Toshiba TLP-X2500C Bedienungsanleitung

SERVICE MANUAL

FILE NO. 330-200610GR

3LCD DATA PROJECTOR

TLP-X2500U, TLP-X2500C

The above models are classified as green product (s) (*1), as indicated by the underlined serial number (s).

This Service Manual describes replacement parts for green product (s). When repairing any green product (s), use

the parts described in this manual and lead-free solder (*2).

For (*1) and (*2) , see the next page.

Published in Japan, November 2006GREEN© TOSHIBA CORPORATION

TLP-X2500E, TLP-X2500B

TLP-XC2500E, TLP-XC2500B

TLP-XC2500U, TLP-XC2500C

(*1) GREEN PRODUCT PROCUREMENT

The EC is actively promoting the WEEE & RoHS Directives that define standards for

recycling and reuse of Waste Electrical and Electronic Equipment and for the Restriction of

the use of certain Hazardous Substances. From July 1, 2006, the RoHS Directive will prohibit

any marketing of new products containing lead.

Increasing attention is given to issues related to the global environmental. Toshiba

Corporation recognizes environmental protection as a key management tasks, and is doing

its utmost to enhance and improve the quality and scope of its environmental activities. In

line with this, Toshiba proactively promotes Green Procurement, and seeks to purchase and

use products, parts and materials that have low environmental impacts. Green procurement

of parts is not only confined to manufacture. The same green parts used in manufacture

must also be used as replacement parts.

(*2) LEAD-FREE SOLDER

This product is manufactured using lead-free solder as a part of a movement within the CE

industry at large to be environmentally responsible. Lead-free solder must be used in the

servicing and repair of this product.

WARNING

This product is manufactured using lead free solder.

DO NOT USE LEAD BASED SOLDER TO REPAIR THIS PRODUCT

The melting temperature of lead-free solder is higher than that of leaded solder by 86°F to

104 °F (30°C to 40°C). Use of a soldering iron designed for lead-based solders to repair

product made with lead-free solder may result in damage to the component and or PCB

being soldered. Great care should be made to ensure high-quality soldering when servicing

this product—especially when soldering large components, through-hole pins, and on

PCBs—as the level of heat required to melt lead-free solder is high.

Table of Contents

Chapter 1 1-1

Specifications 1-1

Using the Menus 1-3

Names of the Terminals on the Rear Panel 1-4

Name of each part on document camera 1-5

List of Supported Signals 1-6

Chapter 2 2-1

Replaceable Part Hierarchy 2-1

Required Tools 2-2

Parts Replacement 2-3

Replacement of optical parts 2-15

Chapter 3 3-1

SINGOWS 2000 3-1

Chapter 4 4-1

FirmwareUpgrade 4-1

Chapter 5 5-1

Wiring Diagram 5-1

Block Diagram 5-2

Chapter 6 6-1

LEDDisplay 6-1

Troubleshooting 6-2

Operation of Power Supply 6-9

Chapter 7 7-1

Electrical adjustment 7- 1

Chapter 8 8-1

Functional Test 8-1

Chapter 9 9-1

Spare Parts List 9-1

ontents

1-1

Chapter 1

Specifications

Chapter 1

Cha

ter 1

1-2

1-3

Cha

ter 1

Using the Menus

1-4

Cha

ter 1

Names of the Terminals on the Rear Panel

Cha

ter 1

1-5

Names of each part on document camera (models with a document camera)

Cha

ter 1

1-6

List of Supported Signals

Cha

ter 1

1-7

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