Digi ConnectCore 93 Kurzanleitung

ConnectCore 93

System-on-Module

Hardware Reference Manual

Revision history—90002549

Revision Date Description

1P May 2023 Early draft.

2P May 2023 Initial release.

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Disclaimers

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merchantability for a particular purpose. Digi may make improvements and/or changes in this manual

or in the product(s) and/or the program(s) described in this manual at any time.

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To view product warranty information, go to the following website:

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Gather support information: Before contacting Digi technical support for help, gather the following

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Product serial number (s)

Firmware version

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Contact Digi technical support: Digi offers multiple technical support plans and service packages.

ConnectCore 93 System-on-Module 2

ConnectCore 93 System-on-Module 3

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Contents

About the ConnectCore 93 SOM

Features and functionality 5

Safety instructions 7

Block diagrams 8

ConnectCore 93 module 9

i.MX 93 application processor 10

Power interfaces 11

Reference power diagram 11

System-on-module power architecture 12

Electrical characteristics 12

Bootstrap 15

Wireless interfaces 17

WLAN IEEE 802.11a/b/g/n/ac/ax 17

RF channels 21

Transmit power 24

Antenna ports 25

Bluetooth 25

Module pinout

External signals and pin multiplexing 27

Castellated pad signals and multiplexing 28

LGA signals and multiplexing 42

Module specifications

Mechanical specifications 69

Host PCB footprint and cutout 69

Label 69

Weight 69

Environmental specifications 70

ConnectCore 93 System-on-Module 4

About the ConnectCore 93 SOM Features and functionality

ConnectCore 93 System-on-Module 5

About the ConnectCore 93 SOM

The Digi ConnectCore® 93 System-on-Module (SOM) platform is a highly integrated, cost-effective,

connected, secure embedded solution, built on the i.MX 93 MPU family. It integrates memory, power

management, pre-certified wireless connectivity, and advanced Digi TrustFence device security with a

complete, open-source Linux software platform based on the Yocto Project.

Note While the ConnectCore 93 system-on-module is designed to be used in a production

environment, the ConnectCore 93 Development Kit is designed only for development and testing in a

pre-production environment.

Features and functionality

The ConnectCore 93 system-on-module is based on thei.MX 93 processor from NXP. This processor

offers a number of interfaces, most of them multiplexed and not available simultaneously. The

module has the following features:

nSingle/Dual Cortex-A55 MPCore platform:

lFrequency operating at up to 1.7 GHz.

l32 KB L1 instruction cache.

l32 KB L1 data cache.

l64 KB per-core L2 cache.

lMedia Processing Engine (MPE) with ARM NEON technology supporting the Advanced

Single Instruction Multiple Data architecture.

lFloating Point Unit (FPU) with support of the Arm VFPv4-D16 architecture.

lSupport of 64-bit Arm v8.2-A architecture.

l256 KB cluster L3 cache.

lParity/ECC protection on L1 cache, L2 cache, and TLB RAMs.

lBoot ROM (256 KB).

lOn-chip RAM (640 KB).

lSecurity:

oTrusted resource domain controller (TRDC).

oARM TrustZone (TZ) architecture, including both Trustzone-A and Trustzone-M.

oOn-chip RAM (OCRAM) secure region protection using OCRAM controller.

oEdgeLock secure enclave.

oBattery backed security module (BBSM):

oSecure non-volatile storage (SNVS).

oSecure real-time clock (RTC).

nCortex-M33 core platform:

lFrequency operating up to 250 MHz.

lSupport FPU, MPU, NVIC, FPB, DWT and ITM.

About the ConnectCore 93 SOM Features and functionality

ConnectCore 93 System-on-Module 6

lTwo-way set-associative 16 KB system cache with parity support.

lTwo-way set-associative 16 KB code cache with parity support.

lBoot ROM (256 KB).

nNeural processing unit (NPU):

lNPU targets 8-bit and 16-bit integer RNN.

lHandles 8-bit weights.

nSystem debug:

lArm CoreSight debug and trace technology.

lEmbedded trace FIFO (ETF) with 4 KB internal storage to provide trace buffering.

lUnified trace capability for dual core Cortex-A55 and Cortex-M33.

lCross Triggering Interface (CTI).

l5-pin JTAG.

nImage sensor interface (ISI):

lStandard pixel formats commonly used in many camera input protocols.

lProgrammable resolutions up to 2K.

lImage processing for:

oSupports one source of up to 2K horizontal resolution.

oSupports pixel rate up to 200 Mpixel/s.

lImage down scaling via decimation and bi-phase filtering.

lColor space conversion.

lInterlaced to progressive conversions.

nConnectivity:

lx2 USB 2.0 controllers and PHYs interfaces.

lx2 CAN/CAN-FD.

lx2 I3C.

lx2 32-pin FlexIO modules.

lx3 uSDHC.

lx2 Ethernet controllers:

ox1 Gigabit Ethernet controller with support for Energy Efficient Ethernet (EEE), Ethernet

AVB and IEEE 1588.

ox1 Gigabit Ethernet controller with support for TSN in addition to EEE, Ethernet AVB and

IEEE 1588.

lx8 LPSPI.

lx8 I2C.

lx8 LPUART.

nMultimedia:

lLCDIF display controller, which can drive any of three displays:

oMIPI DSI: up to 1920x1200p60.

oLVDS Tx: up to 1366x768p60 or 1280x800p60.

oParallel display: up to 1366x768p60 or 1280x800p60.

About the ConnectCore 93 SOM Safety instructions

ConnectCore 93 System-on-Module 7

l2-lane MIPI CSI-2 interface:

oCompliant with MIPI CSI-2 specification v1.2 and MIPI D-PHY specification v1.2.

oSupport up to 2 Rx data lanes (plus 1 Rx clock lane).

oSupport 80 Mbps - 1.5 Gbps per lane data rate in high speed operation.

oSupport 10 Mbps data rate in low power operation.

l4-lane MIPI DSI display with data supplied by the LCDIF:

oCompliant with MPI DSI specification v1.2 and MIPI D-PHY specification v1.2.

oCapable of resolutions achievable with a 200 MHz pixel clock and active pixel rate of 140

Mpixel/s with 24-bit RGB.

oSupport 80 Mbps - 1.5 Gbps data rate per lane in high speed operation.

oSupport 10 Mbps data rate in low power operation.

lAudio:

ox3 SAI interfaces:

oSAI1 supports 2-lane and SAI3 supports 1 lane.

oSAI2 supports 4 lanes.

oSAI2 and SAI3 support glue-less switching between PCM and stereo DSD operation.

ox1 SPDIF.

o24-bit PDM supports up to 8-microphones (4 lanes).

nUp to 1 GB, 16-bit LPDDR4 memory.

nUp to 8 GB, 8-bit eMMC memory.

nNXP PCA9451 Power Management IC (PMIC):

lx6 Step down regulators.

lx5 Linear regulators.

lx1 Load switch.

nIEEE 802.11 a/b/g/n/ac/ax WLAN interface.

nBluetooth version 5.2.

Safety instructions

nThe ConnectCore 93 SOM cannot be guaranteed operation due to the radio link and so should

not be used for interlocks in safety critical devices such as machines or automotive

applications.

nThe ConnectCore 93 SOM has not been approved for use in (this list is not exhaustive):

lnuclear applications

lexplosive or flammable atmospheres

nThere are no user serviceable components inside the ConnectCore 93 SOM. Do not modify the

ConnectCore 93 in any way. Modifications may exclude the SOM from any warranty and can

cause the ConnectCore 93 to operate outside of regulatory compliance for a given country,

leading to the possible illegal operation of the radio.

nUse industry standard ESD protection when handling the ConnectCore 93 SOM.

nTake care while handling to avoid electrical damage to the PCB and components.

About the ConnectCore 93 SOM Block diagrams

ConnectCore 93 System-on-Module 8

nDo not expose ConnectCore 93 SOM to water or moisture.

nUse this product with the antennas specified in the ConnectCore 93 SOM user guides.

nThe end user must be told how to remove power from the ConnectCore 93 SOM or to locate

the antennas 20 cm from humans or animals.

Block diagrams

The figures below show block diagrams of the ConnectCore 93 module and of the NXP i.MX 93

application processor.

About the ConnectCore 93 SOM Block diagrams

ConnectCore 93 System-on-Module 9

ConnectCore 93 module

About the ConnectCore 93 SOM Block diagrams

ConnectCore 93 System-on-Module 10

i.MX 93 application processor

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