Texas Instruments TUSB217AEVM-BC Bedienungsanleitung
User’s Guide
TUSB217AEVM-BC Evaluation Module
ABSTRACT
This user guide is for the evaluation module (EVM) of the TUSB217A devices is available to provide an easy
evaluation process of TI's TUSB217A USB High-Speed signal conditioners. It provides an overview of the EVM,
which highlights key features, operating conditions, and how to set up for use in system-level evaluation. The
construction of the EVM also serves as a reference design that is easily modified for any intended application.
Target applications include cell phones, desktop or notebook computers, docking stations, televisions, and active
cables. Additional schematic and layout information is available on TI.com.
Table of Contents
1 TUSB217AEVM-BC................................................................................................................................................................. 2
2 TUSB217AEVM-BC Board Description................................................................................................................................. 2
3 TUSB217AEVM-BC Kit Contents...........................................................................................................................................3
4 EVM Configuration..................................................................................................................................................................3
4.1 Setting EVM Jumpers........................................................................................................................................................ 3
4.2 Selecting Configuration Levels...........................................................................................................................................4
4.3 Battery Charging Functions of TUSB217A.........................................................................................................................4
5 EVM Operation........................................................................................................................................................................ 5
6 TUSB217AEVM-BC Schematics............................................................................................................................................ 6
7 TUSB217AEVM-BC Bill of Materials (BOM)........................................................................................................................10
List of Figures
Figure 2-1. TUSB217AEVM-BC.................................................................................................................................................. 2
Figure 6-1. TUSB217AEVM-BC Block Diagram.......................................................................................................................... 6
Figure 6-2. TUSB217AEVM-BC Mini-B Receptacle Section....................................................................................................... 7
Figure 6-3. TUSB217AEVM-BC Type-B Receptacle Section...................................................................................................... 8
Figure 6-4. TUSB217AEVM-BC Type-A Plug Section.................................................................................................................9
List of Tables
Table 4-1. 6 × 2 Configuration Header Pinout..............................................................................................................................3
Table 4-2. 3 × 3 Boost Header..................................................................................................................................................... 3
Table 4-3. 3 × 3 RX_SEN Header................................................................................................................................................4
Table 4-4. RX_SEN, BOOST Setting Based on Cable Length.................................................................................................... 4
Table 7-1. TUSB217AEVM-BC BOM.........................................................................................................................................10
Trademarks
All trademarks are the property of their respective owners.
www.ti.com Table of Contents
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1 TUSB217AEVM-BC
The TUSB217A is a USB High-Speed signal conditioner designed to compensate both AC loss (due to
capacitive load) and DC loss (due to resistive loss) in the transmission channel.
The TUSB217A speeds up the transition edges of a USB 2.0 high-speed signal with an edge booster and
increases static levels with a DC boost function. The TUSB217A includes a pre-equalization function to improve
the receiver sensitivity and compensate the inter-symbol interference (ISI) jitter. USB 2.0 low-speed and full-
speed signal characteristics are unaffected by the TUSB217A.
The integrated Charging Downstream Port (CDP) mode and Dedicated Charging Port (DCP) mode BC 1.2
battery charging controller can be controlled via the DCP/CDP pin.
The TUSB217AEVM-BC was designed to be used as a path connection between a USB 2.0 host and a USB 2.0
device. The EVM is designed to provide multiple connector options to help eliminate the use of adapters. The
upstream interface to the EVM consists of three possible input connectors: a USB 2.0 Mini-B Receptacle, a USB
3.1 Type B Receptacle, and a USB 3.1 Type-A Plug. The downstream interface to the EVM consists of three
USB 3.1 Type-A Receptacle output connectors. Each section of the EVM is detachable from the main board
along the board perforations. The EVM can be connected to the system using various cable lengths to verify
system operation under different conditions.
2 TUSB217AEVM-BC Board Description
The TUSB217AEVM-BC (see Figure 2-1) is designed to provide easy evaluation of the TUSB217A device.
It is also meant to serve as a reference design to show a practical example of how to use the device in a
mass-production system.
Figure 2-1. TUSB217AEVM-BC
TUSB217AEVM-BC www.ti.com
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3 TUSB217AEVM-BC Kit Contents
This EVM kit should contain the following items:
• TUSB217AEVM-BC board
• This user’s manual
4 EVM Configuration
4.1 Setting EVM Jumpers
The TUSB217AEVM-BC has two 3 × 3 headers and a 6 × 2 header in each board partition to facilitate
configuration changes.
The BOOST and RX_SEN 3 × 3 headers are arranged to allow for all possible device configurations, including
connecting RX_SEN to an LED so that the ENA_HS status output can be viewed easily. The corner pins of the 3
× 3 headers are not connected.
The 6 × 2 header adds the ability to connect onboard pullups to the SDA and SCL pins to support I2C operation.
If I2C mode is not needed, the SCL/CD pin can be connected to an LED so the CD status can be easily checked.
Also, the 6 × 2 header provides connections for ground and to supply power manually to the EVM. In addition,
the header adds the ability to enable CDP and DCP modes on the TUSB217A.
Table 4-1. 6 × 2 Configuration Header Pinout
Row 1 Row 2
VCC_EXT_Px -EVM External Power Input
If used, the onboard 0-Ω resistor between VCC_US_Px and
VCC_EXT_Px must be removed.
SW_VCC_Px - 3.3-V Power for I2C Interface.
Provided by an onboard regulator.
SDA_Px - I2C Serial Data to TUSB217A
4.7-kΩ I2C pullup - can be jumpered to SDA_Px. To enable I2C
mode, the pullups on both SDA and SCL must be connected at
power on or after a reset.
SCL/CD_Px - I2C Serial Clock or Connect Detect Output to
TUSB217A
4.7-kΩ I2C pullup - can be jumpered to SCL/CD_Px.
To enable I2C mode, the pullups on both SDA and SCL must be
connected at power on or after a reset.
CD_Px - Connect Detect LED. The LED can be jumpered to SCL/
CD_Px so USB connection status can be easily determined.
GND
CDP_DCP- BC 1.2 Mode configuration to TUSB217A.
Jumpering this pin to GND enables DCP mode. CDP is enabled by
internal pullup.
GND
GND GND
Changing jumper settings without a complete understanding of the result is not recommended. Configuration
inputs are only read by the TUSB217A during power on reset or after de-asserting the RSTN pin by pressing
the provided onboard reset button (SW1, SW2, SW3). Changing settings while the EVM is powered on has no
effect. Refer to the device data sheet for detailed pin descriptions and functionality along with EVM schematic for
additional information.
Table 4-2. 3 × 3 Boost Header
No Connect 3.6 kΩ to GND No Connect
1.8 kΩ to GND BOOST to TUSB217A GND
No Connect 0 Ω to GND No Connect
BOOST jumper settings as defined in Table 4-2.
1. Center pin to the bottom position sets BOOST Level 0
2. Center pin to the left position sets BOOST Level 1
3. Center pin to the top position sets BOOST Level 2
4. No connect of the center pin sets BOOST Level 3
The right position of the BOOST jumper is short to GND.
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Table 4-3. 3 × 3 RX_SEN Header
No Connect 27 kΩ to GND No Connect
13 kΩ, 39-kΩ divider RX_SEN to TUSB217A GND
No Connect ENA_HS LED No Connect
RX_SEN jumper settings as defined in Table 4-3.
1. The top position sets low RX sensitivity.
2. No connect of the center pin sets mid RX sensitivity.
3. The center pin to the left position sets high RX sensitivity.
4. The center pin to the bottom position enables the ENA_HS status LED.
Right Position of RX_SEN jumper is short to GND.
4.2 Selecting Configuration Levels
The primary purpose of the USB 2.0 signal conditioner is to restore the signal integrity of a USB High-Speed
channel to USB 2.0 compliant levels. The platform goal is to pass the USB Near-End or Far-End Eye Mask with
the device in the best location.
A typical use case is to place the USB 2.0 signal conditioner close to the USB connector on a host platform to
pass Near-End Eye Mask testing. This includes systems where the USB connector may be placed at the far-end
of a cable.
Typical RX sensitivity and boost recommendations based on cable length (28 AWG USB cable) are shown in
Table 4-4. TI recommends starting with the lower settings first
Table 4-4. RX_SEN, BOOST Setting Based on Cable Length
Cable Length BOOST RX_SEN
0 m - 2 m Level 0 MID
3 m - 5 m Level 1 MID, HIGH
4.3 Battery Charging Functions of TUSB217A
The DCP/CDP pin of the TUSB217A is a battery charging 1.2 Dedicated Charging Port (DCP) and Charging
Downstream Port (CDP) function enable. In the shared TUSB216IEVM and TUSB217AEVM-BC schematic, this
pin is listed as CDP_ENZ. By default, the TUSB217A has the battery charging 1.2 CDP function enabled with a
500-kΩ internal pullup.
When TUSB217A is disconnected from the USB 2.0 data stream, the DCP mode of the TUSB217A can then be
enabled to allow the DCP handshake to be performed. It is recommended that when the TUSB217A switches
from CDP to DCP mode or back, that downstream VBUS is toggled so any downstream devices reconnect.
4.3.1 Automatic DCP/CDP Test Setup
To test these features on the TUSB217AEVM-BC:
1. Remove the 0-Ω resistor connecting the upstream VBUS and the EVM power (R1, R16, R31).
2. Externally power the EVM, by providing power to pin 1 of the 6 × 2 header (VCC_EXT_Px). This power
source should be able to provide up to 1.5 A at 5 V DC. TI recommends setting the voltage slightly above 5
V to prevent droop issues.
3. There is an VBUS toggle circuit on the EVM that should provide an adequate VBUS toggle to force
connected downstream devices to disconnect and reconnect when transitioning between CDP and DCP
mode in most cases. This toggle length will vary depending on the voltage and bulk capacitance of the
system, and may not work for all applications. If it does not, see Manual DCP/CDP Test Setup.
4. Verify that the charging device power consumption is as expected.
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4.3.2 Manual DCP/CDP Test Setup
To manually test DCP/CDP features on the TUSB217AEVM-BC:
If the downstream device is not getting adequate VBUS toggle, to force a reconnect event the downstream
device can be disconnected and reconnected or the external EVM power manually toggled:
Entering CDP mode from DCP mode:
• No jumper on Header 6 × 2, pin 9 (CDP_ENZ in the schematic)
• Power cycle the VCC_EXT_Px to the EVM or disconnect and reconnect the downstream device
Entering DCP mode from CDP mode:
• Jumper on header 6 × 2, pin 9 (CDP_ENZ in the schematic) to GND (pin 10 or 11).
• Power cycle the VCC_EXT_Px to the EVM or disconnect and reconnect the downstream device
Note
The VBUS toggle circuit on the TUSB217AEVM-BC should not be used as a reference design. The
resistor divider used to sense upstream VBUS will back drive voltage on upstream VBUS due to the
internal pullup on DCP/CDP. A design with a comparator is recommended.
5 EVM Operation
To install the EVM, perform the following steps:
1. Upstream connection: attach a USB cable from a host PC Type A connector to the Type B connector (P2 or
P4) of the EVM or connect P6 directly to the host PC.
2. Downstream connection: attach a USB device directly or via a USB cable plugged into the Type A receptacle
connector (P1, P3 or P5) on the EVM.
3. The upstream connection and downstream connections must be on the same board section of the EVM.
The TUSB217A will only re-drive USB 2.0 high-speed signals.
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7 TUSB217AEVM-BC Bill of Materials (BOM)
Table 7-1 displays the EVM BOM.
Table 7-1. TUSB217AEVM-BC BOM
Item Quantity Reference Part
1 15 C1, C4, C5, C8, C9, C12, C15, C16, C18, C19, C23, C26, C27, C29,
C30 0.1uF
2 3 C2, C13, C24 10uF
3 12 C3, C6, C10, C14, C20, C21, C25, C31, C32, C34, C36, C38 1uF
4 6 C7, C17, C28, C35, C37, C39 2.2uF
5 3 C11, C22, C33 4.7uF
6 6 D1, D2, D3, D4, D5, D6 LED
7 3 JMP1, JMP8, JMP9 Header 6x2
8 6 J1, J2, J3, J4, J5, J6 Header 3x3
9 1 LBL1 THT-14-423-10
10 3 L1, L2, L3 100 Ohms Ferrite Bead
11 1 PCB1 HSDC112
12 2 P1, P3, P5 USB3.0 Type A Receptacle
13 1 P2 Mini USB B
14 1 P4 USB3.0 Type B Receptacle
15 1 P6 USB 3.0 Type A
16 6 R1, R7, R16, R22, R31, R37 0
17 3 R2, R18, R32 27K
18 3 R3, R17, R33 1K
19 6 R4, R5, R19, R20, R34, R35 75
20 3 R6, R21, R36 3.6K
21 3 R8, R24, R38 1.8K
22 3 R9, R25, R39 39K
23 3 R10, R23, R40 10K 1%
24 3 R11, R30, R41 13K
25 6 R12, R13, R26, R27, R42, R43 0
26 3 R14, R28, R44 22K
27 3 R15, R29, R45 75K 1%
28 6 R46, R47, R48, R49, R50, R51 4.7k
29 6 SHNT1, SHNT2, SHNT3, SHNT4, SHNT5, SHNT6 QPC02SXGN-RC
30 3 SW1, SW2, SW3 Switch - Push Button
31 3 U1, U4, U7 TUSB217ARWB
32 3 U2, U5, U8 TPS2024D
33 3 U3, U6, U9 SN74AHC1G86DBV
34 3 U10, U11, U12 TPS70633
TUSB217AEVM-BC Bill of Materials (BOM) www.ti.com
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