ADLINK Technology MCM-100 Bedienungsanleitung

Leading EDGE COMPUTING

MCM-100/102

Edge IoT Platform for

Machine Condition Monitoring

User’s Manual

Manual Rev.: 1.0

Revision Date: June 18, 2019

Part No: 50-1Z298-1000

Leading EDGE COMPUTING

Revision History

Revision Release Date Description of Change(s)

1.0 June 18, 2019 Initial Release

Preface iii

MCM-100/102

Preface

This document contains proprietary information protected by copy-

right. All rights are reserved. No part of this manual may be repro-

duced by any mechanical, electronic, or other means in any form

without prior written permission of the manufacturer.

Disclaimer

The information in this document is subject to change without prior

notice in order to improve reliability, design, and function and does

not represent a commitment on the part of the manufacturer.

In no event will the manufacturer be liable for direct, indirect, spe-

cial, incidental, or consequential damages arising out of the use or

inability to use the product or documentation, even if advised of

the possibility of such damages.

Environmental Responsibility

ADLINK is committed to fulfill its social responsi-

bility to global environmental preservation

through compliance with the European Union's

Restriction of Hazardous Substances (RoHS)

directive and Waste Electrical and Electronic

Equipment (WEEE) directive. Environmental pro-

tection is a top priority for ADLINK. We have

enforced measures to ensure that our products,

manufacturing processes, components, and raw

materials have as little impact on the environment as possible.

When products are at their end of life, our customers are encour-

aged to dispose of them in accordance with the product disposal

and/or recovery programs prescribed by their nation or company.

iv Preface

Leading EDGE COMPUTING

Battery Labels (for products with battery)

California Proposition 65 Warning

WARNING: This product can expose you to chemicals

including acrylamide, arsenic, benzene, cadmium,

Tris(1,3-dichloro-2-propyl) phosphate (TDCPP), 1,4-

Dioxane, formaldehyde, lead, DEHP, styrene, DINP, BBP, PVC,

and vinyl materials, which are known to the State of California to

cause cancer, and acrylamide, benzene, cadmium, lead, mercury,

phthalates, toluene, DEHP, DIDP, DnHP, DBP, BBP, PVC, and

vinyl materials, which are known to the State of California to cause

birth defects or other reproductive harm. For more information go

to www.P65Warnings.ca.gov.

Trademarks

Product names mentioned herein are used for identification pur-

poses only and may be trademarks and/or registered trademarks

of their respective companies.

Conventions

Take note of the following conventions used throughout this

manual to make sure that users perform certain tasks and

instructions properly.

NOTE:

Additional information, aids, and tips that help users perform

tasks.

ᘄ㟁ụㄳᅇᨲ

Preface v

MCM-100/102

CAUTION:

Information to prevent minor physical injury, component dam-

age, data loss, and/or program corruption when trying to com-

plete a task.

WARNING:

Information to prevent serious physical injury, component

damage, data loss, and/or program corruption when trying to

complete a specific task.

vi Preface

Leading EDGE COMPUTING

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Table of Contents vii

MCM-100/102

Table of Contents

Preface .................................................................................... iii

List of Tables........................................................................ xiii

List of Figures ....................................................................... xv

1 Introduction ........................................................................ 1

1.1 Features............................................................................... 1

1.2 Specifications....................................................................... 2

1.2.1 General....................................................................... 2

1.2.2 I/O............................................................................... 3

1.2.3 Power Consumption ................................................... 6

1.3 Mechanical Drawings........................................................... 8

1.4 I/O Connectors................................................................... 10

1.4.1 Power Button ............................................................ 12

1.4.2 Reset Button............................................................. 13

1.4.3 DisplayPort Connector.............................................. 13

1.4.4 LED Indicators .......................................................... 14

1.4.5 DB-9P COM Port Connector .................................... 14

1.4.6 Dual Gigabit Ethernet Ports...................................... 15

1.4.7 USB 3.0 Port............................................................. 16

1.4.8 BNC Connectors....................................................... 16

1.4.9 4-pin GPI/O w/ DGND Connector............................. 17

1.4.10 DC Power Supply Connector.................................... 17

1.5 Adapters and Other Accessories ....................................... 17

2 Getting Started ................................................................. 19

2.1 Unpacking Checklist .......................................................... 19

2.2 Connecting DC Power ....................................................... 19

2.3 DIN Rail Mounting.............................................................. 19

2.4 Wall Mounting .................................................................... 22

viii Table of Contents

Leading EDGE COMPUTING

2.5 Cooling Considerations...................................................... 23

2.6 Installing Mini-PCIe WiFi Module (Optional) ...................... 24

3 Driver & Application Installation ..................................... 29

3.1 Installing the Chipset Driver ............................................... 29

3.2 Installing the Graphics Driver............................................. 30

3.3 Installing the Ethernet Driver.............................................. 30

3.4 Installing the USB 3.0 Driver.............................................. 31

3.5 Installing the I/O Controller Driver...................................... 31

3.6 Installing the SEMA Utility, WDT and DI/O Drivers............ 31

3.7 Installing AI and DI/O Drivers............................................. 32

MAPS Core ................................................................... 32

DAQ-LVIEW Plus .......................................................... 33

4 Operation ........................................................................... 35

4.1 Analog Input....................................................................... 35

4.1.1 Analog Input Front End Configuration ...................... 35

Input Configuration: Differential/Pseudo-Differential ..... 35

Input Coupling ............................................................... 36

IEPE Input ..................................................................... 36

4.1.2 AI Data Format ......................................................... 37

4.1.3 Sampling Rate .......................................................... 37

DDS Timing/Sampling Rate .......................................... 37

4.1.4 Data Transfer............................................................ 38

Software Polling Data Transfer

(Non-Buffering Programmed I/O) .................................. 38

Continuous Acquisition Mode ....................................... 38

4.1.5 Anti-Aliasing Filter and Frequency Response........... 38

4.2 Triggering........................................................................... 40

4.2.1 Analog Input Trigger Source..................................... 40

Software Triggering ...................................................... 40

External Analog Trigger ................................................ 41

Table of Contents ix

MCM-100/102

External Digital Triggering ............................................ 42

Trigger Modes ............................................................... 43

Delay-Trigger Acquisition (no retrigger) ........................ 44

Middle-Trigger Acquisition ............................................ 45

Gated Trigger ................................................................ 45

Post-Trigger or Delay-Trigger Acquisition

with Re-Trigger ............................................................. 46

4.3 Programmable Function I/O............................................... 46

4.3.1 Static Digital Input/Output......................................... 46

4.3.2 Frequency Counter................................................... 46

4.3.3 Pulse Output............................................................. 47

4.3.4 Digital Trigger IN for Continuous Analog Input ......... 47

4.3.5 Synchronization Sample Clock IN ............................ 47

5 Calibration......................................................................... 49

5.1 Loading Calibration Constants........................................... 49

5.2 Auto-Calibration ................................................................. 49

5.3 Saving Calibration Constants ............................................ 50

A Appendix: BIOS Setup...................................................... 51

A.1 Main ................................................................................... 52

A.1.1 BIOS Information ...................................................... 52

A.1.2 System Time/System Date ....................................... 52

A.1.3 Board Information ..................................................... 53

A.2 Advanced........................................................................... 54

A.2.1 CPU Configuration.................................................... 55

Active Processor Cores ................................................ 55

Intel Virtualization Technology ...................................... 55

VT-d .............................................................................. 55

Turbo Mode .................................................................. 55

Critical Trip Point .......................................................... 56

Passive Cooling Trip Point ............................................ 56

xTableofContents

Leading EDGE COMPUTING

A.2.2 Graphics Configuration ............................................. 56

GTT Size ....................................................................... 56

Aperture Size ................................................................ 56

DVMT Pre-Allocated ..................................................... 57

DVMT Total Gfx Mem ................................................... 57

A.2.3 Onboard Device Configuration ................................. 57

COM1 Control ............................................................... 57

COM2 Control ............................................................... 57

HSUART ....................................................................... 58

LAN #1 (Intel I210) ........................................................ 58

LAN #2 (Intel I210) ........................................................ 58

Realtek Audio Support .................................................. 58

Console Redirection ..................................................... 59

Console Redirection Settings (COM 1) ......................... 59

Console Redirection ..................................................... 62

Console Redirection Settings (COM 2) ......................... 62

A.2.4 Advanced Power Management................................. 64

Power Supply Unit ........................................................ 65

State After G3 ............................................................... 65

RTC Wake system from S5 .......................................... 65

LAN #1 Wake ................................................................ 65

LAN #2 Wake ................................................................ 65

A.2.5 USB Configuration .................................................... 66

XHCI Hand-off .............................................................. 66

USB Mass Storage Driver Support ............................... 66

USB transfer time-out ................................................... 66

Device reset time-out .................................................... 66

Device power-up delay ................................................. 67

A.2.6 SATA Configuration.................................................. 67

Port ............................................................................... 67

A.2.7 TPM Configuration.................................................... 68

Security Device Support ............................................... 68

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