HP 205 G2 AiO Business Montageanleitung

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP 205 G2 AiO Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm

MB, Memory,HDD PCA,ODD PCA,Adapter PCA 5

Batteries All types including standard alkaline and lithium coin

or button style batteries MB 1

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries 0

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps Panel 1

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing PCB/PCT) 0

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height Adapter 1

External electrical cables and cords Power cord 1

Gas Discharge Lamps 0

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. 0

Components and waste containing asbestos 0

Components, parts and materials containing

refractory ceramic fibers 0

EL-MF877-00 Page 2

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Components, parts and materials containing

radioactive substances 0

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Description #1 crisscross screw driver 2#

Description #2 hexagon screw driver T15

Description #3

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Take off rear cover

2. Take off mother board cover

3. Romove all the cables from PCA

4. Take off MB

5. Remove memory from the PCA

6. Remove battery from the PCA

7. Take off speaker from the unit

8. Take off HDD from the unit

9. Take off system fan from the unit

10. Take off convertor board from the unit

11. Take off ODD from the unit

12. Take off button bracket

13. Take off camera from the unit

14. Take off main chassis

15. Take off panel from the unit

16. Open the power adapter by mechanical force.

17.

18.

19.

20.

21.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

1.Take off rear cover

Rotate screw driver to release

the screw and take off the

rear cover.

2.Take off mother board

cover

Rotate screw driver to

release screw and take off

the mother board cover.

EL-MF877-00 Page 4

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PSG instructions for this template are available at EL-MF877-01

3. Remove all the cables

from PCA.

4.Take off mother board

Rotate screw driver to release

screw and take off mother

board from the unit.

EL-MF877-00 Page 5

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PSG instructions for this template are available at EL-MF877-01

5. Remove memory from

the PCA.

Pull out memory by

arrowhead.

6. Remove battery from

the PCA.

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

7. Take off speaker from

the unit.

Rotate screw driver to

release the screw and take

off speaker from the unit.

8. Take off HDD from the

unit.

8.1: Rotate screw driver to

release screw and remove

HDD cage.

8.2:pull out the HDD by

EL-MF877-00 Page 7

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PSG instructions for this template are available at EL-MF877-01

arrowhead

8.3: Take off HDD from

HDD cage

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

9. Take off system fan

from the unit.

Rotate screw driver to

release screw and remove

system fan from the unit.

10. Take off convertor

board from the unit.

10.1. remove cable from

convertor board

10.2. rotate screw driver to

release convertor board

screw.

EL-MF877-00 Page 9

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PSG instructions for this template are available at EL-MF877-01

11. Take off ODD from the

unit.

11.1: remove ODD bracket

11.2: pull out the ODD by

arrowhead

EL-MF877-00 Page 10

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PSG instructions for this template are available at EL-MF877-01

12. Take off the button

bracket.

13. Take off camera by

arrowhead.

14. Take off main chassis

from the unit.

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