Fujitsu F2MC-8FX MB2146-222 Bedienungsanleitung

FUJITSU SEMICONDUCTOR

SUPPORT SYSTEM SS01-26019-1E

F2MC-8FX Family

LQFP-64P (0.5 mm pitch) HEADER BOARD

MB2146-222

OPERATION MANUAL

PREFACE

Thank you for purchasing the LQFP-64P (0.5 mm pitch) *1header board (model number : MB2146-

222) for the F2MC *2-8FX family.

MB2146-222 is a header board used to connect the MCU board (model number : MB2146-301,

MB2146-303) which mounts the F2MC-8FX family evaluation MCU to a user system.

This manual explains the handling of the MB2146-222. Before using MB2146-222, be sure to read

this manual.

Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass-pro-

duced MCUs and evaluation MCUs which correspond on MB2146-222.

MB2146-222 is an object about MCU with a built-in LCD controller.

*1 : The lead pitch of package (FPT-64P-M24) is 0.5 mm and the body size is 10 mm ×10 mm.

*2 : F2MC is the abbreviation of FUJITSU Flexible Microcontroller.

■Caution of the products described in this document

The following precautions apply to the product described in this manual.

CAUTION The wrong use of a device will give an injury and may cause malfunction on cus-

tomers system.

Cuts This product has parts with sharp points that are exposed.

Do not touch an edge of the product with your bare hands.

Damage

When connecting the header board to the user system, correctly position the index

mark (▲) on the NQPACK mounted on the user system with the 1 pin direction(1)

on the header board, otherwise the MCU board and user system might be dam-

aged.

Damage When mounting a mass production MCU, correctly position pin 1, otherwise the

mass production MCU and user system might be damaged.

•The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales representatives before ordering.

•The information, such as descriptions of function and application circuit examples, in this document are presented sole-

ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU

does not warrant proper operation of the device with respect to use based on such information. When you develop

equipment incorporating the device based on such information, you must assume any responsibility arising out of such

use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-

mation.

•Any information in this document, including descriptions of function and schematic diagrams, shall not be construed

as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right

of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property

right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual

property rights or other rights of third parties which would result from the use of information contained herein.

•The products described in this document are designed, developed and manufactured as contemplated for general use,

including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not

designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless

extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal

injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air

traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)

for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).

Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in

connection with above-mentioned uses of the products.

•Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from

such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-

tection, and prevention of over-current levels and other abnormal operating conditions.

•If any products described in this document represent goods or technologies subject to certain restrictions on export un-

der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be

required for export of those products from Japan.

1. Product Outline

■Product outline

MB2146-222 is a header board (referred to as header board) used to connect the MCU board (model

number : MB2146-301, MB2146-303) which mounts an evaluation MCU in the F2MC-8FX family

of Fujitsu 8-bit microcontrollers to a user system. To build an F2MC-8FX evaluation environment,

combine the three products as shown in Figure 1: the header board, a MCU board, and a BGM adapt-

er (model number : MB2146-09).

Figure 1 System Configuration

■Product configuration

Table 1 lists the product configuration in the header board, and Table 2 lists options.

Table 1 Product Cofiguration

Table 2 Options

* : Multiple types of evaluation MCUs are available depending on their applications. Purchase the one that satisfies

the service conditions.

Name Description Remarks

F2MC-8FX

LQFP-64P (0.5 mm pitch)

header board

[Model number : MB2146-222]

Connector/LQFP64pin

(0.5 mm pitch) Package conversion -

[Model number : YQPACK064SD]

(Tokyo Eletech Corporation) I/F between header board and NQPACK Accessory (connected)

[Model number : NQPACK064SD]

(Tokyo Eletech Corporation) For mounted on user system Accessory

[Model number : HQPACK064SD]

(Tokyo Eletech Corporation)

Used when mounting mass production MCU

to NQPACK. Accessory

Name Description Remarks

BGM adapter

[Model number : MB2146-09] ICE unit for F2MC-8FX -

MCU board

[Model number : MB2146-301, MB2146-303]

Built-in MB95FV100B-101,

MB95FV100B-103 Built-in F2MC-8FX evaluation MCU *

㪤㪙㪉㪈㪋㪍㪄㪇㪐

MCU board

BGM adapter

Header board

2. Checking the Delivered Product

Before using the MB2146-222, confirm that the following components are included

in the box:

•LQFP-64P (0.5 mm pitch) header board *1: 1

•Screws for securing header board (M2 ×10 mm, 0.4 mm pitch) : 4

•NQPACK064SD *2: 1

•HQPACK064SD *3: 1

•Operation manual (English version, this manual) : 1

*1 : Header board manufactured by Tokyo Eletech Corporation, referred to as “YQPACK”, mounts

YQPACK064SD.

*2 : IC socket manufactured by Tokyo Eletech Coporation, referred to as “NQPACK”, is supplied

with a special screwdriver and 2 guide pins. A socket offering higher reliability,

NQPACK064SD-SL (manufactured by Tokyo Eletech Corporation and sold separately) , can

be used by making an IC socket mounting hole on the user system board. For more information,

contact Tokyo Eletech Corporation.

*3 : IC socket cover manufactured by Tokyo Eletech Corporation, referred to as “HQPACK”, is

supplied with 4 screws for securing HQPACK (M2 ×6 mm, 0.4 mm pitch) .

3. Handling Precautions

The header board is precision-manufactured to improve the dimensional accuracy and to ensure a

reliable contact. The header board is therefore sensitive to mechanical shocks. To ensure a correct

use of the header board in the proper environment, observe the following:

•Avoid placing a stress on the NQPACK mounted on the user system board when connecting

the header board.

4. Notes on Designing

■Notes on designing printed circuit board for the user system

When the header board is connected to the user system, some part mounted around the NQPACK in

the user system may be contacting the header board if the height of the part is tall. To prevent this,

design the printed circuit board for the user system so that the components do not exceed the height

shown in Figure 2. Figure 2 shows the dimension figure of the header board.

Figure 2 Header Board Dimensions

㪈

㪉

㪈㪈㪐

㪈㪉㪇

㪚㪥㪉

㪈

㪉

㪈㪈㪐

㪈㪉㪇

㪚㪥㪈

㪚㪥㪊

㪬㪈

40.0 mm

30.0 mm

40.0 mm

Approximately

13.0 mm *1

NQPACK064SD

:Tokyo Eletech Corporation

YQPACK064SD

:Tokyo Eletech Corporation

WR-120SB-VF-N1 : JAE *2

PCW-1-1-1PW

:MAC EIGHT

WR-120SB-VF-N1 : JAE *2

U1: User system I/F connector

CN3: Incorrect insertion prevention socket

CN1/CN2: MCU board I/F connector

*1 : The height differs slightly depending on how the YQPACK and NQPACK are engaged.

*2 : Japan Aviation Electronics Industry, Limited

■MCU footprint design notes

Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed cir-

cuit board for the user system. Take the footprint in Figure 3 into consideration as well as the foot-

print of the mass production MCU when designing the printed circuit board for the user system.

To follow the most updated information, be sure to contact Tokyo Eletech Corporation whenever de-

signing the printed circuit board.

Figure 3 Recommended Footprint Dimensions for Mounting the NQPACK

14.0 mm

2.0 mm

0.5 mm 0.25 mm

10.0 mm

No.1 Pin

5. Connecting to the User System

■Connecting

Mount the supplied NQPACK on the user system before using the MB2146-222.

1. To connect the header board to the user system, match pin 1 indicated by the index mark (▲) on

the NQPACK mounted on the user system with pin 1 indicated by the index mark (an angle cut

linearly at one place only in silk screen) on the header board and then insert it (see “Figure 4”) .

The pins of YQPACK are thin and easy to bend. Insert NQPACK after confirming that the pins

of YQPACK are not bent.

Figure 4 Index Position

2. Insert each screw for securing the header board into each of the four tapped holes on the header

board, and then tighten the screws diagonally. The center screw hole is not used. To tighten the

screws, use the special screwdriver supplied with the NQPACK to equally tighten the four screws

in sequence. Tightening the screws too tight might result in a defective contact.

3. Connect the MCU board to the header board while being careful not to excessively force the NQ-

PACK. The MCU board can be connected to the header board only in the correct orientation as

they have an incorrect insertion prevention header socket to prevent a reverse connection. Figure

5 illustrates how the MCU board, header board, NQPACK, and user system are connected togeth-

er.

64 49

NQPACK index mark

Header board index mark

Figure 5 Connecting MCU Board/Header Board to User System

■Disconnection

1. Remove the MCU board from the header board. Detach the four corners slowly in sequence, not

excessively forcing the junction with the NQPACK.

2. Remove all of the four screws from the header board. Pull out the header board vertically from

the NQPACK. Remove the header board slowly not excessively forcing the junction with the

NQPACK.

YQPACK

Header board

User system

NQPACK

MCU board

Connected

at shipment

Screws for securing

header board

Evaluation

MCU

6. Mounting Mass Production MCUs

■Mounting

To mount a mass production MCU on the user system, use the supplied HQPACK (IC socket cover)

(see “Figure 6”) .

1. To mount a mass production MCU on the user system, match the index mark (▲) on the NQ-

PACK mounted on the user system with the index mark (●) on the mass production MCU.

2. Confirm that the mass production MCU is correctly mounted on the NQPACK. Next, match the

index mark of HQPACK with the index mark of NQPACK and insert it (angle cut linearly at one

place only) .

The pins of HQPACK are thin and easy to bend. Insert NQPACK after confirming that pins of

HQPACK are not bent.

3. Insert each screw for securing HQPACK in each of four tapped holes on the HQPACK, and then

tighten the screws diagonally. To tighten the screws, use the special screwdriver supplied with

the NQPACK to finally tighten the four screws in sequence. Tightening the screws too tight

might result in a defective contact.

Figure 6 Mounting a Mass Production MCU

■Disconnection

To remove the HQPACK, remove all of the four screws and pull out the HQPACK vertically from

the NQPACK. When taking out the mass production MCU, absorb the mass production MCU using

a vacuum pick-up tool special for removing IC. Do not attempt to remove the mass production MCU

forcibly, for example, using a screwdriver to do so can bend the pins of the mass production MCU

or break the NQPACK.

Screws for securing HQPACK

HQPACK

Mass production MCU

NQPACK

User system

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