HP ProDesk 405 G6 SFF Montageanleitung

EL-MF877-00 Page 1

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Desktop Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 405 G6 SFF

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the

disassembly of HP Inc. products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the

plastic part. For any questions on plastic marking or identification of location of parts or components requiring selective treatment,

please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment. An “X” in the list of components and parts indicates the product

contains the component or part requiring selective treatment

Item Description Components and parts requiring selective

treatments

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA) with a surface greater than 10 sq cm

☒Main board (MB) PCB

☒Solid state drive (SSD) PCB

☐Wireless WAN module (WWAN) PCB

☐Touch module PCB

☒Power supply PCB

☒External Keyboard (KB)

☒External Mouse

☒Others: _HDD,_DIMM, add-on card, VGA, flex I/O

board _

Batteries, excluding Li-Ion batteries. This includes

standard alkaline, coin or button style batteries

☒RTC/CMOS battery

☐Others: _____________

Li-Ion batteries. Includes all Li-Ion batteries if more

than one is provided with the product (such as a

detachable notebook keyboard battery, etc.)

Li-ion battery(ies) are attached to the product by:

☐screws

☐snaps

☐adhesive

☐other. Explain

Mercury-containing components. For example,

mercury in lamps, display backlights, scanner lamps,

switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm. Includes background illuminated

displays with gas discharge lamps

☐Panel LCD 0

EL-MF877-00 Page 2

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Item Description Components and parts requiring selective

treatments

Quantity of

items

included in

product

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater

than 2.5 cm in diameter or height

☒Power Supply capacitor(s) or condenser(s)

External electrical cables and cords

☒AC power cord

☐Audio, video or data cables

☐Other: _________

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants (not

including external electrical cables and cords, PCBs or

PCAs already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner.

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

Components containing chlorofluorocarbons (CFC),

hydrochlorofluorocarbons (HCFC) or

hydrofluorocarbons (HFC), hydrocarbons (HC)

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

Philip #1

Screwdriver

Torx T15

Heatgun

N/A

Suction cup

N/A

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment including

the required steps to remove the external enclosure.

1. Remove Top cover

2. Remove ODD & cable

3. Remove front bezel

4. Open cage & remove cable from MB

EL-MF877-00 Page 3

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

5. Remove storage (3.5”HDD or 2.5”HDD) and cable

6. Remove Card reader module

7. Remove WLAN module

8. Remove speaker

9. Remove DIMM

10. Remove SSD

11. Remove add-on card & VGA

12. Remove hood sensor and fan duct

13. Remove Cooler & CPU

14. Remove antenna

15. Remove flex I/O board

16. Remove MB & PSU

3.2 Location of components requiring selective treatment. The photos and/or graphics below identify the location of the parts or

components requiring selective treatment within the main unit. For End-of-Life product disassembly instructions of external

accessories including external power supply (EPS), external keyboard (KB) external mouse and external cables and cords, refer to the

following URL: End-of-Life Product Disassembly Instructions (hp.com)

Reference to below pages.

EL-MF877-00 Page 4

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

1. Remove Top cover

Loosen the rear panel

screws

Remove top panel

Pull

Top

EL-MF877-00 Page 5

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

2. Remove ODD & cable

If SKU w/ ODD or

removable device,

remove SATA data and

SATA power

Push ODD latch release

from drive cage then

pull out ODD device

Pull

Push

Pull

EL-MF877-00 Page 6

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

3. Remove front bezel

Release front bezel

hook and remove it

hook

EL-MF877-00 Page 7

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

4. Open cage & remove cable from MB

Push front bracket

latch and open HDD

cage

Latch

Left side

Right side

EL-MF877-00 Page 8

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

Remove all cables from

connectors of MB.

(include speaker cable,

SATA power cable,

SATA data cable, PSU

P1/P2/P3 cables, serial

card cable, card reader

module cable, antenna

cable on WLAN card)

EL-MF877-00 Page 9

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

5. Remove storage (3.5”HDD or 2.5”HDD) and cable

Remove SATA cable

from MB.

Pull latch of HDD cage

and remove HDD from

HDD cage as shown.

Note: Be careful that

the HDD may fall

Remove SATA cable

from HDD

EL-MF877-00 Page 10

Template Revision D

last updated May-2022

HP Inc. instructions for this template are available at EL-MF877-01

6. Remove Card reader module

Close HDD cage then

release CR module

screw in front side

Take out card reader

module with cable.

Card reader

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