Texas Instruments Bq24725EVM Bedienungsanleitung

User's Guide

SLUU439A–August 2010–Revised May 2011

bq24725EVM Evaluation Module

This user's guide describes the features and operation of the bq24725EVM Evaluation Module (EVM).

This EVM assists users in evaluation the bq24725 synchronous battery charger. The manual includes the

bq24725EVM bill of materials, board layout, and schematic.

Contents

1 Introduction .................................................................................................................. 1

2 Test Summary ............................................................................................................... 3

3 PCB Layout Guideline ...................................................................................................... 7

4 Bill of Materials, Board Layouts and Schematics ....................................................................... 8

List of Figures

1 Connections of the EV2300 Kit ........................................................................................... 4

2 Original Test Setup for HPA-542 (bq24725 EVM)...................................................................... 5

3 Main Window of the bq24725 Evaluation Software .................................................................... 5

4 Test Setup for HPA-542.................................................................................................... 7

5 Top Layer................................................................................................................... 10

6 Second Layer .............................................................................................................. 10

7 Third Layer ................................................................................................................. 11

8 Bottom Layer............................................................................................................... 11

9 Top Mask................................................................................................................... 12

10 Bottom Mask ............................................................................................................... 12

11 Top Silkscreen............................................................................................................. 13

12 Bottom Silkscreen ......................................................................................................... 13

13 Top Assembly.............................................................................................................. 14

14 Bottom Assembly.......................................................................................................... 14

List of Tables

1 bq24275EVM and EV2300 Connections................................................................................. 4

2 Bill of Materials.............................................................................................................. 8

1 Introduction

1.1 EVM Features

•Evaluation module for bq24725

•High-efficiency NMOS-NMOS synchronous buck charger with 750-kHz frequency

•High-efficiency and low-cost NMOS power path selector and integrated gate driver

•User-selectable 2-cell, 3-cell, or 4-cell Li-ion battery voltage

•Programmable battery voltage, charge current, and ac adapter current via SMBus interface

•Flexible Chargeoption() register control via SMBus interface

•AC adapter operating range 9 V –24 V

•Test points for key signals available for testing. Easy probe hook-up

Windows is a trademark of Microsoft Corporation.

SLUU439A–August 2010–Revised May 2011 bq24725EVM Evaluation Module

Introduction

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•

Jumpers available. Easy-to-change connections.

1.2 General Description

The bq24725EVM evaluation module (also referred to as HPA-542) is a complete charger module for

evaluating a multicell synchronous notebook charge using the bq24725 devices. It is designed to deliver

up to 4 A of charge current to Li-ion or Li-polymer applications.

The bq24725 does not include the EV2300 interface board. To evaluate the bq24725, the EV2300

interface board must be ordered separately.

The bq24725 has a highly integrated battery charge controller designed to work with external host

commands. The charge voltage, charge current, input current, and flexible charge option are

programmable with a SMBus interface.

The bq24725 supports high-efficiency and low-cost NMOS power path selector and has an integrated gate

driver for both adapter-side and battery-side power path selector switch.

The dynamic power management (DPM) function modifies the charge current depending on system load

conditions, avoiding ac adapter overload.

High-accuracy current sense amplifiers enable accurate measurement of the ac adapter current, allowing

monitoring of overall system power.

For details, see bq24725 data sheet (SLUS702).

1.3 I/O Description

Jack Description

J1–DCIN AC adapter, positive output

J1–GND AC adapter, negative output

J2-SYS Connected to system

J2-BAT Connected to battery pack

J2-GND Ground

J3-ACOK ACOK pin

J3-IOUT IOUT pin

J3-3.3V External voltage supply 3.3 V

J4–SCL SCL pin output, SMBus clock line

J4–SDA SDA pin output, SMBus data line

J4–GND External power supply, negative output

1.4 Controls and Key Parameters Setting

Jack Description Factory Setting

JMP1 Connect battery voltage to VCC pin Jumper installed

1.5 Recommended Operating Conditions

Min Typ Max Unit Notes

Supply voltage, VIN Input voltage from ac adapter input 18 19 - 20 22 V

Battery voltage, VBAT Voltage applied at VBAT terminal 0 6 - 20 V

16.8

Supply current, IAC Maximum input current from ac adapter 0 4.5 A

input

Charge current, Ichrg Battery charge current 1 3 4 A

Operating junction temperature 0 125 °C

range, TJ

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Test Summary

2 Test Summary

2.1 Definitions

This procedure details how to configure the HPA-542 evaluation board. On the test procedure, the

following naming conventions are followed. Refer to the HPA542 schematic for details.

VXXX : External voltage supply name (VADP, VBT, VSBT)

LOADW: External load name (LOADR, LOADI)

V(TPyyy): Voltage at internal test point TPyyy. For example, V(TP12) means the voltage at

TP12.

V(Jxx): Voltage at jack terminal Jxx.

V(TP(XXX)): Voltage at test point XXX. For example, V(ACDET) means the voltage at the test

point which is marked as ACDET.

V(XXX, YYY): Voltage across point XXX and YYY.

I(JXX(YYY)): Current going out from the YYY terminal of jack XX.

Jxx(BBB): Terminal or pin BBB of jack xx

Jxx ON: Internal jumper Jxx terminals are shorted

Jxx OFF: Internal jumper Jxx terminals are open

Jxx (-YY-) ON: Internal jumper Jxx adjacent terminals marked as YY are shorted

Measure: →A,B Check specified parameters A, B. If measured values are not within specified limits,

the unit under test has failed.

Observe: →A,B Observe if A, B occur. If they do not occur, the unit under test has failed.

Assembly drawings have location for jumpers, test points, and individual components.

2.2 Equipment

2.2.1 Power Supplies

Power Supply #1 (PS#1): a power supply capable of supplying 20 V at 5 A is required.

Power Supply #2 (PS#2): a power supply capable of supplying 5 V at 1 A is required.

Power Supply #3 (PS#3): a power supply capable of supplying 20 V at 1 A is required.

2.2.2 Load #1

A 30-V (or above), 5-A (or above) electronic load that can operate at constant current mode

2.2.3 Load #2

An HP 6060B 3-V to 60-V/0-A to 60-A, 300-W system dc electronic load or equivalent

2.2.4 Meters

Seven Fluke 75 multimeters (equivalent or better)

Or four equivalent voltage meters and three equivalent current meters.

The current meters must be capable of measuring 5-A+ current.

2.2.5 Computer

A computer with at least one USB port and a USB cable. The EV2300 USB driver and the bq24725 SMB

evaluation software must be properly installed.

2.2.6 EV2300 SMBUS Communication Kit

An EV2300 SMBUS communication kit

SLUU439A–August 2010–Revised May 2011 bq24725EVM Evaluation Module

Test Summary

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2.2.7 Software

1. "Driver(USB EV2300) Installer XP2K-Last updated Jan28-04.zip": This is the EV2300 USB driver. Save

and unzip to c:\temp (or other directory). Double-click on the "setup.exe" file. Follow the installation

steps.

2. "bq24725EVMSetup.zip" (SLUC202): This is the bq24725 SMB evaluation software. Save and unzip to

c:\temp (or other directory). Double-click on the “SETUP.EXE”file. Follow the installation steps. This

software needs to be installed after the EV2300 USB driver.

3. Note: When the EV2300 is first inserted into the USB port of the personal computer, the user must

follow the instructions of the "Found New Hardware Wizard."

4. Allow Windows™to connect to Windows Update to search for software. Then click Next.

5. Select "Install software automatically (Recommended)." Then click Next.

6. If a window pops up informing the user that the TI USB Firmware Updater has not passed WIndows

Logo testing, click "Continue Anyway."

7. If a target file already exists and is newer, do not overwrite the newer file.

8. Click Finish.

2.3 Equipment Setup

1. Set the power supply #1 for 0 V ±100 mVdc, with the current limit set to >5 A, and then turn off supply.

2. Connect the output of power supply #1 in series with a current meter (multimeter) to J1 (DCIN, GND).

3. Connect a voltage meter across J1 (DCIN, GND).

4. Set the power supply #2 for 3.3 V ±100 mVdc, 0.2-A ±0.1-A current limit, and then turn off supply.

5. Connect the output of the power supply #2 to J3 (3.3 V) and J4 (GND).

6. Connect a voltage meter across J2 (BAT, GND).

7. Connect a voltage meter across J2 (SYS, GND).

8. Connect J4 (SDA, SCL) and J4 (GND) to the EV2300 kit SMB port. See Table 1 for connection

references. Connect the USB port of the EV2300 kit to the USB port of the computer. The connections

are shown in Figure 1.

Table 1. bq24275EVM and EV2300 Connections

bq24725EVM EV2300

GND (J4) GND (1)

SCL (J4) SMBC (2)

SDA (J4) SMBD (3)

Figure 1. Connections of the EV2300 Kit

9. If JMP1 is not installed, install the jumper.

10. The test setup for HPA542 is shown in Figure 2.

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Test Summary

Figure 2. Original Test Setup for HPA-542 (bq24725 EVM)

11. Turn on the computer. Open the bq24725 evaluation software. The main window of the software is

shown in Figure 3.

Figure 3. Main Window of the bq24725 Evaluation Software

SLUU439A–August 2010–Revised May 2011 bq24725EVM Evaluation Module

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2.4 Procedure

2.4.1 AC Adapter Detection Threshold

1. Be sure to follow EQUIPMENT SETUP steps. Turn on PS#2.

2. Turn on PS#1.

3. Increase the output voltage of PS#1 to 19.5 V.

Measure →V(TP(ACDET)) = 2.6 V ±0.1 V

Measure →V(TP(ACOK)) = 3.3 V ±0.1 V

Measure →V(J2(SYS)) = 19.5 V ±0.5 V

Measure →V(TP(REGN)) = 6 V ±0.5 V

Measure →V(TP(ACDRV, CMSRC)) = 6 V ±0.5 V

Measure →V(J2(BAT, GND)) = 1 V ±1 V

2.4.2 Charger Parameters Settings

1. In the software main window, click all the Read buttons. Make sure no error information is generated.

2. If an error information window pops up that reads "USB Error. Ensure USB cable is connected and

Driver is working," perform the following steps.

•Click OK. Close main window (shown in Figure 3), and disconnect the USB cable.

•Check the 3.3-V power supply (PS#2) and power supply #1 (PS#1) voltage on the EVM board.

•Disconnect any uncertain SMBus connections. Plug in the USB cable into the original EVM2300

installation USB port.

•Open the bq24725 evaluation software. The main window of the software is shown in Figure 3.

3. Type in "512" (mA) in the Charge Current DAC, and click the Write button. This sets the battery charge

current regulation threshold.

4. Type in "12592" (mV) in the Charge Voltage DAC, and click the Write button. This sets the battery

voltage regulation threshold.

Measure →V(J2(BAT)) = 12.6 V ±200 mV

2.4.3 Charge Current and AC Current Regulation (DPM)

1. Type in "7905" in the Charge Option, and click the Write button. This disables charging.

2. Connect the Load #2 in series with a current meter (multimeter) to J2 (BAT, GND). Ensure that a

voltage meter is connected across J2 (BAT, GND). Turn on the Load #2. Use the constant voltage

mode. Set the output voltage to 10.5 V.

3. Turn on the power of the Load #1. Set the load current to 3 A ±50 mA but disable the output. The

setup is now like Figure 4 for HPA542. Ensure that Ibat = 0 A ±10 mA and Isys = 0 A ±10 mA.

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PCB Layout Guideline

Figure 4. Test Setup for HPA-542

4. Type in "7905" in the Charge Option, and click the Write button. This enables charging.

Measure →Ibat = 500 mA ±100 mA

5. Type in "2944" (mA) in the Charge Current DAC, and click the Write button. This sets the battery

charge current regulation threshold to 2.944 A.

Measure →Ibat = 3000 mA ±300 mA

Measure →V(TP(IOUT)) = 340 mV ±40 mV

6. Enable the output of the Load #1.

Measure →Isys = 3000 mA ±300 mA, Ibat = 1600 mA ±200 mA, Iin = 4100 mA ±400 mA

Measure →V(TP(IOUT)) = 820 mV ±100 mV

7. Turn off the Load #1.

Measure →Isys = 0 A ±100 mA, Ibat = 3000 mA ±300 mA.

2.4.4 Power Path Selection

1. Type in "7905" in the Charge Option, and click the Write button. This disables charging.

2. Replace Load #2 and current meter with PS#3. Make sure a voltage meter is connected across J2

(BAT, GND). Enable the output of the PS #3. Ensure that the output voltage is 10 V ±500 mV.

Measure →Measure ±V(J2(SYS)) = 19.5 V ±1 V (adapter connected to system)

3. Turn off PS#1.

Measure →V(J2(SYS)) = 10 V ±1 V (battery connected to system)

Measure →V(J2(BAT)) = 10 V ±1 V (battery connected to system)

3 PCB Layout Guideline

The switching node rise and fall times must be minimized for minimum switching loss. Proper layout of the

components to minimize high-frequency current path loop is important to prevent electrical and magnetic

field radiation and high-frequency resonant problems. The following is a printed-circuit board (PCB) layout

priority list for proper layout. Laying out a PCB according to this specific order is essential.

SLUU439A–August 2010–Revised May 2011 bq24725EVM Evaluation Module

Bill of Materials, Board Layouts and Schematics

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1. Place input capacitor as close as possible to switching MOSFET’s supply and ground connections, and

use shortest copper trace connection. These parts must be placed on the same layer of the PCB

instead of on different layers and vias used to make this connection.

2. The integrated circuit (IC) must be placed close to the switching MOSFET’s gate terminals and the

gate drive signal traces kept short for a clean MOSFET drive. The IC can be placed on the other side

of the PCB of switching MOSFETs.

3. Place inductor input terminal to switching MOSFET's output terminal as close as possible. Minimize the

copper area of this trace to lower electrical and magnetic field radiation but make the trace wide

enough to carry the charging current. Do not use multiple layers in parallel for this connection.

Minimize parasitic capacitance from this area to any other trace or plane.

4. The charging current sensing resistor mut be placed right next to the inductor output. Route the sense

leads connected across the sensing resistor back to the IC in the same layer, close to each other

(minimize loop area), and do not route the sense leads through a high-current path. Place decoupling

capacitor on these traces next to the IC.

5. Place output capacitor next to the sensing resistor output and ground.

6. Output capacitor ground connections need to be tied to the same copper that connects to the input

capacitor ground before connecting to system ground.

7. Use single ground connection to tie charger power ground to charger analog ground. Just beneath the

IC, use analog ground copper pour but avoid power pins to reduce inductive and capacitive noise

coupling.

8. Route analog ground separately from power ground. Connect analog ground and power ground

separately. Connect analog ground and power ground together using power pad as the single ground

connection point. Or use a 0-Ωresistor to tie analog ground to power ground (power pad must tie to

analog ground in this case if possible).

9. Decoupling capacitors must be placed next to the IC pins, and make trace connection as short as

possible.

10. It is critical that the exposed power pad on the backside of the IC package be soldered to the PCB

ground. Ensure that sufficient thermal vias are directly under the IC, connecting to the ground plane on

the other layers.

4 Bill of Materials, Board Layouts and Schematics

4.1 Bill of Materials

Table 2. Bill of Materials

Count RefDes Value Description Size Part Number MFR

1 C1 2.2 µF Capacitor, Ceramic, 25V, X7R, 10% 1210 Std Std

6 C2, C3, C4, 10 µF Capacitor, Ceramic, 25V, X7R, 10% 1206 Std Std

C5, C6, C7

6 C8, C14, C15, 0.1 µF Capacitor, Ceramic, 25V, X7R, 10% 603 Std Std

C16, C17,

C19

4 C9, C10, C20, 1 µF Capacitor, Ceramic, 25V, X7R, 10% 603 Std Std

C25

2 C11, C12 0.01 µF Capacitor, Ceramic, 25V, X7R, 10% 603 Std Std

0 C13, C18, OPEN Capacitor, Ceramic, 25V, X7R, 10% 603 Std Std

C24, C26

1 C21 0.047 µF Capacitor, Ceramic, 25V, X7R, 10% 603 Std Std

1 C22 100 pF Capacitor, Ceramic, 25V, X7R, 10% 603 Std Std

1 C23 2200 pF Capacitor, Ceramic, 25V, X7R, 10% 603 Std Std

1 D1 BAT54-V-G Diode, Schottky, 200-mA, 30-V SOT23 BAT54-V-G Vishay-Liteon

1 D2 BAT54C-V-G Diode, Dual Schottky, 200-mA, 30-V SOT23 BAT54C-V-G Vishay-Liteon

1 J1 ED120/2DS Terminal Block, 2-pin, 15-A, 5.1mm 0.40 x 0.35 inch ED120/2DS OST

1 J2 ED120/3DS Terminal Block, 3-pin, 15-A, 5.1mm 0.60 x 0.35 inch ED120/3DS OST

2 J3, J4 ED555/3DS Terminal Block, 3-pin, 6-A, 3.5mm 0.41 x 0.25 inch ED555/3DS OST

1 JP1 PEC02SAAN Header, Male 2-pin, 100mil spacing, 0.100 inch x 2 PEC02SAAN Sullins

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Bill of Materials, Board Layouts and Schematics

Table 2. Bill of Materials (continued)

Count RefDes Value Description Size Part Number MFR

1 JP1 929950-00 Shorting jumpers, 2-pin, 100mil spacing, 929950-00 3M/ESD

1 L1 4.7 µH Inductor, SMT 0.255 x 0.270 IHLP2525CZER4R7M0 Vishay

inch 1

3 Q1, Q2, Q3 FDS6680A MOSFET, NChan, 30V, 12.5A, 9.5millohm PWRPAK S0-8 FDS6680A Fairchild

2 Q4, Q5 Sis412DN-T1 MOSFET, NChan, 30V, 12A, 30millohm PWRPAK 1212 Sis412DN-T1 Vishay

1 Q6 BSS138W-7-F MOSFET, Nch, 50V, 200mA, SOT-323 BSS138W-7-F Diodes

2 R1, R2 0.01 Resistor, Chip, 1/2W, 1% 150PPM 1206 PMR18EZPFU10L0 Rohm

Resistor, Chip, 1W, 1% 75 PPM WSLP1206R0100FEA Vishay/Dale

2 R3, R5 0 Resistor, Chip, 1/16W, 5% 603 Std Std

1 R4 7.5 Resistor, Chip, 1/16W, 1% 603 Std Std

2 R6, R7 3.9 Resistor, Chip, 0.5W, 5% 1210 Std Std

3 R8, R9, R13 4.02k Resistor, Chip, 1/10W, 1% 603 Std Std

0 R10, R11 OPEN Resistor, Chip, 1/16W, 1% 603 Std Std

1 R12 1.00M Resistor, Chip, 1/16W, 1% 603 Std Std

1 R14 66.5k Resistor, Chip, 1/16W, 1% 603 Std Std

1 R15 430k Resistor, Chip, 1/16W, 1% 603 Std Std

1 R16 10 Resistor, Chip, 1/4W, 1% 1206 Std Std

3 R17, R18, 10.0k Resistor, Chip, 1/16W, 1% 603 Std Std

R19

1 R20 100k Resistor, Chip, 1/16W, 1% 603 Std Std

1 R21 12.1k Resistor, Chip, 1/16W, 1% 603 Std Std

1 R22 316k Resistor, Chip, 1/16W, 1% 603 Std Std

1 R23 3.01M Resistor, Chip, 1/16W, 1% 603 Std Std

1 R24 10 Resistor, Chip, 1/16W, 1% 603 Std Std

1 TP1 131-4244-00 Adaptor, 3.5-mm probe clip ( or 131-5031-00) 0.200 inch 131-4244-00 Tektronix

11 TP2, TP3, Test Point, White, Thru Hole Color Keyed 0.100 x 0.100 5002 Keystone

TP4, TP5, inch

TP6, TP7,

TP8, TP9,

TP10, TP11,

TP12

1 TP13 GND Test Point, Black, Thru Hole Color Keyed 0.100 x 0.100 5001 Keystone

inch

0 TP14, 15, 16,

17, 18

4 6-32 NYL nuts NY HN 632 Building

Fasteners

4 ST1, ST2, 4816 STANDOFF M/F HEX 6-32 NYL 0.500"sf_thvt_325_rnd 4816 Keystone

ST3, ST4

1 U1 bq24725RGR IC, SMBus charge controller with NMOS bq24725RGR TI

selector

1–Label 1.25 x 0.25 inch THT-13-457-10 Brady

1–HPA542 2.5x2.5inch 4 layer 2oz. PCB 2.5x2.5inch PCB Any

SLUU439A–August 2010–Revised May 2011 bq24725EVM Evaluation Module

Bill of Materials, Board Layouts and Schematics

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4.2 Board Layouts

Figure 5. Top Layer

Figure 6. Second Layer

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