HP Compaq dx2200 Montageanleitung

HP-00007-01, Appendix 3 22-Mar-2006

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Page 1

Appendix 3 Product End-of-Life Disassembly instructions

Product Identification:

Marketing Name / Model Description

HP Compaq Business PC dx2200 MT

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the

basic instructions for the disassembly of HP products to remove components and materials requiring

selective treatment.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in

the right column, as applicable.

Item Description

Notes

Qty items in

product

Printed Circuit Boards (PCB) or Printed

Circuit Assemblies (PCA)

With a surface > 10 square cm 3 (1 sys board,

2 P/S board)

Batteries All types including standard

alkaline and lithium coin or button

style batteries

Mercury containing components For example, mercury in lamps,

display backlights, scanner

lamps, switches, batteries

Liquid Crystal Displays (LCD) with a

surface greater than 100 square cm

Includes background illuminated

displays with gas discharge

lamps

Cathode Ray Tubes (CRT) 0

Capacitors / condensers (Containing

PCB / PCT)

Electrolytic Capacitors/Condensers

greater than 2.5 cm in diameter or height

External electrical cables and cords 0

Gas Discharge Lamps 0

Plastics containing Brominated Flame

Retardants

Components and parts containing toner

and ink, including liquids, semi-liquids

(gel/paste) and toner

Include the cartridges, print

heads, tubes, vent chambers, and

service stations.

Components and waste containing

asbestos

Components, parts and materials

containing refractory ceramic fibers

Components, parts and materials

containing radioactive substances

HP-00007-01, Appendix 3 22-Mar-2006

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2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a

point where components and materials requiring selective treatment can be removed.

Tool Description Tool Size (if applicable)

Torx screwdriver T15

Phillips screwdriver

Diagonal cutters (dikes)

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials

requiring selective treatment:

SYSTEM BOARD

1 Remove the access panel:

a) Remove the two screws that secure the access panel to the computer chassis.

b) Slide the access panel back about 6 mm (1/4 inch), then rotate the top of the panel

away from the chassis (pivot on the bottom) and lift it off the unit

2 Remove the front bezel (see Figure 1 below):

a) Pull outward on all three tabs on the left side of the bezel (1)

b) Rotate the bezel off the chassis (2), beginning with the left side then the right side.

3 Disconnect the power, and data cables from the back of all installed drives.

4 Disconnect all cables from the system board.

5 Remove the heatsink from the system board (see Figure 2 below):

a) Disconnect the heatsink control cable from the system board.

b) Loosen the four captive screws that secure the heatsink to the system board.

c) Lift the heatsink from atop the processor and set it on its side to keep from

contaminating the work area with thermal grease.

6 Remove the six screws that secure the system board to the chassis (1)

(see Figure 3 below):

7 Slide the system board towards the front of the chassis (2) then remove it (3)

(see Figure 3 below).

NOTE: The system board in the computer may look slightly different from the one shown

here.

HP-00007-01, Appendix 3 22-Mar-2006

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POWER SUPPLY PRINTED CIRCUIT ASSEMBLY

1 To remove the power supply (see Figure 4 below)

a) Remove all cables connected to all devices in the chassis.

b) Using a phillips screwdriver, remove the four screws that secure the power supply to

the chassis.

c) Slide the power supply toward the front of the computer, and then lift it out of the

chassis.

2 To remove the cover from the power supply (see Figures 5 & 6 below):

a) Using a phillips screwdriver, remove the six screws that secure the cover to the power

supply chassis.

b) Using dikes, cut the plastic cable clamp that secures the cables to the chassis.

c) Lift the cover off the power supply.

3 To remove the power supply PCA:

a) Cut the plastic cable clamp that secures the cables to the chassis

(see Figure 7 below).

b) Remove the four screws that secure the power supply PCA to the chassis

(see Figure 8 & 9 below).

c) Using diagonal cutters (dikes) cut all cables connected to the PCA (2 to switch, 2 to PC

inlet, 2 to power supply fan) (see Figure 10 below).

d) Remove the power supply PCA from the power supply chassis.

BATTERY

Locate the battery and battery holder on the system board. Depending on the type of

battery holder on the system board, follow the instructions below to remove the battery:

TYPE 1 BATTERY HOLDER (see Figure 11 below)

Lift the battery out of the holder.

TYPE 2 BATTERY HOLDER (see Figure 12 below)

To release the battery from its holder, squeeze the metal clamp that extends above one

edge of the battery. When the battery pops up, lift it out.

TYPE 3 BATTERY HOLDER (see Figure 13 below)

Pull back on the clip that holds the battery in place, and then remove the battery.

HP-00007-01, Appendix 3 22-Mar-2006

HP Restricted

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3.2 ILLUSTRATIONS

Figure 1: Removing the front bezel Figure 2: Removing the heatsink

Figure 3: Removing the system board Figure 4: Power supply screw locations

HP-00007-01, Appendix 3 22-Mar-2006

HP Restricted

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Figure 5: Cut the plastic cable clamp

Figure 6: Power supply cover screw locations

Figure 7: Cut the plastic cable clamp

Figure 8: Power supply PCA screw locations

Figure 9: Power supply PCA screw locations

Figure 10: Cut all cables connected to the

board

HP-00007-01, Appendix 3 22-Mar-2006

HP Restricted

Page 6

FIGURE 11: Type 1 battery holder

FIGURE 12: Type 2 battery holder

FIGURE 13: Type 3 battery holder

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