................................................................................................17

2.3. General Functionality and Main Features .......................................................18

2.4. Block Diagram ..................................................................................................21

2.5. Environmental Requirements..........................................................................22

2.5.1. Temperature Range..............................................................................22

2.5.2. RoHS Compliance..................................................................................22

2.6. Frequency Bands..............................................................................................23

2.6.1. RF Bands per Regional Variant .............................................................23

2.6.2. Reference Table of RF Bands Characteristics .......................................24

2.7. RF parameters..................................................................................................27

2.7.1. Sensitivity..............................................................................................27

2.7.2. Output power .......................................................................................27

2.8. LE910C1 Mechanical Specifications.................................................................28

2.8.1. Dimensions ...........................................................................................28

2.8.2. Weight ..................................................................................................28

3. LE910C1 Module Connections .......................................................................... 29

3.1. Pin-out..............................................................................................................29

3.2. LE910C1 - Signals That Must Be Connected ....................................................40

3.3. LGA Pads Layout...............................................................................................42

3.4. Backward Compatibility to xE910 Family ........................................................43

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4. Electrical Specifications .................................................................................... 44

4.1. Absolute Maximum Ratings – Not Operational...............................................44

4.2. Recommended Operating Conditions .............................................................44

4.3. Logic Level Specifications.................................................................................45

4.3.1. 1.8V Pads - Absolute Maximum Ratings...............................................45

4.3.2. 1.8V Standard GPIOs ............................................................................45

4.3.3. 1.8V SD Card Pads.................................................................................46

4.3.4. 1.8V SIM Card Pads...............................................................................46

4.3.5. Dual Voltage Pads - Absolute Maximum Ratings .................................47

4.3.6. SD Card Pads @ 2.95V ..........................................................................47

4.3.7. SIM Card Pads @2.95V .........................................................................48

5. Hardware Commands....................................................................................... 49

5.1. Turning on the LE910C1 Module .....................................................................49

5.2. Initialization and Activation State....................................................................49

5.3. Turning OFF the LE910C1 Module ...................................................................52

5.3.1. Shutdown by Software Command .......................................................52

5.3.2. Hardware Shutdown.............................................................................53

5.3.4. Unconditional Hardware Shutdown.....................................................54

6. Power Supply................................................................................................... 55

6.1. Power Supply Requirements............................................................................55

6.2. General Design Rules .......................................................................................58

6.2.1. Electrical Design Guidelines..................................................................58

6.2.1.1. + 5V Input Source Power Supply – Design Guidelines .........58

6.2.1.2. + 12V Input Source Power Supply – Design Guidelines .......59

6.2.1.3. Battery Source Power Supply – Design Guidelines ..............61

6.2.2. Thermal Design Guidelines...................................................................62

6.2.3. Power Supply PCB Layout Guidelines...................................................63

7. Antenna(s)....................................................................................................... 64

7.1. GSM/WCDMA/LTE Antenna Requirements.....................................................64

7.2. GSM/WCDMA/LTE Antenna – PCB Line Guidelines.........................................65

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7.3. GSM/WCDMA/LTE Antenna – Installation Guidelines ....................................66

7.4. Antenna Diversity Requirements.....................................................................66

7.5. GNSS Antenna Requirements ..........................................................................67

7.5.1. Combined GNSS Antenna .....................................................................67

7.5.2. Linear and Patch GNSS Antenna...........................................................67

7.5.3. Front End Design Considerations .........................................................67

7.5.4. GNSS Antenna – PCB Line Guidelines...................................................68

7.5.5. GNSS Antenna – Installation Guidelines...............................................69

8. Hardware Interfaces......................................................................................... 70

8.1. USB Port ...........................................................................................................71

8.2. HSIC Interface ..................................................................................................72

8.3. SGMII Interface (optional) ...............................................................................72

8.3.1. Ethernet Control interface ...................................................................72

8.4. Serial Ports .......................................................................................................73

8.4.1. Modem Serial Port 1 Signals.................................................................74

8.4.2. Modem Serial Port 2.............................................................................75

8.4.3. RS232 Level Translation........................................................................76

8.5. Peripheral Ports ...............................................................................................78

8.5.1. SPI – Serial Peripheral Interface ...........................................................78

8.5.2. I2C - Inter-integrated Circuit ................................................................79

8.5.3. SD/MMC Card Interface .......................................................................79

8.5.4. WiFi SDIO Interface ..............................................................................81

8.6. Audio Interface ................................................................................................83

8.6.1. Digital Audio .........................................................................................83

8.6.1.1. Short Frame Timing Diagrams ..............................................84

8.6.1.2. Long Frame Timing Diagrams ...............................................86

8.7. General Purpose I/O ........................................................................................88

8.7.1. Using a GPIO Pad as Input ....................................................................90

8.7.2. Using a GPIO Pad as an interrupt / Wakeup source.............................90

8.7.3. Using a GPIO Pad as Output .................................................................90

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9. Miscellaneous Functions .................................................................................. 92

9.1. Indication of Network Service Availability.......................................................92

9.2. Indication of Software Ready...........................................................................93

9.3. RTC – Real Time Clock......................................................................................93

9.4. VAUX Power Output ........................................................................................93

9.5. ADC Converter .................................................................................................94

9.5.1. Description............................................................................................94

9.5.2. Using the ADC Converter......................................................................94

9.6. Using the Temperature Monitor Function ......................................................94

9.7. GNSS Characteristics........................................................................................95

10.Mounting the Module on your Board ............................................................... 96

10.1. General.............................................................................................................96

10.2. Finishing & Dimensions....................................................................................96

10.3. Recommended Footprint for the Application .................................................99

10.4. Stencil.............................................................................................................100

10.5. PCB Pad Design ..............................................................................................100

10.6. Recommendations for PCB Pad Dimensions (mm)........................................101

10.7. Solder Paste ...................................................................................................102

10.7.1.Solder Reflow......................................................................................102

11. Application Guide ...........................................................................................104

11.1. Debug of the LE910C1 Module in Production ...............................................104

11.2. Bypass Capacitor on Power Supplies .............................................................105

11.3. SIM Interface..................................................................................................106

11.3.1.SIM Schematic Example......................................................................106

11.4. EMC Recommendations.................................................................................107

11.5. Download and Debug Port.............................................................................108

11.5.1.Fast Boot mode...................................................................................108

11.5.2.Recovery Boot Mode ..........................................................................108

12. Packing System ...............................................................................................109

12.1. Packing system – Tray....................................................................................109

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12.2. Tape & Reel....................................................................................................111

12.3. Moisture Sensitivity .......................................................................................113

13. Safety Recommendations................................................................................114

14. Conformity assessment issues.........................................................................115

14.1. FCC/ISED Regulatory notices .........................................................................115

15. Document History...........................................................................................118

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List of Tables

Table 1: Applicability Table.................................................................................................................2

Table 2: Related Documents ............................................................................................................15

Table 3: RF Bands per Regional Variant............................................................................................23

Table 4: RF Bands Characteristics.....................................................................................................24

Table 5: LE910C1 Pin-out..................................................................................................................29

Table 6: Mandatory Signals ..............................................................................................................40

Table 7: Absolute Maximum Ratings – Not Operational..................................................................44

Table 8: Recommended Operating Conditions ................................................................................44

Table 9: Absolute Maximum Ratings - Not Functional.....................................................................45

Table 10: Operating Range – Interface Levels (1.8V CMOS) ............................................................45

Table 11: Operating Range – SD Card Pads Working at 1.8V ...........................................................46

Table 12: Operating Range – SIM Pads Working at 1.8V..................................................................46

Table 13: Absolute Maximum Ratings - Not Functional...................................................................47

Table 14: Operating Range – For SD Card Pads Operating at 2.95V ................................................47

Table 15: Operating Range – For SIM Pads Operating at 2.95V.......................................................48

Table 16: Power Supply Requirements ............................................................................................55

Table 17: LE910C1 Current Consumption.........................................................................................55

Table 18: GSM / WCDMA/ LTE Antenna Requirements...................................................................64

Table 19: Antenna Line on PCB Requirements.................................................................................64

Table 20: Antenna Diversity Requirements......................................................................................66

Table 21: Antenna Line on PCB Requirements.................................................................................68

Table 22: LE910C1 Hardware Interfaces ..........................................................................................70

Table 23: USB Interface Signals ........................................................................................................71

Table 24: Ethernet Control Interface Signals....................................................................................72

Table 25: Modem Serial Port 1 Signals.............................................................................................74

Table 26 Modem Serial Port 2 Signals..............................................................................................75

Table 27: SPI Signals .........................................................................................................................78

Table 28: SD Card Signals..................................................................................................................80

Table 29: WiFi SDIO Interface Signals...............................................................................................81

Table 30: Digital Audio Interface (DVI) Signals.................................................................................83

Table 31: PCM_CODEC Timing Parameters......................................................................................85

Table 32: AUX_PCM_CODEC Timing Parameters .............................................................................87

Table 33: Primary GPIOs...................................................................................................................88

Table 34: Network Service Availability Indication ............................................................................92

Table 35: Operating Range – VAUX Power Supply ...........................................................................93

Table 36: ADC Parameters................................................................................................................94

The values are related to typical environment and conditions Table 37 GNSS Characteristics.......95

Table 38: Recommendations for PCB Pad Surfaces .......................................................................101

Table 39: Solder Profile Characteristics..........................................................................................103

Table 40: SIM Interface – C1 Range................................................................................................106

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