Digi ConnectCore 6 Kurzanleitung

ConnectCore® for i.MX6

Hardware Reference Manual

Revision history—90001394

Revision Date Description

N January 2019 Added backdrive caution.

P May 2019 Added NVCC-MIPI supply range, updated I/O supply

operating range values.

R October 2019 Added vapor-phase caution and ten-zone reflow oven

bullet item, added signal usage limitations by variant and

ALT multiplexing signals.

S May 2020 Added operating temperature statement.

T August 2020 Revised MCA pinout comments, added MCA functionality

note.

Trademarks and copyright

Digi, Digi International, and the Digi logo are trademarks or registered trademarks in the United

States and other countries worldwide. All other trademarks mentioned in this document are the

property of their respective owners.

Disclaimers

Information in this document is subject to change without notice and does not represent a

commitment on the part of Digi International. Digi provides this document “as is,” without warranty of

any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or

merchantability for a particular purpose. Digi may make improvements and/or changes in this manual

or in the product(s) and/or the program(s) described in this manual at any time.

Warranty

To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms

Customer support

Gather support information: Before contacting Digi technical support for help, gather the following

information:

Product name and model

Product serial number (s)

Firmware version

Operating system/browser (if applicable)

Logs (from time of reported issue)

Trace (if possible)

Description of issue

ConnectCore® for i.MX6 Hardware Reference Manual 2

Steps to reproduce

Contact Digi technical support: Digi offers multiple technical support plans and service packages.

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Include the document title and part number (ConnectCore® for i.MX6 Hardware Reference Manual,

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ConnectCore® for i.MX6 Hardware Reference Manual 3

Contents

About the ConnectCore 6

Features and functionality 7

Block diagram 8

Power supply architecture 9

Bootstrap 12

Wireless interfaces 13

WLAN standard 14

Data rates 14

Antenna ports 15

Modulation 17

Security/Interoperability 17

Frequency bands 18

5 GHz HT20 and HT40 channel available 19

Receive sensitivity 20

Transmit power 20

Bluetooth 20

Module variants 20

MCA hardware 21

Supported devices 21

MCA pinout 22

Shared I2C bus 31

Shared SPI bus 32

Modules without eMMC flash 33

Module pinout 34

Signal usage limitations 87

Specifications for the ConnectCore 6

Electrical characteristics 90

Voltage supplies 90

Power consumption 90

Power consumption use cases 90

Global power consumption 91

Mechanical specifications 91

Host PCB footprint 94

Environmental specifications 94

Linux - Android users 95

ConnectCore® for i.MX6 Hardware Reference Manual 4

ConnectCore® for i.MX6 Hardware Reference Manual 5

Assembly instructions

Moisture sensitivity and shelf life 97

Mounting 97

Coplanarity 97

Solder paste print 97

Stencil 97

SMT pick and place 98

SMT process parameter reference 98

Reflow profile 98

Regulatory information and certifications

Maximum power and frequency specifications 101

United States FCC 101

Labeling requirements 101

For WiFi/Bluetooth variant 101

For WiFi only variant 101

FCC notices 102

FCC-approved antennas 102

RF exposure 103

Canada (IC) 104

Labeling requirements 104

Transmitters with detachable antennas 104

Europe ETSI 105

OEM labeling requirements 106

CE labeling requirements 106

Declarations of Conformity 106

Approved antennas 106

Bluetooth SIG-qualified hardware and firmware 106

Japan 108

About the ConnectCore 6

The ConnectCore 6 is an ultra-compact and integrated system-on-module solution based on the NXP

i.MX6 Cortex-A9 processor family.

With processor speeds up to 1.2 GHz and fully interchangeable single-/dual-/quad-core variants, the

ConnectCore 6 offers a truly future-proof platform solution with scalable performance and pre-

certified wireless 802.11a/b/g/n and Bluetooth 4.0, including Bluetooth Low Energy connectivity.

Cloud Connector integration, as part of the Digi Linux and Android software platform support, offers

secure remote management and web services capabilities through Digi Remote Manager. Digi also

offers custom Remote Manager hardware and wireless design services as well as end-to-end

solutions for cloud integration and app development.

Features and functionality 7

Block diagram 8

Power supply architecture 9

Bootstrap 12

Wireless interfaces 13

Module variants 20

MCA hardware 21

Modules without eMMC flash 33

Module pinout 34

Signal usage limitations 87

ConnectCore® for i.MX6 Hardware Reference Manual 6

About the ConnectCore 6 Features and functionality

ConnectCore® for i.MX6 Hardware Reference Manual 7

Note To serve our customers most effectively, Digi International Inc. is consolidating its cloud

services, Digi Device Cloud and Digi Remote Manager®, under the Remote Manager name. This phased

process does not affect device functionality or the functionality of the web services and other

features. However, you will find instances of both Device Cloud and Digi Remote Manager in some

documentation, firmware, and user interfaces.

Features and functionality

The ConnectCore 6 module is based on the i.MX6 processor from NXP. This processor offers a high

number of interfaces. Most of these interfaces are multiplexed and are not available simultaneously.

The module has the following features:

ni.MX6 duallite/dual/quad ARM Cortex-A9 cores operating at speeds up to 1.2 GHz

l32 Kbytes L1 instruction cache

l32 Kbytes L1 data cache

lUp to 1 MB unified instruction/data L2 cache

lNEON MPE (Media Processing Engine) co-processor

nGraphical hardware accelerators:

lIPU (Image Processing Unit)

lOptional VPU (Video Processing Unit)

lOptional 2D/3D GPU (Graphics Processing Unit)

n64-bit DDR3-1066 memory interface with a density up to 2 GBytes

n8-bit eMMC support

nDialog DA9063 power management IC (PMIC)

l6x DC/DC buck converters

l11x LDO regulators

lRTC with rechargeable coin cell battery support

l10-bit ADC channels

lGPIO pins

nOptional IEEE802.11a/b/g/n WLAN interface with spatial diversity support

lSoftAP (Software Access Point) support

nOptional Bluetooth 4.0 dual mode

nOptional Cortex-M0+/Cortex-M4 MCA (Microcontroller Assist) subsystem

nDebug interfaces:

lStandard JTAG controller IEEE 1149.1

lETM/ETB support

nSupport of i.MX6 typical interfaces:

l16/32-bit data/address bus

lSATA II, 3.0 Gbps (24-bit parallel bus, LVDS, HDMI, MIPI/DSI)

lDisplay support

oHDMI

o24-bit parallel bus

About the ConnectCore 6 Block diagram

ConnectCore® for i.MX6 Hardware Reference Manual 8

oDual LVDS

oMIPI/DSI

l2x camera (20-bit parallel bus, MIPI/CSI)

lMMC/SD/SDIO

l1x USB OTG with integrated PHY

l3x USB Host

lPCI Express Gen 2.0 lane

l10/100/1000 M Ethernet MAC

lUART, SPI, I2C, PWM, CAN, I2S and GPIO

nUltra-miniature SMT module (50x50mmx5mm) based on 400-LGA pads

nSecurity accelerators:

lARMTrustZone

lCAAM (Cryptographic Acceleration and Assurance Module)

lSNVS (Secure Non-volatile Storage)

lCSU (Central Security Unit)

lA-HABv4 (Advanced High-assurance Boot)

Block diagram

The figure below shows the block diagram of the NXP i.MX6 application processor.

Not all functions are available on all processor variants.

About the ConnectCore 6 Power supply architecture

ConnectCore® for i.MX6 Hardware Reference Manual 9

Power supply architecture

The ConnectCore 6 provides a primary 5 V power supply input. This supply is the main power domain

to the on-module Dialog DA9063 power management IC (PMIC), which generates all required supply

voltages for the module components as well as the carrier board.

About the ConnectCore 6 Power supply architecture

ConnectCore® for i.MX6 Hardware Reference Manual 10

The module provides support for a backup battery (coin-cell or super cap) powering the real-time

clock (RTC) on the module. In addition, rechargeable backup batteries (ML414, others) are also

supported.

The PMIC generates the following power domains that are available on the module pads:

n3.3 V (VGEN_3V3)

nMoreover, 5x PMIC LDO outputs are also available on the module pads:

lVLDO3

lVLDO4

lVLDO6

lVLDO7

lVLDO8

Power

domain

Regulator

type

Output

accuracy

Maximum

current

Dropout

voltage

(MAX)

Turn on

time

(MAX)

Turn

off

time

(MAX)

Quiescent

current in

OFF mode

(TYP)

3.3 V DC/DC +/-3% 1500 mA - 1 µA 1.2 ms -

Note The maximum current consumption mentioned in the previous table is a combination of the

current consumed by the module (max 500 mA) and by the carrier board for external use (1000 mA).

The table below provides the characteristics of the optional LDO outputs:

Primary

power

supply

input

Input

voltage

Output

voltage

Output

accurac

Default

voltage

Maximu

current

Drop

output

voltage

(MAX)

Quiescen

t current

in OFF

mode

(TYP)

Turn

time

(MAX)

Turn

off

time

(MAX)

VLDO2 +5VDC 0.6-

1.86V

+/-3% 1.8 V 200 mA 150 mV 1 µA 150 µs 1 ms

VLDO3 +5VDC 0.9-

3.44V

+/-3% 3.3 V 200 mA 150 mV 1 µA 300 µs 1 ms

VLDO4 +5VDC 0.9-

3.44V

+/-3% 3.3 V 200 mA 150 mV 1 µA 300 µs 1 ms

VLDO6 +5VDC 0.9-

3.6V

+/-3% 3.3 V 200 mA 150 mV 1 µA 200 µs 1 ms

VLDO8 +5VDC 0.9-

3.6V

+/-3% 3.3 V 200 mA 150 mV 1 µA 300 µs 1 ms

Note For information about using the LDO options, please contact Digi. VLDO3 is used for supplying

MCA processor on the module.

The power management IC located on the module is responsible for generating all required i.MX6

processor supply voltages. The following i.MX6x supplies are available on the module pads:

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