ADLINK Technology Q7-AL Bedienungsanleitung

Q7-AL

User’s Manual

Qseven Computer On Module (COM) with

Embedded Intel® Atom™, Pentium®, and Celeron® Processors

Manual Rev.: 1.0

Revision Date: March 2, 2018

Part Number: 50-1Z231-1000

ii Preface

Preface

All rights are reserved. No part of this manual may be reproduced by any mechanical, electronic, or other means in

any form without prior written permission of the manufacturer.

Disclaimer

The information in this document is subject to change without prior notice in order to improve reliability, design, and

function and does not represent a commitment on the part of the manufacturer. In no event will the manufacturer

be liable for direct, indirect, special, incidental, or consequential damages arising out of the use or inability to use

the product or documentation, even if advised of the possibility of such damages.

Environmental Responsibility

ADLINK is committed to fulfill its social responsibility to global environmental preservation through compliance with

the European Union's Restriction of Hazardous Substances (RoHS) directive and Waste Electrical and Electronic

Equipment (WEEE) directive. Environmental protection is a top priority for ADLINK. We have enforced measures to

ensure that our products, manufacturing processes, components, and raw materials have as little impact on the

environment as possible. When products are at their end of life, our customers are encouraged to dispose of them

in accordance with the product disposal and/or recovery programs prescribed by their nation or company.

Trademarks

Product names mentioned herein are used for identification purposes only and may be trademarks and/or

registered trademarks of their respective companies.

Revision History

Revision Description Date By

1.0 Initial release 2018-03-02 DA

Q7-AL

Preface iii

Table of Contents

Preface................................................................................................................................ii

Table of Contents..............................................................................................................iii

List of Figures ....................................................................................................................v

List of Tables.....................................................................................................................vi

1. Introduction................................................................................................................1

2. Specifications ..........................................................................................................13

2.1. Core System...........................................................................................................13

2.2. Expansion Busses ..................................................................................................13

2.3. Video ......................................................................................................................14

2.4. Audio ......................................................................................................................15

2.5. LAN.........................................................................................................................15

2.6. Multi I/O and Storage..............................................................................................16

2.7. Serial I/O on Module ...............................................................................................17

2.8. SEMA Board Controller...........................................................................................17

2.9. Debug.....................................................................................................................18

2.10. Power Specifications...............................................................................................18

2.11. Power Consumption................................................................................................18

2.12. Operating Temperatures.........................................................................................19

2.13. Environmental.........................................................................................................19

2.14. Specification Compliance........................................................................................19

2.15. Operating Systems .................................................................................................19

2.16. Functional Diagram.................................................................................................20

2.17. Mechanical Drawing................................................................................................21

2.18. Q7-AL Heatspreaders.............................................................................................22

2.19. Q7-AL Top View and Bottom View..........................................................................26

3. Pinouts and Signal Descriptions............................................................................13

3.1. Primary/Secondary Pin Definitions..........................................................................13

3.2. Signal Description Terminology...............................................................................18

3.3. Qseven Signal Descriptions....................................................................................19

4. Connector Pinouts on Module................................................................................29

4.1. Connector, Switch, and LED Locations...................................................................29

4.2. Q7-AL and the DB40 Debug Module.......................................................................29

4.3. 36-pin MIPI-CSI2 Camera Connector......................................................................30

4.4. 40-pin Debug Connector.........................................................................................32

iv Preface

4.5. Status LEDs............................................................................................................33

4.6. BIOS Switch Settings..............................................................................................35

5. Smart Embedded Management Agent (SEMA) .....................................................37

5.1. Board Specific SEMA Functions .............................................................................38

6. System Resources ..................................................................................................41

6.1. System Memory Map..............................................................................................41

6.2. Direct Memory Access Channels ............................................................................41

6.3. I/O Map...................................................................................................................41

6.4. Interrupt Request (IRQ) Lines.................................................................................43

6.5. PCI Configuration Space Map.................................................................................44

6.6. PCI Interrupt Routing Map ......................................................................................46

6.7. SMBus Address Table ............................................................................................46

7. BIOS Setup...............................................................................................................47

7.1. Menu Structure .......................................................................................................47

7.2. Main........................................................................................................................48

7.3. Advanced................................................................................................................50

7.4. Chipset ...................................................................................................................60

7.5. Security...................................................................................................................66

7.6. Boot........................................................................................................................67

8. BIOS Checkpoints, Beep Codes.............................................................................69

8.1. Status Code Ranges...............................................................................................70

8.2. Standard Status Codes...........................................................................................70

8.3. OEM-Reserved Checkpoint Ranges .......................................................................77

9. Mechanical Information...........................................................................................79

9.1. Board-to-Board Connector......................................................................................79

9.2. Thermal Solution.....................................................................................................80

9.3. Mounting Requirements..........................................................................................83

Safety Instructions...........................................................................................................84

Getting Service.................................................................................................................85

Q7-AL

Preface v

List of Figures

Figure 1: Q7-AL Functional Block Diagram............................................................................................20

Figure 2: Q7-AL Mechanical Drawing ....................................................................................................21

Figure 3: Q7-AL-HS1 Heat Spreader Mechanical Drawing....................................................................22

Figure 4: Q7-AL-HS2 Heat Spreader Mechanical Drawing....................................................................23

Figure 5: Q7-AL-HS4 Passive Heatsink Mechanical Drawing ...............................................................24

Figure 6: Q7-AL-HS5 Passive Heatsink Mechanical Drawing ...............................................................25

Figure 7: Q7-AL Connector, Switch and LED Locations........................................................................29

Figure 8: Q7-AL and the DB40 Debug Module ......................................................................................30

Figure 9: Q7-AL LED Locations .............................................................................................................33

Figure 10: Q7-AL BIOS Switch Location................................................................................................35

Figure 11: Qseven Mounting Requirements...........................................................................................83

vi Preface

List of Tables

Table 1: Q7-AL Primary/Secondary Pin Definitions ...............................................................................13

Table 2: 36-pin MIPI-CSI Camera Connector Pin Definition on the Qseven Module.............................31

Table 3: 40-pin Debug Connector Pin Definition on the Qseven Module ..............................................32

Table 4: LED Descriptions......................................................................................................................34

Table 5: BIOS Select and Mode Configuration Switch Settings.............................................................35

Table 6: SEMA Onboard Voltage Monitor..............................................................................................38

Table 7: SEMA BMC Status...................................................................................................................38

Table 8: SEMA Exception Codes...........................................................................................................39

Table 9: SEMA BMC Flags.....................................................................................................................39

Q7-AL

Introduction 1

1. Introduction

The Q7-AL Computer-On-Module (COM) combines the QSeven® 2.1 standard with the Intel® (“Apollo Lake”) Atom

E-series and Pentium® and Celeron® N-series System-on-Chips (SoCs), providing ideal solutions for low power

consumption and high pin/area density requirements. The module provides the high integration, high performance,

low power, and ruggedness favored by Internet-of-Things (IoT) applications such as retail transactional clients,

digital signage, and in-vehicle infotainment systems.

The QSeven form factor affords a more compact profile and footprint than the other COM platforms. With

mechanical dimensions of 70mm width, 70mm length, and 2.3mm of overall height, Qseven ranks as one of the

smallest COM standards currently available.

The Q7-AL utilizes the upgrades in Intel’s latest (“Apollo Lake”) N-series and E-series SoCs such as the Intel 64

Architecture (“Goldmont”), the new HD graphics 500/505 engine (Gen-9), and a faster, 4-vector image processing

unit. The SoCs are manufactured on Intel’s industry-leading, tri-gate 14nm process, improving system performance

by supporting up to 8GB of system memory. Compared to the previous generation (“Braswell”), the Apollo Lake

SoC comes with a larger package size (24x31mm2) and pin count (1296 pins) and has updated the OS support by

adding Windows 10 IOT and removing support for Windows7/8.1 and WEC7/2013. Because Apollo Lake has more

I/O interfaces than Braswell, no pin compatibility exists between these two generations of SoCs.

New Intel SoC features:

•Integrated heat spreader on Atom E3950, E3940 and E3930

•Extended temperature SKUs (-40°C to +85°C)

•Windows 10 IOT support

•Gen-9 graphics engine with 18 execution units

•Up to 4-vector-unit image processing unit

•Up to 15 simultaneous 1080p30 decode streams

•Memory bandwidth increase to 38.4 GB/s

•4K display resolution with 60Hz

•4K video encode

•Embedded Apollo Lake-I and Apollo Lake have 15-year Intel support lifecycle

The Qseven module primarily targets embedded intelligent systems used in several vertical market segments such

as healthcare, industrial controllers and real-time systems, gaming devices, retail systems, edge IoT gateways, in-

vehicle infotainment systems, printers, thin clients, industrial and ruggedized tablets, and many others. The Q7-AL

supports contemporary, high-bandwidth interfaces such as Ultra HD HDMI, dual-channel LVDS, PCI Express Gen2,

Gigabit Ethernet, USB 2.0/3.0, SATA Gen3, two MIPI CSI cameras, and a state-of-the-art HD audio interface. The

module generates its own LVDS (18/24bit), TMDS, and DisplayPort++ video signals using eDP and DDI output

from the SoC.

Two SPI Flash chips implement a fail-safe BIOS, allowing the user to boot the module even if current BIOS settings

have corrupted the system. Other storage devices on the board include an optional eMMC NAND Flash device and

an optional SATA SSD.

Under the management of the BMC (Board Management Controller), the SEMA (Smart Embedded Management

Agent) utility provides system control, security, and failure protection—counting, monitoring, and measuring

hardware and software events, and using the SMBus to send corrective commands to the SoC.

2 Introduction

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Q7-AL

Specifications 13

2. Specifications

2.1. Core System

CPU Intel® Atom™ E39xx, Pentium® N4200, and Celeron® N3350, x86 dual-core or quad-

core SoCs (System on Chips) with integrated memory, graphics, and I/O (formerly

‘Apollo Lake’)

•Atom E3950 Quad-Core; 12W TDP; 1.6 GHz base freq; 2.0 GHz burst freq; up to 2400

MT/s; 500MHz graphics base freq; 650MHz graphics burst freq

•Atom E3940 Quad-Core; 9.5W TDP; 1.6 GHz base freq; 1.8 GHz burst freq; up to 2133

MT/s; 400MHz graphics base freq; 600MHz graphics burst freq

•Atom E3930 Dual-Core; 6.5W TDP; 1.3 GHz base freq; 1.8 GHz burst freq; up to 2133

MT/s; 400MHz graphics base freq; 550MHz graphics burst freq

•Pentium N4200 Quad-Core; 6W TDP; 1.1 GHz base freq; 2.5 GHz burst freq; up to

2400 MT/s; 200MHz graphics base freq; 750MHz graphics burst freq

•Celeron N3350 Dual-Core; 6W TDP; 1.1 GHz base freq; 2.4 GHz burst freq; up to 2400

MT/s; 200MHz graphics base freq; 650MHz graphics burst freq

Support: Intel VT-x, VT-d, Intel TXT, Intel SSE4.2, Intel 64 Architecture, Intel Turbo Boost

Technology 2.0, Intel AES-NI, and PCLMULQDQ Instruction DRNG

Note: Availability of features may vary between processor SKUs. Only Atom SKUs can

support extreme temperature operating range.

Cache 2MB L2 for all SKUs

Memory Dual channel non-ECC 2133/2400 MHz LPDDR4 memory; up to 8 GB soldered SDRAM

BIOS AMI EFI, 16MB SPI BIOS with CMOS backup

2.2. Expansion Busses

PCI Express 4x PCI Express x1 Gen2 :

Lanes 0/1/2/3, support up to 5 GT/s signal rate

Other •LPC bus

•SMBus (system)

•I2C (user)

14 Specifications

2.3. Video

Integrated on Processor Intel 9

Generation Low Power Graphics core architecture (Intel HD Graphics 500/505)

GPU Feature Support •2 to 3 independent and simultaneous display combinations of DisplayPort, HDMI, LVDS

and eDP

•Encode/transcode HD content

•Playback of high definition content including Blu-ray Disc

•Playback of Blu-ray disc S3D content using HDMI (1.4a spec compliant with 3D)

•DirectX Video Acceleration (DXVA2) support for accelerated video processing

•AVC/VC1/MPEG2/HEVC/VP8/JPEG HW decode

•AVC/MPEG2/HEVC/VP8/JPEG HW encode

•Advanced Scheduler 2.0, 1.0, XPDM support

•DirectX 12, OpenGL 4.3, OpenGL ES 3.0 and OpenCL 2.0

•Multi Display Support: 3 independent displays

Note: Availability of features may vary between processor SKUs.

Display Types •Single/dual channel 18/24-bit LVDS via eDP-to-LVDS chip from DDI2, supporting DE

mode and H/V-Sync mode display. Resolutions up to 1920x1200 with dual channel

LVDS.

•With eDP-to-LVDS chip removed (build option):

eDP (4096x2160@60Hz) at LVDS primary channel pins from DDI2 and DP

(4096x2160@60Hz) at LVDS secondary channel pins from DDI0. Requires compatible

carrier board.

•DisplayPort (4096x2160@60Hz)/HDMI (3840x2160@30Hz) from DDI1

Note: Supports HDMI 1.4b, DP 1.2a and eDP 1.3.

The figure below illustrates the default (LVDS) build configuration and the alternative (e)DP configuration:

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