Fujitsu LQFP-64P Bedienungsanleitung

FUJITSU SEMICONDUCTOR

SUPPORT SYSTEM SS01-71060-1E

DSU-FR EMULATOR

LQFP-64P HEADER TYPE 2

MB2198-304

OPERATION MANUAL

PREFACE

Thank you for purchasing the LQFP-64P*1header type 2 (MB2198-304) for the DSU-FR emulator.

This product is used together with the BGA-660P adapter for the DSU-FR emulator (MB2198-

300)*2to connect the DSU-FR emulator (MB2198-01)*3and DSU-FR cable (MB2198-10)*4to a

user system that uses a MB91460 series Fujitsu FR*4microcontroller (LQFP-64P)*5.

This manual describes how to use the LQFP-64P header type 2 for the DSU-FR emulator. Please read

the manual carefully before using. Please contact your Fujitsu sales or support representative for de-

tails on which production and evaluation MCU models can be used with this product.

*1 : The lead pitch of package (FPT-64P-M23) is 0.65mm and the body size is 14mm ×14mm.

*2 : Referred to as the “adapter”

*3 : Referred to as the “emulator”

*4 : Referred to as the “DSU cable”

*5 : FR is an abbreviation of FUJITSU RISC CONTROLLER and is a product of Fujitsu Limited.

■Handling and usage

The handling and use of this product and notes regarding safety use are included in the hardware

manual of the DSU-FR family emulator.

Follow the instructions in for the use of this product.

•DSU-FR EMULATOR MB2198-01 HARDWARE MANUAL

•DSU-FR EMULATOR DSU-FR CABLE MB2198-10 OPERATION MANUAL

•DSU-FR EMULATOR BGA-660P ADAPTER MB2198-300 OPERATION MANUAL

■Caution of the products described in this manual

The following precautions apply to the product described in this manual.

CAUTION The wrong use of a device will give an injury and may cause malfunction on cus-

tomers system.

Cuts This product has parts with sharp points that are exposed. Do not touch edge of

the product with your bare hands. There is a possibility that it may be injured.

Damage

When connect the header board to the user system, correctly position the index

mark (▲) on the NQPACK mounted on the user system with the index mark (▲)

on the header board, otherwise the emulator system and user system might be

damaged.

Damage When mounting a mass production MCU, correctly position pin 1, otherwise the

mass production MCU and user system might be damaged.

•The contents of this document are subject to change without notice.

Customers are advised to consult with FUJITSU sales representatives before ordering.

•The information, such as descriptions of function and application circuit examples, in this document are presented sole-

ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device; FUJITSU

does not warrant proper operation of the device with respect to use based on such information. When you develop

equipment incorporating the device based on such information, you must assume any responsibility arising out of such

use of the information. FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor-

mation.

•Any information in this document, including descriptions of function and schematic diagrams, shall not be construed

as license of the use or exercise of any intellectual property right, such as patent right or copyright, or any other right

of FUJITSU or any third party or does FUJITSU warrant non-infringement of any third-party’s intellectual property

right or other right by using such information. FUJITSU assumes no liability for any infringement of the intellectual

property rights or other rights of third parties which would result from the use of information contained herein.

•The products described in this document are designed, developed and manufactured as contemplated for general use,

including without limitation, ordinary industrial use, general office use, personal use, and household use, but are not

designed, developed and manufactured as contemplated (1) for use accompanying fatal risks or dangers that, unless

extremely high safety is secured, could have a serious effect to the public, and could lead directly to death, personal

injury, severe physical damage or other loss (i.e., nuclear reaction control in nuclear facility, aircraft flight control, air

traffic control, mass transport control, medical life support system, missile launch control in weapon system), or (2)

for use requiring extremely high reliability (i.e., submersible repeater and artificial satellite).

Please note that FUJITSU will not be liable against you and/or any third party for any claims or damages arising in

connection with above-mentioned uses of the products.

•Any semiconductor devices have an inherent chance of failure. You must protect against injury, damage or loss from

such failures by incorporating safety design measures into your facility and equipment such as redundancy, fire pro-

tection, and prevention of over-current levels and other abnormal operating conditions.

•If any products described in this document represent goods or technologies subject to certain restrictions on export un-

der the Foreign Exchange and Foreign Trade Law of Japan, the prior authorization by Japanese government will be

required for export of those products from Japan.

1. Checking the Delivered Product

Before using the MB2198-304, confirm that the following components are included in the box:

•LQFP-64P header board*1: 1

•Screws for securing the header board (M2 ×10mm, 0.4mm pitch) : 4

•Washers : 4

•NQPACK064SB*2: 1

•HQPACK064SB140*3: 1

•Operation manual (Japanese version) : 1

•Operation manual (English version, this manual) : 1

*1 : The YQPACK064SB is mounted on the header board (Tokyo Eletech Corporation, referred to

as the “YQPACK”).

*2 : The IC socket (manufactured by Tokyo Eletech Corporation, referred to as “NQPACK”). This

socket is supplied with a special screwdriver and 2 guide pins. Additionally, the relatively high

reliability NQPACK064SB-SL (Tokyo Eletech Corporation, sold separately) can be used by

preparing screw holes on the user system board for mounting the socket. For more information,

contact Tokyo Eletech Corporation.

*3 : The IC socket cover (manufactured by Tokyo Eletech Corporation, and referred to as “HQ-

PACK”). This cover includes 4 screws for securing HQPACK (M2 ×6mm, 0.4mm pitch).

This product is used as an emulator system by combining with an optional emulator, DSU cable and

adapter.

Consult a sales or support representative from Fujitsu Limited for details on the adapter and emulator

for this product.

2. Handling Precautions

■Handling precautions

The header board is precision-manufactured to improve dimensional accuracy and to ensure reliable

contact. The header is therefore sensitive to mechanical shock. To ensure correct use of the header

in the proper environment, observe the following points regarding its insertion and removal:

•To avoid placing stress on the NQPACK mounted on the user system during connecting the

header board.

■Precautions when operating on the sub clock

When using this product, the evaluation MCU cannot be supplied with a sub clock from the user sys-

tem.

When the evaluation MCU is operating using the sub clock, use the sub clock on the adapter.

Refer to the operation manual for the adapter for more details.

3. Notes on Designing

■Notes on designing the printed circuit board for the user system

If the header board is connected to a user system, the heights of parts mounted around the

header board are restricted.

When designing the printed circuit board of the user system, consider the heights of components

within the range of the header board, as shown in Figure 1, so that the components mounted on the

user system do not interfere with the header board.

Figure 1 Header board dimensions

* : The height differs slightly depending on how the sockets are engaged.

88.0mm

52.0mm

42.0mm

10.0mm

Approx.

13.0mm*

150.0mm

23.0mm

Approx.

17.0mm*

Header

User

system

Insulating plate

Adapter

1.6mm

NQPACK064SB

■MCU footprint design notes

Figure 2 shows the recommended dimensions of the NQPACK footprint mounted on the printed cir-

cuit board of the user system.

The printed circuit board of the user system must be designed with due consideration given to this

footprint as well as to the mass production MCU.

For more information, contact the Tokyo Eletech Corporation.

Figure 2 Recommended dimensions of the footprint for mounting the NQPACK

*1 : Position of the guide pin hole (φ1.0) when mounting the NQPACK.

These holes do not need to be fabricated if the guide pins are not used.

*2 : Position of the hole (φ2.2) for the screw for affixing the IC socket when the NQPACK064SB-SL

(Tokyo Eletech Corporation, sold separately) is mounted instead of the NQPACK064SB-SL.

This hole does not need to be fabricated if the NQPACK064SB-SL is not used.

0.65mm ×15 = 9.75mm

0.65mm

1.8mm 12.0mm 1.8mm

1.8mm

12.0mm

1.8mm

No.1 pin

5.0mm

0.65mm ×15 = 9.75mm

3-φ1.0mm*1

φ2.2mm*2

0.4mm

4. Procedure for Connecting to the User System

Before using the MB2198-304, mount the supplied NQPACK on the user system.

Connect the header board directly to the adapter. Refer to the operation manual of the adapter for

details on how to connect the adapter.

■Connecting

1. To connect the header board to the user system, align pin 1 indicated by the index mark (▲) on

the NQPACK mounted on the user system with the index mark (▲) on the header board and then

insert it (See Figure 3) .

The YQPACK pins are thin and easy to bend. Check that the YQPACK pins are not bent before

inserting it into the NQPACK.

2. Insert each of the screws for securing the header board through a washer and into each of the four

holes in the header board. Partially tighten one of the screws with the special screwdriver supplied

with the NQPACK and then partially tighten the screw in the diagonally opposite corner. Partially

tighten the two remaining screws. Finally repeat the process making the screws equally tight.

(See Figure 4) .

Take care not to overtighten the screws as this may cause a faulty connection.

Figure 3 Index position

Adapter I/F connector 1

Adapter I/F connector 2

YQPACK

(It mounts at the back)

NQPACK

Index mark (▲) Header board

Index mark (▲)

Figure 4 Header board connection

■Disconnection

To disconnect the header board from the user system, remove all four screws, and then pull the

header board straight out of the NQPACK.

Screws for securing

the header board

Washer

Header board

User system

YQPACK

NQPACK

5. Mounting Mass Production MCUs

Use the supplied HQPACK to mount a mass production MCU on the user system.

■Mounting

1. To mount a mass production MCU on the user system, align the index mark (▲) on the NQPACK

mounted on the user system with the index mark (●) on the mass production MCU.

2. Confirm that the mass production MCU is correctly mounted on the NQPACK, and then align the

index mark (the only corner with an angle cut-out) of the HQPACK with the index mark of the

NQPACK, and insert it (See “Figure 5”).

The HQPACK pins are thin and easy to bend. Check that the HQPACK pins are not bent before

inserting it into the NQPACK.

3. Insert each of the screws for securing the HQPACK into each of the four screw holes on the HQ-

PACK and tighten the diagonally opposite screws in turn.

To tighten the screws, use the special screwdriver supplied with the NQPACK to finally tighten

the four screws in sequence. Tightening the screws too tight might result in a defective contact.

Figure 5 Mounting a mass production MCU

■Disconnection

To remove the HQPACK, remove all of the four screws, and pull the HQPACK vertically out from

the NQPACK.

Screws for securing

the HQPACK

HQPACK

Mass production MCU

NQPACK

User system

6. Connector Pin Assignment

The signals from the evaluation MCU mounted on the adapter board are connected to the YQPACK

(the same assignments as mass production MCU) via adapter I/F connectors 1 and 2 on the header

board.

For details on the mass production MCU pins, refer to the data sheet or hardware manual of each

MCU.

■Pin assignment

Tables 1 to 4 show the correspondence between the pin numbers for adapter I/F connectors 1 and 2,

the evaluation MCU on the adapter board, and the mass production MCU.

The following explanations apply to these tables. Row A corresponds to the side of the connector

that displays the polarity. Row B corresponds to the opposite side.

*1 : No connection. These are not connected on either evaluation MCUs or mass production MCUs.

*2 : Pin 18 on mass production MCUs is connected to pins AA38, Y37, Y36, and Y35 on evaluation

MCUs.

- : Unconnected (open) pin

: VCC

The evaluation MCU power supply pins (VCC) are as follows:

VCC=Y38, W38, W36, W35, G5, L5, AR7, AM35, H35, D8, R5, W5, AC5, AG5, AP11,

AP19, AP23, AP31, AH34, AD34, T34, H34, E32, E28, E20, E12, G4, AL4, AR31,

D32, AL5, AP7, AP15, AP27, AR7, AM34, Y34, M34, E24, E16, E8, AP33, AP29,

AP25, AP21,AP13, AA5, D15, D25, R35, AE35, AR24, P4, AP17, AP9, AN5, AJ5,

AE5, U5, N5, J5,AR14, AD4, AK34, AF34, AB34, V34, P34, K34, F34, E30, E26, E22,

E18, E14, E10, E6

The mass production MCU power supply (VCC) pin numbers are 16 and 48.

: VSS

The evaluation MCU ground pins (VSS) are as follows:

VSS = E11, E15, E19, E23, E27, E31, G34, L34, R34, W34, AA34, AE34, M5, C3, B37, T5,

Y5, AD5, AJ34, AH5, AT36, AT3, AU37, AU2, AK5, AP8, AP12, AP16, AP20, AP24,

AP28, AP30, AL34, A1, B1, AU1, AV1, AV2, AV37, AV38, AU38, B38, A38, A37,

A2, C36, D4, AR4, AR35, D35, E5, K5, P5, V5, AB5, AF5, AM5, AP5, AP6, AP10,

AP14, AP18, AP22, AP26, AP32, AP34, AN34, AG34, AC34, U34, N34, J34, E34,

E33, E29, E25, E21, E17, E13, E7

The mass production MCU ground (VSS) pin numbers are 17, 33, and 49.

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