Texas Instruments LP-MSPM0C1104 Bedienungsanleitung

EVM User's Guide: MSPM0C1104 LP-MSPM0C1104

LP-MSPM0C1104 Evaluation Module

Description

The MSPM0C1104 LaunchPad™ Development Kit

is an easy-to-use evaluation module for the

MSPM0C1104 microcontroller (MCU). The kit

contains everything needed to start developing

on the MSPM0C110x microcontroller platform,

including onboard debug probe for programming and

debugging. The board also features an onboard

button and LED for quick integration of a simple user

interface.

The MSPM0C1104 is an Arm® Cortex® 32-bit

-M0+ CPU with frequency up to 24 MHz. The

device features 16KB of embedded flash memory

combined with 1KB of on-chip RAM. This devices

includes an integrated 12-bit 866Ksps SAR ADC

with 10 external channels. Rapid prototyping is

simplified by the 20-pin BoosterPack™ plug-in module

headers, which support a wide range of available

BoosterPack plug-in modules. Users can quickly add

features like wireless connectivity, graphical displays,

environmental sensing, and much more. Design a

BoosterPack plug-in module or choose among many

available from TI and third-party developers.

Get Started

1. Order LP-MSPM0C1104 from ti.com.

2. Navigate to dev.ti.com to browse for code

examples.

3. Plug LP-MSPMC1104 into a PC with the provided

USB cable.

4. Download code directly from the browser to the

MSPM0C1104 with CCS Cloud.

5. Download CCS Theia for a desktop integrated

development environment.

Features

• Onboard XDS110 debug probe

• Backchannel UART through USB to PC

• USB powered

• 20-pin BoosterPack headers

• RC filter for ADC input or PWM DAC output

• One user button

• One red LED

Applications

•Battery charging and management

•Power supplies and power delivery

•Personal electronics

•Building security and fire safety

•Connected peripherals and printers

•Grid infrastructure

•Smart metering

•Communication modules

•Medical and healthcare

•Lighting

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LP-MSPM0C1104 Evaluation Module 1

1 Evaluation Module Overview

1.1 Introduction

The MSPM0C1104 is a low-cost microcontroller from the MSPM0 family based on the Arm(r) Cortex-M(r) M0+

processors architecture. These flexible devices can be used in a variety of system tasks from housekeeping

to simple motor control. The easiest way to get started with MSPM0C1104 is with the LP-MSPM0C1104

LaunchPad™. The LaunchPad has all the required features to load code, debug, and prototype right out of

the box.

To make prototyping even easier, TI provides the MSPM0 software development kit (SDK), which has over 50

code examples to use as starting points for application.

Free software development tools are also available, such as TI's Code Composer Studio™ IDE, IAR Embedded

Workbench™ IDE, and Keil® µVision® IDE. Code Composer Studio IDE supports EnergyTrace™ technology

when paired with the MSPM0L1306 LaunchPad development kit. More information about the LaunchPad

development kit, the supported BoosterPack™ plug-in modules, and the available resources can be found at

the TI LaunchPad™ development kit portal. To get started quickly and find available resources in the MSPM0

software development kit (SDK), visit the TI Cloud Developer Zone. MSPM0 MCUs are also supported by

extensive online collateral, training with MSP Academy, and online support through the TI E2E™ support forums.

1.2 Kit Contents

LP-MSPM0C1104 LaunchPad development kit

Quick start guide

1.3 Specification

LP-MSPM0C1104 is designed to be used in conjunction with a PC, Mac®, or Linux® workstation running Code

Composer Studio™ (CCS). CCS can run as a stand-alone on the workstation or be accessed through the web

(CCS Cloud) without the need for a software installation. Alternatively, LP-MSPM0C1104 ships with an example

loaded, which can be controlled by a GUI. See the out-of-box description below.

Once the code has been flashed onto LP-MSPM0C1104, the device can be powered from a power supply other

than the built in USB power supply. This allows the user to forgo the PC connection. Power can be applied

directly to either the 3.3V or 5 V rails. Do not apply power to both rails simultaneously. When using an external

power supply, make sure to not exceed 3.3V or 5 V respectively.

1.4 Device Information

LP-MSPM0C1104 uses the following devices from Texas Instruments.

Device Name Description Purpose

MSP432E401YTPDT SimpleLink™ 32-bit Arm® Cortex®-M4F MCU with ethernet,

CAN, 1MB Flash and 256kB RAM XDS110 host device

TPD4E004DRYR ESD-protection array for high-speed data interfaces, 4

channels

Protect LP-MSPM0C1104 from ESD damage

through USB connector

TPS73533DRBT 500 mA, adjustable, low quiescent current, low-noise, high-

PSRR, single-output LDO regulator 3.3V power XDS110 and MSPM0C1104

LM4040C25IDCKR Precision micropower shunt voltage reference Voltage reference for XDS110 debugger

MSPM0C1104SDGSR

Mixed-signal

Microcontroller with 24 MHz Arm® Cortex®32-bit-M0+ CPU,

16kB flash, and 1kB SRAM

Evaluation device

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2 Hardware

2.1 Hardware Overview

Figure 2-1. Diagram of LP-MSPM0C1104 Jumpers and Connectors

LP-MSPM0C1104 has many hardware features, which allow the user full access to the MSPM0C1104 pins while

still providing onboard connectivity for easy use. Shunt connections provide a way for the user to easily change

the LaunchPad configuration. The location of these shunts is shown in Figure 2-1. The connection of each shunt

is described in Table 2-1. The default configuration is to have all shunts populated.

Table 2-1. Jumper Information

Jumper Description Default Setting Connected Signal

J6 Pullup selection for PA0 (open drain) Installed between center tap and 3.3V 2.2k pullup resistor to 3.3V or 5 V

J7 PA4 LED connection Installed LED1 anode (+)

J8 Pullup selection for PA11 Installed 2.2k pullup resistor to 3.3V

J9 Reset button and pullup circuitry

connection Installed See Section 4.1

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2.2 Power Requirements

Simple nature of LP-MSPM0C1104 only requires 5 V USB power to operate. The onboard LDO generates a

3.3V supply up to 500 mA. The LaunchPad can also be power directly from the BoosterPack or power headers

using a bench supply or battery. Do not exceed 3.3V on the 3.3V rail. Do not exceed 5 V on the 5 V rail. Figure

2-2 shows the power connections on LP-MSPM0C1104.

Figure 2-2. LP-MSPM0C1104 Power Connections

2.3 XDS110 Debug Probe

LP-MSPM0C1104 features a onboard debug probe to streamline prototyping. The debugger used on this

LaunchPad is the XDS110 variant, which supports all MSPM0 device derivatives. The integrated XDS110 debug

probe is physically separated from the rest of the MSPM0C1104 circuitry as shown in figure 2.x. The XDS110

is also electrically separated from the MSPM0C1104. The XDS110 is only connected through signals that pass

through J101, in addition to a common ground.

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Isolation Jumper Block

The isolation jumper block at jumper J101 allows the user to connect or disconnect signals that cross from the

XDS110 domain into the MSPM0C1104 target domain. This includes XDS110 SWD signals, application UART

signals, and 3.3V and 5 V power.

Jumper Description

5 V 5-V VBUS from USB.

3V3 3.3-V rail, derived from VBUS in the XDS110-ET domain.

RXD<< Backchannel UART: The target MSPM0L1306 receives data through this signal. The arrows indicate the direction of the

signal.

TXD>> Backchannel UART: The target MSPM0L1306 sends data through this signal. The arrows indicate the direction of the

signal.

NRST RST signal.

SWDIO Serial wire debug: SWDIO data signal.

SWCLK Serial wire debug: SWDCLK clock signal.

During normal prototyping all shunts are populated. However, there are some scenarios where a user needs to

open these connections:

• To remove any and all influence from the XDS110 debug probe for high accuracy target power

measurements.

• To control 3.3V and 5 V power flow between the XDS110 and target domains.

• To expose the target MCU pins for other use than onboard debugging and application UART communication.

• To expose the programming and UART interface of the XDS110 so that the XDS110 can be used for devices

other than the onboard MCU.

Application (Backchannel) UART

The backchannel UART allows communication with the USB host that is not part of the target application’s

main functionality. This is very useful during development, and also provides a communication channel to the

PC host side. This can be used to create graphical user interfaces (GUIs) and other programs on the PC that

communicate with the LaunchPad development kit.

Figure 2-3 shows the pathway of the backchannel UART. The backchannel UART is connected to UART0 (PA8,

PA9) deepening on the jumper settings on headers J16 and J17.

On the host side, a virtual COM port for the application backchannel UART is generated when the LaunchPad

development kit enumerates on the host. You can use any PC application that interfaces with COM ports,

including terminal applications like Hyperterminal or Docklight, to open this port and communicate with the target

application. You need to identify the COM port for the backchannel. On Windows PCs, Device Manager can

assist.

Figure 2-3. Application Backchannel UART in Device Manager

The backchannel UART is the XDS110 Class Application/User UART port. In this case, Figure 2-3 shows

COM14, but this port can vary from one host PC to the next. After identifying the correct COM port, configure

the port in the host application according to documentation. The user can then open the port and begin

communication from the host.

On the target MSPM0C1104 side, the backchannel is connected to the UART0 module. The XDS110 has a

configurable baud rate; therefore, the PC application configuring the baud rate to be the same as what is

configured on the UART0 is important.

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2.4 Measure Current Draw of the MSPM0C1104

To measure the current draw of the MSPM0L1306 MCU using a multimeter, use the 3V3 jumper on the J101

jumper isolation block. The current measured includes the target device, launchpad circuits, and any current

drawn through the BoosterPack plug-in module headers.

To measure ultra-low power, follow these steps:

1. Remove the 3V3 jumper in the J101 isolation block, and attach an ammeter across this jumper.

2. Consider the effect that the backchannel UART and any circuitry attached to the MSPM0C1104 can have

on the current draw. Consider disconnecting these at the isolation jumper block, or at least consider their

current sinking and sourcing capability in the final measurement.

3. Make sure there are no floating inputs/outputs (I/Os) on the MSPM0C1104. This causes unnecessary extra

current draw. Every I/O is either driven or, if the I/O is an input, is pulled or driven to a high or low level.

4. Begin target execution.

5. For the most accurate current measurements, place the device in Free Run mode and disconnect

programming signals between the MSPM0L1306 and the debug portion of the board (header J101).

6. Measure the current. Keep in mind that if the current levels are fluctuating, then getting a stable

measurement can be difficult. Measuring the quiescent states is easier.

2.5 Clocking

The internal SYSOSC is 24 MHz as default at the accuracy of 2.5%. The MCLK is sourced by 32-MHz SYSOSC

at default. CPUCLK is sourced directly from MCLK in RUN mode and disabled in other modes. The low-power

clock (ULPCLK) can be sourced by MCLK and active in RUN and SLEEP mode by configuration. For more

clock tree details see Section 2.3 Clock Module (CKM) of the MSPM0 C-Series Microcontrollers Technical

Reference Manual.

2.6 BoosterPack Plug-in Module Pinout

The LaunchPad development kit adheres to the 20-pin LaunchPad development kit pinout standard, where

pins are available. A standard was created to aid compatibility between LaunchPad development kits and

BoosterPack plug-in modules across the TI ecosystem.

While most BoosterPack plug-in modules are compliant with the standard, some are not. If the reseller or owner

of the BoosterPack plug-in module does not explicitly indicate compatibility with the MSPM0C1104 LaunchPad

development kit,then compare the schematic of the candidate BoosterPack plug-in module with the LaunchPad

development kit to verify compatibility. Conflicts can be resolved by changing the MSPM0C1104 device pin

function configuration in software.

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3 Software

3.1 Software Development Options

There are multiple ways to prototype with LP-MSPM0C1104:

1. Out-of-box GUI - Choose this option for an easy demo of LP-MSPM0C1104.

2. CCS Cloud - Choose this option to get started quickly with minimal installation.

3. CCS Thiea - Choose this option to work offline and have full access to debug features. See CCS Thiea

documentation to get started.

4. CCS Eclipse - This option is supported but is a legacy tool and is not covered in this guide.

3.2 Out-of-box GUI

Get started right away with the out-of-box example on LP-MSPM0C1104. Simply navigate to the Out-of-box GUI

and plug in LP-MSPM0C1104 to a PC, Mac, or Linux workstation. This GUI provides control of the built in LED

and a dashboard of the current state of LP-MSPM0C1104. Find instructions to start prototyping below.

3.3 CCS Cloud

1. Navigate to dev.ti.com. The user can be required to install CCS Cloud Agent. If so, then follow the steps to

complete this installation.

2. Plug LP-MSPM0C1104 using a micro-USB cable. TI Developer Zone automatically detects that LP-

MSPM0C1104 has been plugged in.

3. Click Browse software and examples, which opens the MSPM0 SDK in a new window.

4. In the left bar, navigate to Arm-based microcontrollers > Embedded Software > MSPM0 SDK > Examples >

Development Tools > DriverLib > gpio_toggle_output > No RTOS > TI Clang Compiler > gpio_toggle_output.

5. Click the Import button in the top right corner of the screen. This action imports the project into CCS Cloud

and open in a new window.

6. In CCS Cloud, click the debug icon in the left bar to open the debug view.

7. Click the play button to deploy the code to the device and open a debug session. By default, the debugger

pauses the first line of code.

8. Click the blue play button to start the application.

9. The red LED on LP-MSPM0C1104 needs to be blinking.

Now, the user is ready to begin prototyping by modifying the code or by importing a different example code.

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4 Hardware Design Files

4.1 Schematics

GND

GNDGND

GND GND GND

3V3

GND

PA2

PA4

+5V

5V and 3.3V pullup selector for PA0

GND

LED

RESET Button

PA6

3V3

Power Headers

PA0

3 4

1 2

3 4

1 2

10uF

47k

470

0.47uF

270

R19

USER Button

PA16

PA20_A6

PA23

PA22_A4

PA24_A3

PA25_A2

PA26_UART_RX_A1

PA11

PA16

PA27_UART_TX_A0

PA17_A9

PA19

PA18_A7

2.2k

R18

2.2k

R21

3V3

6VDD

4PA0

5PA1/RST

11 PA11

12 PA16/A8

13 PA17

14 PA18/A7

15 PA19/SWDIO

8PA2/ROSC

16 PA20/A6/SWCLK

17 PA22/A4

18 PA23/VREF+

19 PA24/A3

20 PA25/A2

1PA26/A1

2PA27/A0

9PA4

10 PA6

3VCORE

VSS 7

MSPM0L1306SDGS20

PA28_A5

PA1_NRST

GND

+5V

BoosterPack Connectors

GPIO ! 11

SPI_CS/GPIO ! 12

SPI_CS/GPIO ! 13

SPI_POCI 14

SPI_PICO 15

RST 16

GPIO 17

GPIO ! 18

PWM/GPIO ! 19

GND

201

SSQ-110-03-F-S

5V 21

GND

+3.3V

Analog_In

LP_UART_RX

LP_UART_TX

GPIO !

Analog In

SPI_CLK

GPIO !

I2C_SCL

I2C_SDA

3V3

SSQ-102-03-F-S

+5V

GND

PA0_BP

PA22_A4

PA6

PA28_A5

PA24_A3

PA27_UART_TX_A0

PA26_UART_RX_A1

PA25_A2 PA16

PA17_A9_BP

PA19

PA1_NRST

PA18_A7_BP

PA4

PA2

PA23

PA20_A6

GND

PA0_BP

GND

PA17_A9_BP

2.2uF

R7 PA17_A9

GND

PA18_A7_BP

2.2uF

RC Filters for ADC or PWM DAC

PA18_A7

3V3

2.2k

270

PA11_BP PA11

PA0

PA11_BP

3.3V pullup selector for PA11

0.01uF

0.1uF

4VDD

PA28/A0_5/TIMA0_C0/UART0_RX/TIMG8_IDX

PA0/BEEP/I2C0_SDA/TIMG8_C0/SPI0_CS1/FCC_IN/TIMA_FAL1

NRST/PA1/I2C0_SCL/TIMG8_C1/HFCLK_IN/TIMA0_C1

VSS

A2/TIMG8_C1/SPI0_CS0/TIMA0_C0/TIMG8_IDX

PAD 21

MSPM0C1104SRUK

PA28_A5

PA0

PA1_NRST

PA2

PA4

PA6

PA11

PA16

PA17_A9

PA18_A7

PA19

PA20_A6

PA22_A4

PA23

PA24_A3

PA25_A2

PA26_UART_RX_A1

PA27_UART_TX_A0

GND

0.1uF

3V3

GND

PA4/TIMA0_C0N/SPI0_POCI/LFCLK_IN/HFCLK_IN/TIMA0_C1N

PA6/TIMG0_C1/SPI0_SCK/TIMA0_C1/TIMG0_C2/SPI0_CS0/TIMA_FAL0

PA11/SPI0_SCK/I2C0_SCL/TIMA_FAL0

PA16/A0_8/TIMA0_C1N/SPI0_POCI/TIMG0_C0/FCC_IN

PA17/A0_9/UART0_TX/TIMA0_C0N/SPI0_SCK/TIMA0_C2/SPI0_CS1/TIMA0_C3

PA18/A0_7/UART0_RX/SPI0_PICO/TIMA0_C1N/CLK_OUT/TIMA0_C3/TIMA0_C3N

PA19/SWDIO/SPI0_SCK/SPI0_POCI/TIMA0_C2/TIMG0_C0/UART0_CTS

PA20/A0_6/SWCLK/TIMA_FAL1/SPI0_PICO/TIMA0_C2N/TIMA0_C0/UART0_RTS

PA22/A0_4/UART0_RX/SPI0_POCI/UART0_RTS/CLK_OUT/TIMA0_C1

PA23/UART0_TX/SPI0_CS3/TIMG0_C0/UART0_CTS/TIMA0_C3/TIMG0_C1

PA24/A0_3/SPI0_CS2/TIMG0_C1/UART0_RTS/TIMG0_C2/TIMA0_C3N/UART0_RX

PA25/A0_2 /TIMG0_C3/UART0_TX/SPI0_PICO/TIMG0_C1/TIMA_FAL2

PA26/A0_1 /TIMG8_C0/UART0_RX/SPI0_POCI/BEEP/TIMG0_C0/TIMA_FAL0

PA27/A0_0/TIMG8_C1/SPI0_CS3/TIMA0_C0N/UART0_TX/SPI0_POCI/TIMA_FAL2

Red

1 2

LED1

Place C2 close to MCU

LTST-C190KRKT

U1 uses the VSSOP20 package, however this

LaunchPad also provisions U2 if the user would

like to use the VQFN20 (MSPM0CxxxRUK)

package.

Series resistor helps identify which devices is

pulling down an open-drain bus. MSPM0C LP will

only be able to pull down the bus to about 0.1 *

VDD. Other will be able to pull down to ground.

Figure 4-1.

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XDS_RXD

XDS_TXD

XDS_TCK_SWDCLK

XDS_TMS_SWDIO

XDS_TDO_SWO

XDS_TDI

XDS_RESET_OUT

ITCK

ITMS

ITDI

ITDO

XDS_ID

XDS_VBUS

VBUS_DETECT

XDS_VCC

XDS_USB_D_P

XDS_USB_D_N

XDS_VCC

GND

GNDGND

GND

REF_TARGET_VCC

1PD0

2PD1

PE3 12

PE2 13

PE1 14

PE0 15

PK0 18

PK1 19

PK2 20

PK3 21

PC7

22 PC6

23 PC5

24 PC4

PH0 29

PH1 30

PH2 31

PH3 32

PA0

PA1

PA2

PA3

PA4

PA5

PA6

PA7

PF0 42

PF1 43

PF2 44

PF3 45

PF4 46

PG0 49

PG1 50

PK7 60

PK6 61

PK5 62

PK4 63

92 PB

96 PB

PC3/TDO/SWO

97 PC2/TDI

99 PC1/TMS/SWDIO

PC0/TCK/SWCLK

100

PJ0 116

PJ1 117

PB5

120 PB4

121

PE4 123

PE5 124

PD4

125

126

127

128

XDS1A

MSP432E401YTPDTR

PQ0 6

PQ1

PQ2 11

PQ3 27

PM7

71 PM6

72 PM5

73 PM4

74 PM3

75 PM2

76 PM1

77 PM0

PL0

PL1

PL2

PL3

PL4

PL5

PL7

93 PL6

PQ4 102

PP2 103

PP3 104

PP4 105

PP5 106

PN0

107

PN1

108

PN2

109

PN3

110

PN4

111

PN5

112

PP0 118

PP1 119

XDS1B

MSP432E401YTPDTR

53 EN0RXIN

EN0RXIP

EN0TXON

EN0TXOP

RBIAS 59

WAKE

64 HIB 65

XOSC0 66

XOSC1 67

RST

OSC0 88

OSC1 89

XDS1C

MSP432E401YTPDTR

7VDD

8VDDA

9VREFA+

GNDA 10

VDD

GND 17

VDD

GND 48

VDD

GND 55

GND 58

VBAT

VDD

GND 80

VDDC

VDD

101

VDD

113

GND 114

VDDC

115

VDD

122

XDS1D

MSP432E401YTPDTR

XDS_VCC

IRSTN

Green

LED102

LTST-C190GKT

10k

R31

3 4

0.1uF

C17

0.1uF

C18

0.1uF

C24

0.1uF

C27

0.1uF

C28

0.1uF

C13

0.01uF

C14

0.01uF

C15

0.01uF

C16

0.01uF

C22

0.01uF

C26

1uF

C19

1uF

C21

1uF

C25

12pF

C29

12pF

C30

1.0k

R24

1.0k

R25

1.0k

R26

1.0k

R27

100

R28

4.87k

R32

470

R29

470

R30

1.0k

R34

R35

BSL_INVOKE

LM4040C25IDCKR

IC5A

0.1uF

C20

XDS_VBUS

XDS_TXD

XDS_RXD

XDS_TMS_SWDIO

XDS_RESET_OUT

XDS_TCK_SWDCLK

5V+ 3V3

XDS_VCC

LaunchPad<<---->> XDS110

XDS_VCC

PA1_NRST

3.30k

PA19

PA20_A6

PA27_UART_TX_A0

1 2

PA26_UART_RX_A1

3 4

5 6

7 8

9 10

11 12

13 14

J101

TSW-107-07-G-D

10V

2.2uF

C23

100

R33

Red

LED101

LTST-C190KRKT

Figure 4-2.

XDS_VCC

XDS_ID

XDS_USB_D_P

XDS_VBUS

XDS_USB_D_N

XDS_ID

XDS_VBUS

XDS_USB_D_P

XDS_VBUS

XDS_USB_D_N

VBUS_DETECT

GND

GND GND

GND

OUT

GND

5EN

7NC

PAD

IC4

TPS73533DRBT

GND

ITDO

ITDI

XDS_VCC

IRSTN

XDS_VCCITMS

ITCK

10V

2.2uF

C53

IO1

IO2

GND 3

IO3 4

IO4 5

6VCC

TPD4E004DRYR

IC3

VBUS

D- 2

D+ 3

ID 4

GND 5

611

USB2

1051640001

10k

R91

10k

R92

TP4

TP5

1uF

C55

2.2uF

C56

6R8

R89

330k

R87

220k

R88

3300pF

C54

1.00M

R90

TP6

TP7

TP8

TP9

TP10

LDO 3v3 (for XDS)

USB ESD protection

Figure 4-3. Schematic

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LP-MSPM0C1104 Evaluation Module 9

FID1

Fiducial

FID2

Fiducial

FID3

Fiducial

LOGO1

LOGO

CE Mark

PCB

Logo4

LOGO

PCB

ESD Susceptible

Logo6

LOGO

PCB

FCC disclaimer

Logo2

LOGO

PCB

Texas Instruments

Logo7

WEEE logo

MCU0118PCB Number:

PCB Rev: LOGO

PCB

Printed Circuit Board

Logo3

LaunchPad Rocket

ZZ1

Assembly Note

ZZ2

Assembly Note

These assemblies must comply with workmanship standards IPC-A-610 Class 2, unless otherwise specified.

ZZ3

Assembly Note

These assemblies are ESD sensitive, ESD precautions shall be observed.

SH-J1

J101: 1-2

SH-J2

J101: 3-4

SH-J3

These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable.

J101: 5-6

SH-J4

J101: 7-8

SH-J5

J101: 9-10

SH-J6

J101: 11-12

SH-J7

J101: 12-13

SH-J9

J7: 1-2

SH-J10

J8: 1-2

J9: 1-2

SH-J11

SH-J8

LOGO

PCB

J6: 1-2

Logo5

Texas Instruments

FID4

Fiducial

FID5

Fiducial

FID6

Fiducial

Figure 4-4.

Hardware Design Files www.ti.com

10 LP-MSPM0C1104 Evaluation Module SLAU908 – OCTOBER 2023

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