HP 282 Pro G3 Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP 282 Pro G3 Microtower Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

PCA, PSU

Batteries

All types including standard alkaline and lithium coin

or button style batteries PCA

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

PSU

External electrical cables and cords

AC Power Cable

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

System Fan

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 Crisscross Screw Driver

PH1

Description #2 Hexagon Screw Driver

T-15

Description #3 Electric Iron

QUICK 310

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel (Step1)

2. Disconnect ODD/ HDD power cable and ODD/ HDD SATA cable from ODD (Step2~Step3)

3. Remove ODD/ HDD from chassis (Step4~Step7)

4. Remove all cables and heat sink from MB (Step8~Step11)

5. Remove the Memory/ CPU/ Battery from MB (Step12~Step14)

6. Remove front panel from chassis (Step15)

7. Remove MB from chassis (Step16)

8. Remove system fan (Step17)

9. PSU from chassis (Step17~Step19)

10. Separate PSU and remove the Electrolytic Capacitors (Step 20~Step23)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Step1 Loose thumb screw and remove

access panel.

EL-MF877-00 Page 3

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PSG instructions for this template are available at EL-MF877-01

Step2 Disconnect ODD power cable and

ODD SATA cable from ODD.

Step3 Disconnect HDD power cable and

HDD SATA cable from HDD.

Step4 Remove the driver cage from

chassis

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Step5 Press the ODD’s latch on ODD cage

Step6 Remove the ODD from ODD cage

Step7 Use T-15 screwdriver to loose the

screws of HDD and remove HDD from HDD

cage

EL-MF877-00 Page 5

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PSG instructions for this template are available at EL-MF877-01

Step8 Disconnect all cables from MB.

Step9 Disconnect heat sink fan cable from

Step10 Use T-15 screwdriver to loose the

screws and remove heat sink

EL-MF877-00 Page 6

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Step11 Use PH1 screwdriver to loose the

screws and remove the heat sink fan.

Step12 Remove the Memory from MB

Step13 Rotate the handle and open it up to

remove CPU from MB.

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PSG instructions for this template are available at EL-MF877-01

Step14 Remove the battery from MB.

Step15 Remove front panel from chassis

Step16 Use T-15 screwdriver to loose the

screws of MB and remove MB from

chassis

EL-MF877-00 Page 8

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Step17 Use PH1 screwdriver to loose the

screws of system fan and remove it

Step18 Use T-15 screwdriver to loose the

screws of PSU

Step19 Press the PSU’s latch on chassis

and remove it.

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Step20 Use PH1 screwdriver to loose

screws from PSU

Step21 Open the PSU cage and use PH1

screwdriver to loose the screw of PCBA

cable

Step22 Use PH1 screwdriver to loose

screws and remove PCB from case

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Step23 Use Electric Iron remove caps from

PCB

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