HP EliteOne 1000 G2 Montageanleitung

EL-MF877-00 Page 1

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PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP EliteOne 1000 G2 Base PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Motherboard, RAM

Batteries

All types including standard alkaline and lithium coin

or button style batteries RTC battery

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LCD

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

EPS, Power Cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdiver

TORX T8

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Removed Base Rare Cover

2. Removed Base Front Cover

3. Removed Speker

4. Remove Fan

5. Removed Thermal

6. Removed Stand base brket

7. Removed WireLan

8. Removed IO Brket

9. Remove HDD, HDD cable

10. Removed RAM

11. Removed Wireless Card, Ram, CPU

12. Removed RTC battery

13. Removed Motherboard,

14. Removed Stand Base

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Removed Base Rare Cover

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

2. Removed Base Front Cover

3. Removed Speaker

4. Remove Fan

5. Removed Thermal Module

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

6. Removed Stand Base brket

7. Removed Wire Lan

8. Remove IO brket

9. Removed Motherboard

10. Removed HDD and HDD cable

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

11. Removed RAM

12. Removed Stand base

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