Texas Instruments DRV8833 Bedienungsanleitung

PWM

nSLEEP

nFAULT

2.7 to 10.8 V

Controller

+ t

DRV8833

Stepper or

Brushed DC

Motor Driver

1.5 A

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

Reference

Design

DRV8833

SLVSAR1E –JANUARY 2011–REVISED JULY 2015

DRV8833 Dual H-Bridge Motor Driver

1 Features 3 Description

The DRV8833 device provides a dual bridge motor

1• Dual-H-Bridge Current-Control Motor Driver driver solution for toys, printers, and other

– Can Drive Two DC Motors or One Stepper mechatronic applications.

Motor The device has two H-bridge drivers, and can drive

– Low MOSFET ON-Resistance: HS + LS 360 two DC brush motors, a bipolar stepper motor,

mΩsolenoids, or other inductive loads.

• Output Current (at VM= 5 V, 25°C) The output driver block of each H-bridge consists of

– 1.5-A RMS, 2-A Peak per H-Bridge in PWP N-channel power MOSFETs configured as an H-

and RTY Package Options bridge to drive the motor windings. Each H-bridge

– 500-mA RMS, 2-A Peak per H-Bridge in PW includes circuitry to regulate or limit the winding

current.

Package Option

• Outputs can be in Parallel for Internal shutdown functions with a fault output pin are

provided for overcurrent protection, short-circuit

– 3-A RMS, 4-A Peak (PWP and RTY) protection, undervoltage lockout, and

– 1-A RMS, 4-A Peak (PW) overtemperature. A low-power sleep mode is also

• Wide Power Supply Voltage Range: provided.

2.7 to 10.8 V The DRV8833 is packaged in a 16-pin WQFN

• PWM Winding Current Regulation and Current package with PowerPAD™ (Eco-friendly: RoHS & no

Limiting Sb/Br).

• Thermally Enhanced Surface-Mount Packages Device Information(1)

2 Applications PART NUMBER PACKAGE BODY SIZE (NOM)

TSSOP (16) 5.00 mm × 4.40 mm

• Battery-Powered Toys DRV8833 HTSSOP (16) 5.00 mm × 4.40 mm

• POS Printers WQFN (16) 4.00 mm × 4.00 mm

• Video Security Cameras (1) For all available packages, see the orderable addendum at

• Office Automation Machines the end of the data sheet.

• Gaming Machines

• Robotics

Simplified Schematic

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

DRV8833

SLVSAR1E –JANUARY 2011–REVISED JULY 2015

www.ti.com

Table of Contents

8.1 Application Information............................................ 12

1 Features.................................................................. 18.2 Typical Application.................................................. 12

2 Applications ........................................................... 19 Power Supply Recommendations...................... 14

3 Description............................................................. 19.1 Bulk Capacitance.................................................... 14

4 Revision History..................................................... 29.2 Power Supply and Logic Sequencing..................... 14

5 Pin Configuration and Functions......................... 310 Layout................................................................... 15

6 Specifications......................................................... 510.1 Layout Guidelines ................................................. 15

6.1 Absolute Maximum Ratings ...................................... 510.2 Layout Example .................................................... 15

6.2 ESD Ratings ............................................................ 510.3 Thermal Considerations........................................ 16

6.3 Recommended Operating Conditions....................... 510.4 Power Dissipation ................................................. 16

6.4 Thermal Information.................................................. 511 Device and Documentation Support................. 17

6.5 Electrical Characteristics........................................... 611.1 Documentation Support ........................................ 17

6.6 Typical Characteristics.............................................. 711.2 Community Resources.......................................... 17

7 Detailed Description.............................................. 811.3 Trademarks........................................................... 17

7.1 Overview................................................................... 811.4 Electrostatic Discharge Caution............................ 17

7.2 Functional Block Diagram......................................... 811.5 Glossary................................................................ 17

7.3 Feature Description................................................... 912 Mechanical, Packaging, and Orderable

7.4 Device Functional Modes........................................ 11 Information ........................................................... 17

8 Application and Implementation ........................ 12

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision D (March 2015) to Revision E Page

• Updated Features bullets to include specifications for other packages................................................................................. 1

• Added note back to Pin Functions regarding the different I/O types ..................................................................................... 3

• Corrected the device name and current regulation description in Overview ......................................................................... 8

• Corrected output current to 1.5-A RMS from 700-mA RMS .................................................................................................. 8

Changes from Revision C (January 2013) to Revision D Page

• Added ESD Ratings table,Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section ................................................................................................. 1

Product Folder Links: DRV8833

AIN1

AIN2

VINT

GND

VCP

BIN2

BIN1

BOUT1

nFAULT

BOUT2

BISEN

AISEN

AOUT2

AOUT1

nSLEEP

GND

(PPAD)

AOUT1

nSLEEP

AIN1

AIN2

VINT

GND

VCP

BIN1

BIN2

BOUT1

nFAULT

BOUT2

BISEN

AOUT2

AISEN

GND

(PPAD)

AIN1

AIN2

VINT

GND

VCP

BIN2

BIN1

BOUT1

nFAULT

BOUT2

BISEN

AISEN

AOUT2

AOUT1

nSLEEP

DRV8833

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SLVSAR1E –JANUARY 2011–REVISED JULY 2015

5 Pin Configuration and Functions

PWP Package RTY Package

16-Pin HTSSOP 16-Pin WQFN

Top View Top View

PW Package

16-Pin TSSOP

Top View

Pin Functions

PIN EXTERNAL COMPONENTS

I/O(1) DESCRIPTION

HTSSOP, OR CONNECTIONS

NAME WQFN TSSOP

POWER AND GROUND

11 Device ground. HTSSOP package Both the GND pin and device PowerPAD

GND 13 —

PPAD has PowerPAD. must be connected to ground.

Bypass to GND with 2.2-μF, 6.3-V

VINT 12 14 — Internal supply bypass capacitor.

Connect to motor supply. A 10-µF

VM 10 12 — Device power supply (minimum) ceramic bypass capacitor to

GND is recommended.

Connect a 0.01-μF, 16-V (minimum) X7R

VCP 9 11 IO High-side gate drive voltage ceramic capacitor to VM.

CONTROL

Logic input controls state of AOUT1.

AIN1 14 16 I Bridge A input 1 Internal pulldown.

Logic input controls state of AOUT2.

AIN2 13 15 I Bridge A input 2 Internal pulldown.

Logic input controls state of BOUT1.

BIN1 7 9 I Bridge B input 1 Internal pulldown.

Logic input controls state of BOUT2.

BIN2 8 10 I Bridge B input 2 Internal pulldown.

Logic high to enable device, logic low to

nSLEEP 15 1 I Sleep mode input enter low-power sleep mode and reset all

internal logic. Internal pulldown.

(1) I = Input, O = Output, OZ = Tri-state output, OD = Open-drain output, IO = Input/output

Product Folder Links: DRV8833

DRV8833

SLVSAR1E –JANUARY 2011–REVISED JULY 2015

www.ti.com

Pin Functions (continued)

PIN EXTERNAL COMPONENTS

I/O(1) DESCRIPTION

HTSSOP, OR CONNECTIONS

NAME WQFN TSSOP

STATUS

Logic low when in fault condition

nFAULT 6 8 OD Fault output (overtemperature, overcurrent)

OUTPUT

Connect to current sense resistor for bridge

AISEN 1 3 IO Bridge A ground / ISENSE A, or GND if current control not needed

Connect to current sense resistor for bridge

BISEN 4 6 IO Bridge B ground / ISENSE B, or GND if current control not needed

AOUT1 16 2 O Bridge A output 1 Connect to motor winding A

AOUT2 2 4 O Bridge A output 2

BOUT1 5 7 O Bridge B output 1 Connect to motor winding B

BOUT2 3 5 O Bridge B output 2

Product Folder Links: DRV8833

DRV8833

www.ti.com

SLVSAR1E –JANUARY 2011–REVISED JULY 2015

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNIT

VM Power supply voltage –0.3 11.8 V

Digital input pin voltage –0.5 7 V

xISEN pin voltage –0.3 0.5 V

Peak motor drive output current Internally limited A

TJOperating junction temperature –40 150 °C

Tstg Storage temperature –60 150 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 ESD Ratings VALUE UNIT

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000

Electrostatic

V(ESD) V

Charged device model (CDM), per JEDEC specification JESD22-C101, all

discharge ±1500

pins(2)

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

TA= 25°C (unless otherwise noted) MIN NOM MAX UNIT

VMMotor power supply voltage range(1) 2.7 10.8 V

VDIGIN Digital input pin voltage range –0.3 5.75 V

IOUT RTY package continuous RMS or DC output current per bridge(2) 1.5 A

(1) RDS(ON) increases and maximum output current is reduced at VM supply voltages below 5 V.

(2) VM= 5 V, power dissipation and thermal limits must be observed.

6.4 Thermal Information DRV8833

PWP RTY PW

THERMAL METRIC(1) UNIT

(HTSSOP) (WQFN) (TSSOP)

16 PINS 16 PINS 16 PINS

RθJA Junction-to-ambient thermal resistance 40.5 37.2 103.1 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 32.9 34.3 38 °C/W

RθJB Junction-to-board thermal resistance 28.8 15.3 48.1 °C/W

ψJT Junction-to-top characterization parameter 0.6 0.3 3 °C/W

ψJB Junction-to-board characterization parameter 11.5 15.4 47.5 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance 4.8 3.5 N/A °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

Product Folder Links: DRV8833

DRV8833

SLVSAR1E –JANUARY 2011–REVISED JULY 2015

www.ti.com

6.5 Electrical Characteristics

TA= 25°C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

POWER SUPPLY

IVM VM operating supply current VM= 5 V, xIN1 = 0 V, xIN2 = 0 V 1.7 3 mA

IVMQ VM sleep mode supply current VM= 5 V 1.6 2.5 μA

VUVLO VM undervoltage lockout voltage VMfalling 2.6 V

VM undervoltage lockout

VHYS 90 mV

hysteresis

LOGIC-LEVEL INPUTS

nSLEEP 0.5

VIL Input low voltage V

All other pins 0.7

nSLEEP 2.5

VIH Input high voltage V

All other pins 2

VHYS Input hysteresis 0.4 V

nSLEEP 500

RPD Input pulldown resistance kΩ

All except nSLEEP 150

IIL Input low current VIN = 0 1 μA

VIN = 3.3 V, nSLEEP 6.6 13

IIH Input high current μA

VIN = 3.3 V, all except nSLEEP 16.5 33

tDEG Input deglitch time 450 ns

nFAULT OUTPUT (OPEN-DRAIN OUTPUT)

VOL Output low voltage IO= 5 mA 0.5 V

IOH Output high leakage current VO= 3.3 V 1 μA

H-BRIDGE FETs

VM= 5 V, I O= 500 mA, TJ= 25°C 200

VM= 5 V, IO= 500 mA, TJ= 85°C 325

HS FET on resistance VM= 2.7 V, I O= 500 mA, TJ= 25°C 250

VM= 2.7 V, IO= 500 mA, TJ= 85°C 350

RDS(ON) mΩ

VM= 5 V, I O= 500 mA, TJ= 25°C 160

VM= 5 V, IO= 500 mA, TJ= 85°C 275

LS FET on resistance VM= 2.7 V, I O= 500 mA, TJ= 25°C 200

VM= 2.7 V, IO= 500 mA, TJ= 85°C 300

IOFF Off-state leakage current VM= 5 V, TJ= 25°C, VOUT = 0 V –1 1 μA

MOTOR DRIVER

ƒPWM Current control PWM frequency Internal PWM frequency 50 kHz

tRRise time VM= 5 V, 16 Ωto GND, 10% to 90% VM180 ns

tFFall time VM= 5 V, 16 Ωto GND, 10% to 90% VM160 ns

tPROP Propagation delay INx to OUTx VM= 5 V 1.1 µs

tDEAD Dead time(1) VM= 5 V 450 ns

PROTECTION CIRCUITS

IOCP Overcurrent protection trip level 2 3.3 A

tDEG OCP Deglitch time 4 µs

tOCP Overcurrent protection period 1.35 ms

tTSD Thermal shutdown temperature Die temperature 150 160 180 °C

(1) Internal dead time. External implementation is not necessary.

Product Folder Links: DRV8833

100

200

300

400

500

600

700

800

2.7 3.6 4.5 5.4 6.3 7.2 8.1 9.0 9.9 10.8

RDS(ON) (HS + LS) (m)

VVM (V)

-40°C

25°C

85°C

C004

100

200

300

400

500

600

700

800

±40 ±30 ±20 ±10 0 10 20 30 40 50 60 70 80

RDS(ON) (HS + LS) (m)

Temperature (C)

2.7 V

5 V

10.8 V

C003

0.0

0.5

1.0

1.5

2.0

2.5

3.0

2.7 3.6 4.5 5.4 6.3 7.2 8.1 9.0 9.9 10.8

IVM (mA)

VVM (V)

±40C

25°C

85°C

C001

±5.0

0.0

5.0

10.0

15.0

20.0

25.0

2.7 3.6 4.5 5.4 6.3 7.2 8.1 9.0 9.9 10.8

IVMQ (uA)

VVM (V)

±40C

25°C

85°C

C002

DRV8833

www.ti.com

SLVSAR1E –JANUARY 2011–REVISED JULY 2015

Electrical Characteristics (continued)

TA= 25°C (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

CURRENT CONTROL

VTRIP xISEN trip voltage 160 200 240 mV

tBLANK Current sense blanking time 3.75 µs

SLEEP MODE

tWAKE Start-up time nSLEEP inactive high to H-bridge on 1 ms

6.6 Typical Characteristics

Figure 2. Sleep Current

Figure 1. Operating Current

Figure 3. RDS(on) (HS + LS) Figure 4. RDS(on) (HS + LS)

Product Folder Links: DRV8833

Over-

Temp

AOUT1

GND

AIN1

Logic

AOUT2

Gate

Drive

OCP

BOUT1

BOUT2

Gate

Drive

OCP

BISEN

AISEN

Step

Motor

Drives 2x DC motor

or 1x Stepper

ISEN

AIN2

BIN1

BIN2

Charge

Pump

0.01uF

VM VCP

Internal

Ref &

Regs

VINT

DCM

nFAULT

nSLEEP

2.2uF

10uF

DRV8833

SLVSAR1E –JANUARY 2011–REVISED JULY 2015

www.ti.com

7 Detailed Description

7.1 Overview

The DRV8833 device is an integrated motor driver solution for brushed DC or bipolar stepper motors. The device

integrates two NMOS H-bridges and current regulation circuitry. The DRV8833 can be powered with a supply

voltage from 2.7 to 10.8 V and can provide an output current up to 1.5-A RMS.

A simple PWM interface allows easy interfacing to the controller circuit.

The current regulation is a fixed frequency PWM slow decay.

The device includes a low-power sleep mode, which lets the system save power when not driving the motor.

7.2 Functional Block Diagram

Product Folder Links: DRV8833

xOUT1

xOUT2

xISEN

xIN2

Pre-

drive

VCP, VINT

PWM

OCP

xIN1

REF (200mV)

DCM

Optional

DRV8833

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SLVSAR1E –JANUARY 2011–REVISED JULY 2015

7.3 Feature Description

7.3.1 Fixed-Frequency PWM Motor Drivers

DRV8833 contains two identical H-bridge motor drivers with current-control PWM circuitry. Figure 5 shows a

block diagram of the circuitry.

Figure 5. Motor Control Circuitry

7.3.2 Bridge Control and Decay Modes

The AIN1 and AIN2 input pins control the state of the AOUT1 and AOUT2 outputs; similarly, the BIN1 and BIN2

input pins control the state of the BOUT1 and BOUT2 outputs. Table 1 shows the logic.

Table 1. H-Bridge Logic

xIN1 xIN2 xOUT1 xOUT2 FUNCTION

Coast/fast

0 0 Z Z decay

0 1 L H Reverse

1 0 H L Forward

Brake/slow

1 1 L L decay

The inputs can also be used for PWM control of the motor speed. When controlling a winding with PWM, when

the drive current is interrupted, the inductive nature of the motor requires that the current must continue to flow.

This is called recirculation current. To handle this recirculation current, the H-bridge can operate in two different

states: fast decay or slow decay. In fast decay mode, the H-bridge is disabled and recirculation current flows

through the body diodes; in slow decay, the motor winding is shorted.

To PWM using fast decay, the PWM signal is applied to one xIN pin while the other is held low; to use slow

decay, one xIN pin is held high.

Table 2. PWM Control of Motor Speed

xIN1 xIN2 FUNCTION

PWM 0 Forward PWM, fast decay

1 PWM Forward PWM, slow decay

0 PWM Reverse PWM, fast decay

PWM 1 Reverse PWM, slow decay

Product Folder Links: DRV8833

CHOP ISENSE

200 mV

xOUT1 xOUT2

Forward drive

Slow decay

Fast decay

Reverse drive

Slow decay

Fast decay

xOUT1 xOUT2

FORWARD REVERSE

DRV8833

SLVSAR1E –JANUARY 2011–REVISED JULY 2015

www.ti.com

Figure 6 shows the current paths in different drive and decay modes.

Figure 6. Drive and Decay Modes

7.3.3 Current Control

The current through the motor windings may be limited, or controlled, by a fixed-frequency PWM current

regulation, or current chopping. For DC motors, current control is used to limit the start-up and stall current of the

motor. For stepper motors, current control is often used at all times.

When an H-bridge is enabled, current rises through the winding at a rate dependent on the DC voltage and

inductance of the winding. If the current reaches the current chopping threshold, the bridge disables the current

until the beginning of the next PWM cycle. Immediately after the current is enabled, the voltage on the xISEN pin

is ignored for a fixed period of time before enabling the current sense circuitry. This blanking time is fixed at 3.75

μs. This blanking time also sets the minimum on time of the PWM when operating in current chopping mode.

The PWM chopping current is set by a comparator which compares the voltage across a current sense resistor

connected to the xISEN pins with a reference voltage. The reference voltage is fixed at 200 mV.

The chopping current is calculated in Equation 1.

(1)

Example: If a 1-Ωsense resistor is used, the chopping current will be 200 mV/1 Ω= 200 mA.

Once the chopping current threshold is reached, the H-bridge switches to slow decay mode. Winding current is

recirculated by enabling both of the low-side FETs in the bridge. This state is held until the beginning of the next

fixed-frequency PWM cycle.

If current control is not needed, the xISEN pins should be connected directly to ground.

Product Folder Links: DRV8833

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