Texas Instruments Hercules TMS570LS04 Series Bedienungsanleitung

TMS570LS04 Hercules Development Kit (HDK)

User's Guide

Literature Number: SPNU569

September 2012

Contents

Preface ....................................................................................................................................... 4

1 Introduction ........................................................................................................................ 5

1.1 Scope of Document ......................................................................................................... 5

1.2 TMS570LS04 HERCULES Development Kit (HDK) Features ........................................................ 5

1.3 HDK Board Block Diagram ................................................................................................ 6

1.4 TMS570LS04 HDK Contents .............................................................................................. 6

1.5 HDK Specifications ......................................................................................................... 7

1.6 Basic Operation ............................................................................................................. 7

1.7 Memory Map ................................................................................................................. 7

1.8 Power Supply ................................................................................................................ 7

2 Physical Description ............................................................................................................ 8

2.1 Board Layout ................................................................................................................ 8

2.2 Connectors ................................................................................................................... 9

2.2.1 20-Pin ARM JTAG Header ........................................................................................ 9

2.2.2 20-Pin Compact TI JTAG Header .............................................................................. 10

2.2.3 CAN Interface ..................................................................................................... 10

2.2.4 J4, XDS100V2 USB JTAG Interface ........................................................................... 11

2.2.5 P1, +5 V to +12 V Input .......................................................................................... 11

2.2.6 Virtual COM Port Interface ...................................................................................... 12

2.2.7 Daughter Card Interface ......................................................................................... 12

2.3 LEDs ........................................................................................................................ 16

2.4 Emulator and Pin Multiplexing Selection DIP Switch ................................................................. 16

2.5 Jumpers ..................................................................................................................... 17

2.6 S3, Power-On Reset Switch ............................................................................................. 17

2.7 S2, System Reset Switch ................................................................................................ 17

2.8 S4, Pushbutton for Clock Failure Test .................................................................................. 17

A Operation Notices .............................................................................................................. 18

A.1 Support Resources ........................................................................................................ 18

2Contents SPNU569–September 2012

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List of Figures

1-1. TMS570LS04 HDK Board Block Diagram............................................................................... 6

2-1. TMS570LS04 HDK Board ................................................................................................. 8

2-2. Connectors on TMS570LS04 HDK Table ............................................................................... 9

2-3. CAN Bus Termination..................................................................................................... 11

2-4. J1, J2 Screw Terminal Block for CAN Bus............................................................................. 11

2-5. +12 V Input Jack........................................................................................................... 12

2-6. J9, J10 and J11 Connectors ............................................................................................. 13

2-7. DIP Switch Settings ....................................................................................................... 16

List of Tables

1-1. TMS570LS0432 Memory Map ............................................................................................ 7

1-2. Power Supply Selection.................................................................................................... 7

1-3. Power Test Points .......................................................................................................... 7

2-1. Connectors on HDK Board ................................................................................................ 9

2-2. 20-Pin ARM JTAG Header............................................................................................... 10

2-3. 20-Pin CTI JTAG Header................................................................................................. 10

2-4. Expansion Connector P2 (J9, Right, TopView)........................................................................ 13

2-5. Expansion Connector P1 (J9, Left, TopView) ......................................................................... 14

2-6. Expansion Connector P3 (J11, Bottom One, TopView).............................................................. 15

2-7. Demo LEDs ................................................................................................................ 16

2-8. Other LEDs as Indicator.................................................................................................. 16

2-9. S5 DIP Switch Functions ................................................................................................. 16

2-10. Jumpers..................................................................................................................... 17

SPNU569–September 2012 List of Figures

Preface

SPNU569–September 2012

Read This First

About This Manual

This document describes the board level operations of the TMS570LS04 Hercules™ Development Kit

(HDK). The HDK is based on the Texas Instruments TMS570LS0432 Microcontroller. The TMS570LS04

HDK is a table top card that allows engineers and software developers to evaluate certain characteristics

of the TMS570LS0432 microcontroller to determine if the microcontroller meets the designer application

requirements. Evaluators can create software to execute on board or expand the system in a variety of

ways.

Notational Conventions

This document uses the following conventions.

The TMS570LS04 HDK will sometimes be referred to as the HDK.

Program listings, program examples, and interactive displays are shown in a special italic typeface. Here

is a sample program listing:

• equations

• !rd = !strobe&rw;

Information About Cautions

This book may contain cautions.

This is an example of a caution statement.

A caution statement describes a situation that could potentially damage your software, or hardware, or

other equipment. The information in a caution is provided for your protection. Please read each caution

carefully.

Related Documentation From Texas Instruments

Information regarding this device can be found at the following Texas Instruments website:

http://www.ti.com/rm4

4Read This First SPNU569–September 2012

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Chapter 1

SPNU569–September 2012

Introduction

The TMS570LS0432 HDK is a low cost and easy to use hardware and software platform for evaluating the

functionality of the Texas Instruments TMS570LS0432 microcontroller family. Project collateral,

schematics and PCB layouts discussed in this application report can be downloaded from the following

URL:

(http://processors.wiki.ti.com/index.php/TMS570LS04x_HDK_Kit).

1.1 Scope of Document

This user guide will list the contents of the development kit, point out the features of the major

components, and provide the instructions necessary to verify your development kit is in working order. Any

additional usage instructions or details fall outside the scope of this document. Additional resources are

listed at the end of this user guide.

1.2 TMS570LS04 HERCULES Development Kit (HDK) Features

The HDK comes with a full complement of on board devices that suit a wide variety of application

environments. Key features include:

• A Hercules TMS570LS0432 100-pin QFP microcontroller

• Integrated USB JTAG emulator (XDS100v2)

• External JTAG headers ( ARM®20 pin and TI compact 20-pin CTI)

• One DIP switch to select pull-up or pull-down for JTAG nTRST

• Two CAN transceivers (SN65HVDA541Q1) and screw terminal blocks

• One ambient light sensor

• One ambient temperature sensor

• Microcontroller’s serial communications interface (SCI) universal asynchronous receiver/transmitter

(UART) accessible through a USB virtual COM port

• Four user programmable white LEDs

• One user programmable pushbutton

• Three expansion connectors for hardware prototyping

• Reset and power-on reset pushbuttons (nRST and nPORRST)

• One pushbutton simulating external oscillator failure

• One Jumper to select clock source for MCU: crystal or crystal oscillator

• One crystal socket (HC-18)

• One SD card slot (SPI mode)

• Current measurement capability for 3.3 V IO, 3.3 V analog-to digital converter (ADC) and, 1.2 V core

voltage

• May be powered by USB or an external power supply in case additional power is required (for

expansion boards)

• Accepts an external power supply between +5 V and +12 V

SPNU569–September 2012 Introduction

TMS570LS0432

80MHz

Power

Select

GIO

Button

Light

Sensor

ENET

RJ45

XDS100V2

FTDI

2332

CPLD

USB

EMU

CAN

PHY

CAN

PHY

CAN1 CAN2

Temp

Sensor

Ext JTAG

1.2V Core

3.3V I/O

PWR

EXP Conn1

EXP Conn3

EXP

Conn2

nPOR

nRST

SPI/ADC

JTAG

CAN/LIN/GIO/

HET

CTI

JTAG

Clock

Reset

Clock

Select

HDK Board Block Diagram

www.ti.com

1.3 HDK Board Block Diagram

Figure 1-1. TMS570LS04 HDK Board Block Diagram

1.4 TMS570LS04 HDK Contents

The kit contains everything needed to develop and run applications for TMS570LS04 microcontrollers

including:

• Cables and Accessories:

– 12 V power supply with power adapters for US, or Europe

– Type A to mini B USB cable for using on board XDS100V2 JTAG emulator

– Flashlight for light sensor demo

• CCS DVD Containing:

– Texas Instruments’ Code Composer Studio™ Integrated Development Environments (IDE)

• Hercules DVD Containing:

– Hercules Safety Demos

– Hardware Abstraction Layer Code Generator (HALCoGen)

– Training Videos

– Device Documentation

6Introduction SPNU569–September 2012

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HDK Specifications

1.5 HDK Specifications

• Board supply voltage: 5 V to 12 V DC

• Board supply current: 130 mA typ (fully active, CPU at 100 MHz)

• Dimensions: 4.90” x 4.30” x 0.85” (LxWxH)

1.6 Basic Operation

The HDK is designed to work with TI’s Code Composer Studio and other third party ARM IDEs. The IDEs

communicate with the board through the embedded emulator or an external JTAG emulator. To get

started, follow the instructions in the Quick Start Guide to install Hercules specific software. This process

will install all of the necessary development tools, documentation, and drivers.

1.7 Memory Map

The TMS570LS04 family of MCUs have a large byte addressable address space. Table 1-1 shows the

address space of a TMS570LS0432 microcontroller on the left with specific details of how each region is

used on the right. On-chip Flash memory starts at the beginning of the address space where the exception

vector table is located.

Table 1-1. TMS570LS0432 Memory Map

Start Address End Address HDK

0x0000 0000 0x0005 FFFF 384KB Flash

0x0800 0000 0x0800 7FFF 32KB RAM

0x0840 0000 0x0840 7FFF RAM-ECC

1.8 Power Supply

The HDK board operates from either +5V supplied from the USB connector (J4) or +5 V to +12 V supplied

from the power supply connected to the main power input (P1), a 2.5 MM, barrel-type plug. Internally, the

power input is converted into +1.2 V, +3.3 V using Texas Instruments voltage regulators. The +1.2 V

supply is used for the MCU core while the +3.3 V supply is used for the MCU's I/O buffers and other

component on the board.

The power used for operation is determined by the options listed in Table 1-2.

Table 1-2. Power Supply Selection

Power Used for USB VBUS (+5 V) Power From P1(5 V to 12 V)

the Board (USB Cable is Plugged or Not) (Power Cable is Plugged or Not)

From P1 ON ON

From P1 OFF ON

From VBUS ON OFF

There are multiple power test points on the HDK board. The three main test point pairs provide a

convenient mechanism to check the HDK’s current for each supply. Table 1-3 shows the voltages for each

test point and what the supply is used for.

Table 1-3. Power Test Points

Test Point Pair Voltage Voltage Use

TP11 and TP12 1.2 V MCU core

TP3 and TP4 3.3 V MCU IO and logic

TP22 and TP23 3.3 V MCU ADC power

SPNU569–September 2012 Introduction

TMS570LS

0432

Chapter 2

SPNU569–September 2012

Physical Description

This chapter describes the physical layout of the TMS570LS04 HDK board and its interfaces.

2.1 Board Layout

The TMS570LS04 HDK board a 4.9 x 4.3 inch (125 x 109 mm.) six layer printed circuit board that is

Figure 2-1 shows the layout of the TMS570LS04 HDK board.

Figure 2-1. TMS570LS04 HDK Board

8Physical Description SPNU569–September 2012

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J15

J10 J9

J11

J1 J2

J4 P1

TMS570LS

0432

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Connectors

2.2 Connectors

The HDK board has ten interfaces to various peripherals. These interfaces are described in Table 2-1.

Figure 2-2. Connectors on TMS570LS04 HDK Table

Table 2-1. Connectors on HDK Board

Connector Size Function

J1 3, 2,54mm DCAN1

J2 3, 2.54mm DCAN2

J3 10x2, 2.54mm ARM 20-pin JTAG header

J4 4pin, Mini-B USB XDS100V2 USB

J5 10x2, 2mm Compact TI 20-pin JTAG header

J9 33x2, 2mm Exp P1, SPI1, ADC, nPORRST

J10 33x2, 2mm EXP P2, SPI2, nRST, ECLK, nERROR

J11 40x2, 2mm EXP P3, GIO, CAN, LIN, EQEP, NHET, SPI3

J15 Micro SD slot SD card

P1 2.5mm +12 V In

2.2.1 20-Pin ARM JTAG Header

In addition to on board XDS100V2 JTAG. One 20-pin ARM JTAG header is added for using an external

emulator. This is the standard interface used by JTAG emulators to interface to ARM microcontrollers. The

pinout of the connector is shown in Table 2-2.

SPNU569–September 2012 Physical Description

Connectors

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Table 2-2. 20-Pin ARM JTAG Header

Signal Name Pin Number Pin Number Signal Name

Vref 1 2 VCC

nTRST 3 4 GND

TDI 5 6 GND

TMS 7 8 GND

TCK 9 10 GND

RTCK 11 12 GND

TDO 13 14 GND

nRST 15 16 GND

NC 17 18 GND

NC 19 20 GND

2.2.2 20-Pin Compact TI JTAG Header

We also implemented a compact TI JTAG header (CTI) on the board. This is the standard interface used

by TI and Spectrum Digital JTAG emulators. The pinout for the connector is shown in Table 2-3.

Table 2-3. 20-Pin CTI JTAG Header

Signal Name Pin Number Pin Number Signal Name

TMS 1 2 nTRST

TDI 3 4 TDIS

VTRef 5 6 KEY

TDO 7 8 GND

RTCLK 9 10 GND

TCLK 11 12 GND

NA 13 14 NA

SYSRSTn 15 16 GND

NA 17 18 NA

NA 19 20 GND

2.2.3 CAN Interface

The TMS570LS0432 has two DCAN interfaces which provide a high-speed serial interface. Two 3 pin

screw terminal blocks, J1 and J2, are used to interface with 12 the DCAN bus. The pinouts for this

connector are shown in Figure 2-3. H means CAN High (CAN H), and L means CAN Low (CAN L).

CAN Bus termination is used to minimize signal reflection on the bus. ISO-11898 requires that the CAN

bus have a nominal characteristic line impedance of 120 Ω. Therefore, the typical terminating resistor

value for each end of the bus is 120 Ω. A split termination method is used to help increase EMC

performance. Split termination is a concept that is growing in popularity because emission reduction can

be achieved very easily. Split termination is a modified standard termination in which the single 120 Ω

resistor on each end of the bus is split into two 60 Ωresistors, with a bypass capacitor tied between the

resistors and to ground. The two resistors should match as close as possible.

10 Physical Description SPNU569–September 2012

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