HP Elite 7000 Microtower Montageanleitung

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP Elite 7000 Microtower Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries Inside mainboard

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

Inside power supply

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Fans

Components and parts containing toner and ink,

Include the cartridges, print heads, tubes, vent

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including liquids, semi-liquids (gel/paste) and toner

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

1.3 Markings for plastic parts greater than 25 grams

Plastic Part Name

Plastic Part

Description

Weight

(grams)

ISO 11469:2000 Plastic Part

Mark

Optional:

Photo

Spruce Main Bezel

Main front bezel piece

150

>ABS<

Spruce Bezel Frame

Front bezel frame

194

>ABS<

System Fan Frame

Fan Frame

>PBT-GF30-FR(17)<

CPU Heatsink Fan

Frame

Fan Frame

>PBT-GF30-FR(17)<

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

T-15

Micro shear

170II

Screwdriver

PH1

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. SYSTEM BOARD

1.1 Remove the access panel:

a) Remove the screw that secure the access panel to the computer chassis. (see Figure 1 below)

b) Pull the panel off the unit. (see Figure 2 below)

1.2 Disconnect the data cables from the board.(see Figure 3-7 below)

a) Disconnect the CPU cable and ATX cables from the board.

b) Disconnect the ODD cable and HDD cable from the board.

c) Disconnect the power switch cable and front I/O cable from the board.

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1.3 Remove the Graphic card from the system board(see Figure 8-11)

a) Loose the screw that secure PCI card with chassis

b) Remove the metal baffle

c) Pull the switch of the PCI_E slot

d) Remove the Graphic card from the slot

1.4 Remove the system fan.(see Figure 12&13 below)

a) Remove the cables from mainboard.

b) Loose the screws and remove the system fan from chassis.

1.5 Remove the processor from the system board: (see Figure 14-18 below)

a) Remove the processor fan cable from the board

b) Loosen the screws that secures the CPU fan to the system board.

c) Lift the heat sink from atop the processor and set it on its side to keep from contaminating the work area with thermal

grease.

d) Rotate the handle and lift the processor from the socket.

1.6 Remove the Memery.(see Figure 19&20 below)

a) push the two handles of the DIMM slot

b) Lift the memery from the DIMM slot

1.7 Remove the system board: (see Figure 21-&22 below)

a) Remove the screws that secure the system board to the chassis .

b) Lift the system board towards then remove it.

2. BATTERY

2.1 Release the battery from its holder, squeeze the metal clamp that extends above one edge of the battery. Then the

battery pops up, lift it out.(see Figure 23 below).

3. SYSTEM DRIVERS

3.1 Remove the HDD.(see Figure 24-30 below)

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a) Remove the cables connect to the HDD.

b) Loose the screws that secure the HDD cage to chassis

c) Push the handle and push the HDD cage off the chassis

d) Loose the screws on thetwo side of the HDD cage

e) Pull the HDD from the HDD cage

3.2 Remove the ODD.(see Figure 31-34 below)

a) Remove the cables connect to the ODD.

b) Pull outward on all three tabs on the front bezel.

c) Loose the screws on the ODD cage

d) Lift the handle and pull the ODD out of the ODD cage.

3.3 Remove the front I/O.(see Figure 35-37 below)

a) Loose the screw that secure the front I/O to chassis.

b) Cut the plastic cable clamp that secures the cables to the cover

c) Lift the Front I/O and pull it out of the chassis.

3.4 Remove the power on/off switch.(see Figure 38&39 below)

a) Extrusion the bottom of the switch.

b) Pull the switch out of the chassis.

4. POWER SUPPLY

4.1 Take off the power supply: (see Figure 40-43 below)

a) Remove the four screws that secure the power supply to the chassis.

b) Press the baffle and slide the power supply toward the front of the computer,

c) Lift the power supply out of the chassis.

4.2 Remove the cover from the power supply: (see Figures 44-48 below)

a) Remove the six screws that secure the cover to the power supply chassis.

b) Cut the plastic cable clamp that secures the cables to the cover.

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c) Lift the cover off the power supply.

d) Cut the plastic cable clamp that secures the cables to the power cable.

e) Remove the four screws of the PFC module.

f) Lift the PFC out of the power supply cage.

4.3 Remove the power supply fan (see Figures 49&50)

a) Remove the four screws on the power supply

b) Lift the power supply fan from the cage.

4.4 Remove the power supply PCA: (see Figure 51-55 below)

a) Remove the screw that secure the ground to the cage.

b) Remove the screw that secure the switch to the chassis

c) Push the switch and light out of the cage.

d) Remove the four screws that secure the power supply PCA to the chassis.

e) Remove the power supply PCA from the power supply chassis.

4.4 Remove the Electrolytic Capacitors:(see Figure 56&57 below)

a) Using Soldering Iron, heat the solder of Electrolytic Capacitors.

b) Remove the Electrolytic Capacitors.

10.

11.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

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Figure 1 Remove the screw on the cover

Figure 2 pull out the blade card

Figure 3 Disconnect the cables from the board

Figure 4 Disconnect the cables from the board

Figure 5 Disconnect the cables from the board

Figure 6 Disconnect the cables from the board

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Figure 7 Disconnect the cables from the board

Figure 8 Loose the screw of PCI shielding

Figure 9 Remove the PCI shield

Figure 10 Push the switch of PCI_E slot

Figure 11 Remove the Graphic card from the board

Figure12 Disconnect the system fan from the board

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PSG instructions for this template are available at EL-MF877-01

Figure 13 Loose the four screws and remove the fan

Figure 14 Remove the CPU fan cable from the board

Figure 15 Loose the four screws of the fan

Figure 16 Remove the CPU fan

Figure 17 Rotate the handle and open it up

Figure 18 Remove the processor from the socket.

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PSG instructions for this template are available at EL-MF877-01

Figure 19 Push the two handles of the DIMM slot

Figure 20 Lift the memory from the DIMM slot

Figure 21 Loose the four screws on the PCA

Figure 22 Lift the mainboard from the chassis

Figure Remove the battery from the system board

Figure 24 Remove the cables connect to the HDD.

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PSG instructions for this template are available at EL-MF877-01

Figure 25 Loose the screws on the HDD cage

Figure 26 Push the handle of the HDD cage

Figure 27 Pull the HDD cage off the chassis

Figure 28 Loose the screws on the side of HDD cage

Figure 29 Loose the screws on other side of HDD

cage

Figure 30 Pull the HDD from the HDD cage

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