Fibocom L850-GL Montageanleitung

FIBOCOM L850-GL Series

Hardware Guide

Version: V1.1.5

Date: 2020-06-20

FIBOCOM L850-GL Series Hardware Guide Page 2 of 59

Applicability Type

No. Product Model Description

1 L850-GL-00 NA

2 L850-GL-01 NA

3 L850-GL-02 NA

4 L850-GL-03 NA

5 L850-GL-05 NA

6 L850-GL-10 L850-GL-10 series (except L850-GL-10-06)

7 L850-GL-10-06 NA

8 L850-GL-12 NA

9 L850-GL-20 NA

FIBOCOM L850-GL Series Hardware Guide Page 3 of 59

Without the prior written permission of the copyright holder, any company or individual is prohibited to

excerpt, copy any part of or the entire document, or distribute the document in any form.

Notice

The document is subject to update from time to time owing to the product version upgrade or other reasons.

Unless otherwise specified, the document only serves as the user guide. All the statements, information

and suggestions contained in the document do not constitute any explicit or implicit guarantee.

Trademark

The trademark is registered and owned by Fibocom Wireless Inc.

FIBOCOM L850-GL Series Hardware Guide Page 4 of 59

Change History

Version Author Date Remark

V1.1.5 Shu Ying 2020-06-20

● Section 3.3.1, add FCPO# controlling GPIO request

● Section 3.4.1.2, change PEWAKE# pull high resistor to

100KΩ

V1.1.4 Li Senhao 2020-04-01 ● Section 3.1.2, add GPIO design request

● Section 3.3.4, add CLKREQ# and PEWAKE# requests

V1.1.3 Guan Xiangyang 2019-12-26

● Section 3.3.1.2, add minimum PCIe detection time

note

● Section 3.3.5, add timing application instruction

● Section 3.4.1.2, add a pull-up resistor on CLKREQ#

● Section 3.9, add note about the direction of MIPI signal

● Section 4.1.4, add RF connector assembly

● Section 4.5, update GNSS performance table

V1.1.2 Guan Xiangyang 2019-09-06 Add L850-GL-20 product model

V1.1.1 Guan Xiangyang 2019-08-22

● Add L850-GL-10-06 and L850-GL-20 part numbers

● Section 2.2, list supporting RF bands of all product

● Section 3.4, add Chrome OS support in USB interface

● Section 3.3, add note of PERST# control timing in USB

● Section 4.3, modify LTE Band5 TX power range

V1.1.0 Lei Daijun 2019-05-05

● Section 3.2.3, update power consumption

● Section 3.3, update module control timing

● Section 4.5, update GNSS consumption

● Section 3.3.4.1, add D0 L1.2 timing

● Section 3.9, modify MIPI-RFFE power domain

● Section 5.6, update packing

● Section 3.4.1.2, fix Figure 3-12 abnormal display in

PDF converting

V1.0.9 Lei Daijun 2018-08-06 Add L850-GL-12 part no

V1.0.8 Lei Daijun 2018-07-13 Modify band 30 TX power range of L850-GL-03 serial

module

V1.0.7 Lei Daijun 2018-06-26

● Update package

● Add note about PERST#/CLK_REQ# 3.3V support

● Add antenna of B30 requirement, update power

consumption and RX sensitivity

V1.0.6 Lei Daijun 2018-02-26 ● Modify COEX pin define

● Delete L850-GL-02 product model

FIBOCOM L850-GL Series Hardware Guide Page 5 of 59

Version Author Date Remark

V1.0.5 Lei Daijun 2018-01-16

● Modify CA combinations and TDD data throughput

● Modify description of power consumption condition

● Optimize power on/off/reset timing

V1.0.4 Lei Daijun 2017-12-06 Update Storage and packing and PCIe signal

description, power consumption, CA combine

V1.0.3 Lei Daijun 2017-07-26

● Update timing of power on/off and reset

● Update PCIe, add USB support

● Update power consumption, TX power, RX sensitivity

and other data

V1.0.2 Lei Daijun 2017-02-09 ● Update the content of PCIe

● Add the power Consumption of 3CA

V1.0.1 Lei Daijun 2016-12-16 ● Modify the PCIe Interface Application;

● Update the Pin Definition: change pin65 to NC

V1.0.0 Lei Daijun 2016-12-08 Initial version

FIBOCOM L850-GL Series Hardware Guide Page 6 of 59

Contents

1Foreword ........................................................................................................................9

1.1 Introduction..................................................................................................................... 9

1.2 Reference Standard ....................................................................................................... 9

1.3 Related Documents........................................................................................................ 9

2Overview ......................................................................................................................10

2.1 Introduction................................................................................................................... 10

2.2 Specification ................................................................................................................. 10

2.3 CA Combinations.......................................................................................................... 12

2.4 Application Framework................................................................................................. 13

2.5 Hardware Block Diagram ............................................................................................. 14

3Application Interface...................................................................................................15

3.1 M.2 Interface ................................................................................................................ 15

3.1.1 Pin Map........................................................................................................................15

3.1.2 Pin Definition................................................................................................................16

3.2 Power Supply ............................................................................................................... 20

3.2.1 Power Supply...............................................................................................................20

3.2.2 Logic Level...................................................................................................................22

3.2.3 Power Consumption ....................................................................................................22

3.3 Control Signal............................................................................................................... 25

3.3.1 Module Start-Up...........................................................................................................25

3.3.1.1 Start-up Circuit ............................................................................................................................ 25

3.3.1.2 Start-up Timing Sequence........................................................................................................... 26

3.3.2 Module Shutdown ........................................................................................................27

3.3.3 Module Reset...............................................................................................................28

3.3.4 PCIe Link State............................................................................................................29

3.3.4.1 D0 L1.2........................................................................................................................................ 30

3.3.4.2 D3cold L2 ...................................................................................................................................... 30

3.3.5 Timing Application........................................................................................................32

3.4 IPC Interface ................................................................................................................ 32

3.4.1 PCIe Interface..............................................................................................................33

3.4.1.1 PCIe Interface Definition ............................................................................................................. 33

3.4.1.2 PCIe Interface Application ........................................................................................................... 34

3.4.2 USB Interface ..............................................................................................................35

FIBOCOM L850-GL Series Hardware Guide Page 7 of 59

3.4.2.1 USB Interface Definition .............................................................................................................. 36

3.4.2.2 USB2.0 Interface Application....................................................................................................... 36

3.4.2.3 USB3.0 Interface Application....................................................................................................... 36

3.5 USIM Interface ............................................................................................................. 37

3.5.1 USIM Pins....................................................................................................................37

3.5.2 USIM Interface Circuit..................................................................................................38

3.5.2.1 N.C. SIM Card Slot...................................................................................................................... 38

3.5.2.2 N.O. SIM Card Slot...................................................................................................................... 38

3.5.3 USIM Hot-Plug.............................................................................................................39

3.5.4 USIM Design................................................................................................................39

3.6 Status Indicator ............................................................................................................ 40

3.6.1 LED#1 Signal...............................................................................................................40

3.7 Interrupt Control ........................................................................................................... 41

3.7.1 W_DISABLE1# ............................................................................................................41

3.7.2 BODYSAR ...................................................................................................................41

3.8 Clock Interface ............................................................................................................. 41

3.9 ANT Tunable Interface ................................................................................................. 42

3.10 Configuration Interface ................................................................................................. 42

4Radio Frequency .........................................................................................................44

4.1 RF Interface.................................................................................................................. 44

4.1.1 RF Interface Functionality ............................................................................................44

4.1.2 RF Connector Characteristic........................................................................................44

4.1.3 RF Connector Dimension.............................................................................................44

4.1.4 RF Connector Assembly ..............................................................................................46

4.2 Operating Band ............................................................................................................ 48

4.3 Transmitting Power ...................................................................................................... 49

4.4 Receiver Sensitivity ...................................................................................................... 50

4.5 GNSS ........................................................................................................................... 51

4.6 Antenna Design............................................................................................................ 52

5Structure Specification ...............................................................................................54

5.1 Product Appearance..................................................................................................... 54

5.2 Dimension of Structure................................................................................................. 54

5.3 M.2 Interface Model...................................................................................................... 55

5.4 M.2 Connector.............................................................................................................. 55

FIBOCOM L850-GL Series Hardware Guide Page 8 of 59

5.5 Storage......................................................................................................................... 56

5.5.1 Storage Life .................................................................................................................56

5.6 Packing......................................................................................................................... 56

5.6.1 Tray Package...............................................................................................................56

5.6.2 Tray Size......................................................................................................................59

FIBOCOM L850-GL Series Hardware Guide Page 9 of 59

1 Foreword

1.1 Introduction

The document describes the electrical characteristics, RF performance, dimensions and application

environment, etc. of L850-GL (hereinafter referred to as L850). With the assistance of the document and

other instructions, the developers can quickly understand the hardware functions of L850 modules and

develop products.

1.2 Reference Standard

The design of the product complies with the following standards:

3GPP TS 34.121-1 V8.11.0: User Equipment (UE) conformance specification; Radio transmission

and reception (FDD); Part 1: Conformance specification

3GPP TS 34.122 V11.13.0: Technical Specification Group Radio Access Network; Radio

transmission and reception (TDD)

3GPP TS 36.521-1 V11.4.0: User Equipment (UE) conformance specification; Radio transmission

and reception; Part 1: Conformance testing

3GPP TS 21.111 V10.0.0: USIM and IC card requirements

3GPP TS 51.011 V4.15.0: Specification of the Subscriber Identity Module -Mobile Equipment (SIM-

ME) interface

3GPP TS 31.102 V10.11.0: Characteristics of the Universal Subscriber Identity Module (USIM)

application

3GPP TS 31.11 V10.16.0: Universal Subscriber Identity Module (USIM) Application Toolkit(USAT)

3GPP TS 36.124 V10.3.0: Electro Magnetic Compatibility (EMC) requirements for mobile terminals

and ancillary equipment

3GPP TS 27.007 V10.0.8: AT command set for User Equipment (UE)

3GPP TS 27.005 V10.0.1: Use of Data Terminal Equipment - Data Circuit terminating Equipment

(DTE - DCE) interface for Short Message Service (SMS) and Cell Broadcast Service (CBS)

PCI Express M.2 Specification Rev1.2

1.3 Related Documents

FIBOCOM Design Guide_RF Antenna

FIBOCOM L850-GL Series Hardware Guide Page 10 of 59

2 Overview

2.1 Introduction

L850 is a highly integrated 4G WWAN module which uses M.2 form factor interface. It supports LTE

FDD/LTE TDD/WCDMA systems and can be applied to most cellular networks of mobile carrier in the

world.

2.2 Specification

Specification

Operating Band

L850-GL-00, L850-GL-01,

L850-GL-02, L850-GL-03,

L850-GL-05, L850-GL-10

series (except L850-GL-

10-06)

L850-GL-12

L850-GL-20

LTE FDD: Band 1, 2, 3, 4, 5, 7, 8, 11, 12, 13, 17, 18,

19, 20, 21, 26, 28, 29, 30, 66

LTE TDD: Band 38, 39, 40, 41

WCDMA/HSPA+: Band 1, 2, 4, 5, 8

L850-GL-10-06

LTE FDD: Band 2, 4, 5, 13

GNSS

Support GPS, GLONASS, BDS

LTE

3GPP Release 11

UMTS

3GPP Release 8

Data Transmission

LTE FDD 450Mbps DL(Cat 9)/50Mbps UL(Cat 4)

LTE TDD

347Mbps DL(Cat 9)/30Mbps UL(Cat 4)

When LTE TDD achieves maximum DL rate, its UL

rate can reach 10Mbps only

UMTS/HSPA+

UMTS: 384 kbps DL/384 kbps UL

DC-HSPA+: 42Mbps DL(Cat 24)/5.76Mbps UL(Cat6)

Power Supply DC 3.135V~4.4V, Typical 3.3V

Temperature

Normal operating temperature: -10°C~+55°C

Extended operating temperature: -20°C~+65°C

Storage temperature: -40°C~+85°C

Physical

characteristics

Interface: M.2 Key-B

Dimension：30×42×2.3mm

Weight: About 6.2 g

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