HP Xw9400 Montageanleitung

Product End-of-Life Disassembly Instructions

HP xw9400 Workstation

Product Category: Workstations

Marketing Name / Model

[List multiple models if applicable.]

HP xw9400 Workstation

- Standard configuration

- Optional liquid cooled configuration

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq cm.

There are two in the power supply, one graphics

card, and one system board. (Additional cards may

be present depending on the configuration.)

Batteries All types including standard alkaline and lithium coin

or button style batteries. 1

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries None

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm Includes background illuminated displays with gas

discharge lamps. None

Cathode Ray Tubes (CRT) None

Capacitors / condensers (Containing PCB/PCT) None

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height Fifteen attached to the power supply boards. 15

External electrical cables and cords None

Gas Discharge Lamps None

Plastics containing Brominated Flame Retardants None

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner Include the cartridges, print heads, tubes, vent

chambers, and service stations. None

Components and waste containing asbestos None

Components, parts and materials containing

refractory ceramic fibers None

Components, parts and materials containing None

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radioactive substances

Liquid Fluid in the liquid cooling unit of the optional

configurations. Yes

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description Tool Size (if

applicable)

Torx drivers, screwdriver, diagonal cutter

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

(See instructions below in sections 3.2 and 3.3.)

3.2 Workstation Disassembly Procedures

1. Remove/disengage any security devices that prohibit opening the workstation.

2. Disconnect the power cord from the electrical outlet and then from the workstation.

3. Disconnect all peripheral device cables from the workstation.

4. Remove the access panel. Pull up on the handle 1and lift off the cover 2.

5. Disconnect all internal cables from system board, power supply, and other components.

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Template Revision A 438710-001

6. Remove the system battery. On the system board, press on the release tab of the battery

holder. Rotate the battery enough to get beyond the latch, and lift it straight up.

Battery

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Template Revision A 438710-001

7. Remove the graphics card and any other expansion cards.

If necessary, remove PCI holders. For short or tall PCI cards press in on the sides 1of the

holder and rotate it 2out of the chassis.

Short card Tall card

Remove the PCI retainer by pressing down on it, then out 1. Lift the PCI or PCI-X card out of

the chassis 2.

If removing a PCI Express high-end graphics card, disconnect the auxiliary power supply cable

from the card (not illustrated) if required, and move the lever to release the card 3and lift it

out of the chassis.

PCI or PCI-X card PCI Express card

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Template Revision A 438710-001

8. Remove the CPU Heatsink.

Remove the CPU airflow duct by lifting up on the tabs 1and rotating the duct away 2from the

CPU heatsinks.

Disconnect the CPU heatsink fan connector 1from the system board. Loosen the heatsink

mounting screws 2. Before lifting the heatsink, carefully break the thermal compound between

the CPU heatsink and processor by moving the heatsink back and forth or twisting it 3.

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9. Remove the power supply from the chassis. Remove the four screws 1from the back panel.

Slide the power supply toward the front and lift up 2to remove it from the chassis.

10. If the workstation is equipped with a liquid cooling unit, see section 3.4 for instructions on

draining the fluid.

11. Rotate the system board latch lever 90 degrees 1clockwise to unlock the system board. Slide

the system board forward 2to disengage the metal mounting standoffs from the chassis. Lift

the system board out 3of the chassis. You can lift the board by the rear audio connector and

the 2 x 4 power connector 4.

12. Dispose of all removed components according to regulatory requirements.

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3.3 Power Supply Disassembly Procedures

1. Cut the cable tie at the rear of the unit.

2. Remove the eight power supply screws—three on each side of the front, one at the side,

and one at the top back.

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3. Slide the chassis housing from the power supply unit.

4. Remove the four screws from the corners of the first PCB card. Pull the card loose from the

chassis.

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5. Unplug the connectors that connect the two PCB cards together. Remove the first PCB

card from the chassis.

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Template Revision A 438710-001

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