Texas Instruments M-LVDS Bedienungsanleitung

Multipoint-Low Voltage

Differential Signaling

(M-LVDS) Evaluation Module

April 2004 High Performance Analog

User’s Guide

SLLU039B

IMPORTANT NOTICE

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accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI

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EVM IMPORTANT NOTICE

Texas Instruments (TI) provides the enclosed product(s) under the following conditions:

This evaluation kit being sold by TI is intended for use for ENGINEERING DEVELOPMENT OR EVALUATION

PURPOSES ONLY and is not considered by TI to be fit for commercial use. As such, the goods being provided

may not be complete in terms of required design-, marketing-, and/or manufacturing-related protective

considerations, including product safety measures typically found in the end product incorporating the goods.

As a prototype, this product does not fall within the scope of the European Union directive on electromagnetic

compatibility and therefore may not meet the technical requirements of the directive.

Should this evaluation kit not meet the specifications indicated in the EVM User’s Guide, the kit may be returned

within 30 days from the date of delivery for a full refund. THE FOREGOING WARRANTY IS THE EXCLUSIVE

WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED,

IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY

PARTICULAR PURPOSE.

The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user

indemnifies TI from all claims arising from the handling or use of the goods. Please be aware that the products

received may not be regulatory compliant or agency certified (FCC, UL, CE, etc.). Due to the open construction

of the product, it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic

discharge.

EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE

TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES.

TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not

exclusive.

TI assumesno liability for applications assistance, customer product design, software performance, or

infringement of patents or services described herein.

Please read the EVM User’s Guide and, specifically, the EVM Warnings and Restrictions notice in the EVM

User’s Guide prior to handling the product. This notice contains important safety information about temperatures

and voltages. For further safety concerns, please contact the TI application engineer.

Persons handling the product must have electronics training and observe good laboratory practice standards.

No license is granted under any patent right or other intellectual property right of TI covering or relating to any

machine, process, or combination in which such TI products or services might be or are used.

Mailing Address:

Texas Instruments

Post Office Box 655303

Dallas, Texas 75265

EVM WARNINGS AND RESTRICTIONS

It is important to operate this EVM within the supply voltage range of 3 V to 3.6 V.

Exceeding the specified supply range may cause unexpected operation and/or irreversible

damage to the EVM. If there are questions concerning the supply range, please contact a TI

field representative prior to connecting the input power.

Applying loads outside of the specified output range may result in unintended operation and/or

possible permanent damage to the EVM. Please consult the EVM User’s Guide prior to

connecting any load to the EVM output. If there is uncertainty as to the load specification,

please contact a TI field representative.

During normal operation, some circuit components may have case temperatures greater than

125°C. The EVM is designed to operate properly with certain components above 125°C as

long as the input and output ranges are maintained. These components include but are not

limited to linear regulators, switching transistors, pass transistors, and current sense

resistors. These types of devices can be identified using the EVM schematic located in the

EVM User’s Guide. When placing measurement probes near these devices during operation,

please be aware that these devices may be very warm to the touch.

Mailing Address:

Texas Instruments

Post Office Box 655303

Dallas, Texas 75265

Read This First

Preface

How to Use This Manual

This document contains the following chapters:

-Chapter 1—The M-LVDS Evaluation Module

-Chapter 2—Test Setup

-Chapter 3—Bill of Materials, Board Layout, and PCB Construction

-Appendix A—Schematic

Related Documentation From Texas Instruments and Others

-Introduction to M-LVDS (SLLA108)

-LVDS Designer’s Notes (SLLA014A).

-Reducing EMI With Low Voltage Differential Signaling (SLLA030B).

-Interface Circuits for TIA/EIA−644 (LVDS) (SLLA038B).

-Transmission at 200 Mpbs in VME Card Cage Using LVDM (SLLA088).

-LVDS Multidrop Connections (literature number SLLA054).

-SN65MLVD20x data sheets, Multipoint-LVDS Line Drivers and Receivers,

(SLLS573 and SLLS558)

-Electromagnetic Compatibility Printed Circuit Board and Electronic

Module Design, VEC workshop, Violette Engineering Corporation.

FCC Warning

This equipment is intended for use in a laboratory test environment only. It

generates, uses, and can radiate radio frequency energy and has not been

tested for compliance with the limits of computing devices pursuant to subpart

J of part 15 of FCC rules, which are designed to provide reasonable protection

against radio frequency interference. Operation of this equipment in other

environments may cause interference with radio communications. In which

case the user, at his own expense, is required to take the necessary measures

to correct this interference.

Running Title—Attribute Reference

vii

Chapter Title—Attribute Reference

Contents

1 The M-LVDS Evaluation Module 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.1 Overview 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 M-LVDS Standard TIA/EIA−899 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 M-LVDS EVM Kit Contents 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4 Configurations 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4.1 Point-to-Point 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4.2 Multidrop 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4.3 Multipoint 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4.4 EVM Operation With Separate Power Supplies 1-7. . . . . . . . . . . . . . . . . . . . . . . . . .

1.5 Recommended Equipment 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2 Test Setup 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1 Typical Cable Test Configurations 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1.1 Point-to-Point Simplex Transmission 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.1.2 Point-to-Point Parallel Terminated Simplex Transmission 2-3. . . . . . . . . . . . . . . . .

2.1.3 Two-Node Multipoint Transmission 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2.2 Test Results 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3 Bill of Materials, Board Layout, and PCB Construction 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.1 Bill of Materials 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.2 Board Layout 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3.3 PCB Construction 3-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

A Schematic A-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Running Title—Attribute Reference

viii

Figures

1−1. M-LVDS Unit Interval Definition 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−2. Expanded Graph of Receiver Differential Input Voltage Showing Transition Region 1-4. . . .

1−3 Point-to-Point Simplex Circuit 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−4 Parallel Termination Simplex Circuit 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−5 Multidrop or Distributed Simplex Circuit 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−6 Five-Node Multipoint Circuit 1-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−7 Two-Node Multipoint Circuit 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−8 EVM Configuration for Including a Ground Potential Difference Voltage Between Nodes 1-8

2−1 Point-to-Point Simplex Transmission 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−2 Point-to-Point Parallel Terminated Simplex Transmission 2-3. . . . . . . . . . . . . . . . . . . . . . . . . . .

2−3 Two-Node Multipoint Transmission 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−4 Point-to-Point Parallel Simplex Typical Eye Pattern Data 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . .

2−5 Parallel Terminated Point-to-Point Parallel Simplex Typical Eye Pattern Data 2-6. . . . . . . . . .

2−6 Two-Node Multipoint Typical Eye Pattern Data 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−1 Assembly Drawing 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−2 Top Layer 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−3 Second Layer 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−4 Third Layer 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−5 Bottom Layer 3-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−6 Trace Configurations in Printed-Circuit Boards 3-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Tables

1−1M−LVDS Devices Supported by the EVM 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1−2 Receiver Input Voltage Threshold Requirements 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

2−1 EVM Configuration Options 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−1 M-LVDS EVM Bill of Materials 3-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

3−2 EVM Layer Stack Up 3-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1-1

The M-LVDS Evaluation Module

This document describes the multipoint low-voltage differential-signaling

(M-LVDS) evaluation module (EVM) used to aid designers in development and

analysis of this new signaling technology. The Texas Instruments

SN65MLVD200A, SN65MLVD201, SN65MLVD202A, SN65MLVD203,

SN65MLVD204A, SN65MLVD205A, SN65MLVD206, SN65MLVD207 series

are low-voltage differential line drivers and receivers complying with the

M-LVDS standard (TIA/EIA−899). The EVM kit contains the assembled

printed-circuit board and all of the released devices referred to in Table 1−1.

Using the EVM to evaluate these devices should provide insight into the design

of low-voltage differential circuits. The EVM board allows the designer to

connect an input to one or both of the drivers and configure a point-to-point,

multidrop, or multipoint data bus.

The EVM can be used to evaluate device parameters while acting as a guide

for high-frequency board layout. The board allows for the connection of a

100-Ωcontrolled impedance cable of varying lengths. This provides the

designer with a tool for evaluation and successful design of an end product.

Topic Page

1.1 Overview 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.2 M-LVDS Standard TIA/EIA−899 1-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.3 M-LVDS EVM Kit Contents 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.4 Configurations 1-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

1.5 Recommended Equipment 1-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Chapter 1

Overview

1-2 The M-LVDS Evaluation Module

1.1 Overview

The EVM comes with all the production devices in Table 1−1. The

SN65MLVD201 and SN65MLVD207 are installed on the circuit board, and can

easily be replaced with the other devices supplied. The M-LVDS devices

evaluated with this EVM are in the SN75ALS180 and SN75176 footprint. Use

of these industry standard footprints allows the designer to easily configure the

parts into a simplex or half-duplex data bus. These are all TIA/EIA−899

M-LVDS standard compliant devices. While initially intended for half-duplex or

multipoint applications, M-LVDS devices are not precluded from being used

in a point-to-point or multidrop configuration. In these configurations there can

be a distinct advantage to the additional current drive provided by an M-LVDS

driver.

The M-LVDS devices shown in Table 1−1 all include output slew-rate limited

drivers, thus the need for different nominal signaling rates. The M-LVDS

standard recommends the transition time not exceed 0.5 of the unit interval

(UI). The definition of transition time (trand tf) in M-LVDS is the 10% to 90%

levels shown in Figure 1−1. Using the maximum transition time for each of the

drivers and the 0.5(tUI) rule results in the signaling rates shown in Table 1−1.

This slew-rate control differentiates M-LVDS devices from LVDS

(TIA/EIA−644A)compliant devices. The slower transition times available with

M-LVDS help to reduce higher frequency components in the transmitted

signal. This reduces EMI and allows longer stubs on the main transmission

line. For this reason it is generally better to select a driver with a specified

signaling rate no greater than is required in the system.

Figure 1−1.M-LVDS Unit Interval Definition

10%

50%

90%

Table 1−1. M-LVDS Devices Supported by the EVM

Nominal

Signaling Rate

(Mbps) Footprints Receiver

Type Part

Number Status

100 SN75176 Type-1 SN65MLVD200AD Production

200 SN75176 Type-1 SN65MLVD201D Production

100 SN75ALS180 Type-1 SN65MLVD202AD Production

200 SN75ALS180 Type-1 SN65MLVD203D Production

100 SN75176 Type-2 SN65MLVD204AD Production

100 SN75ALS180 Type-2 SN65MLVD205AD Production

200 SN75176 Type-2 SN65MLVD206D Production

200 SN75ALS180 Type-2 SN65MLVD207D Production

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