Dell PowerApp .cache 100 Technisches Handbuch

Dieses Handbuch passt für folgende Modelle

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Inhaltsverzeichnis

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Dell PowerApp .cache 100 Technisches Handbuch

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This document updates information contained in your Dell PowerApp™ system and service

documentation.

If you replace the PowerApp appliance’s system board, you must also restore the system configura-

tion settings using the SMBIOS program on the diskette or CD provided with the new system board.

In addition, this document provides important information for reinstalling the microprocessor and

heat sink on the new system board.

For details on replacing the system board, see “Replacing the System Board” in your Service

Manual.

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To restore the system configuration settings, perform the following steps:

1. Insert the configuration diskette or CD provided with the new system board, and turn on the

computer.

The computer boots from the diskette or CD and prompts you to select the type of system you

are servicing.

2. When prompted, enter the system type and enter the service tag number, which is located on

the back of the computer.

The program notifies you when programming is complete.

3. Remove the diskette or CD and reboot the computer.

4. When the system reboots, press <F2> to enter the system setup program.

5. From the Main Menu, enter the correct time and date in the System Time and System Date

options.

6. Set the Processor Serial Number option to “Disabled.”

7. Press <F10> to save these settings, exit the system setup program, and reboot the system.

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To install the microprocessor and heat sink on the new system board, perform the following steps:

1. Using the cleaning cloth supplied with the new system board, wipe the top of the microproces-

sor die to remove any previous thermal grease.

Once cleaned, the microprocessor die should have a reflective shine.

2. Insert the microprocessor into the ZIF socket on the new system board and lower the lever to

lock it into place.

3. Peel off the protective backing (if present) from the enclosed replacement heat sink to expose

the pad of thermal grease.

4. Place the heat sink on the microprocessor and ensure that the bevel on the heat sink covers the

raised portion of the ZIF socket.

5. Replace the heat sink clip onto the heat sink and secure it on the ZIF socket.

The longest side of the clip should be pointing to the front of the appliance.

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Information in this document is subject to change without notice.

© 2000 Dell Computer Corporation. All rights reserved. Printed in the U.S.A.

Trademarks used in this text: Dell, the DELL logo, and PowerApp are trademarks of Dell Computer Corporation. Other trademarks and

trade names may be used in this document to refer to either the entities claiming the marks and names or their products. Dell Computer

Corporation disclaims any proprietary interest in trademarks and trade names other than its own.