HP EliteOne 800 G3 Montageanleitung

EL-MF877-00 Page 1

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Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP EliteOne 800 G3 Touch GPU All-in-One Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

MB*1, Memory*2, SSD*1

Batteries

All types including standard alkaline and lithium coin

or button style batteries RTC

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps LED

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Star(Torx) screwdriver OD 3.3mm..

Cross(Philips) screwdriver OD 3.0mm

Cross(Philips) screwdriver OD 2.0mm

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Refer to 1~4 to disassemble rear cover and IO pocket

2. Refer to 5~6 to disassemble VESA bracket and Fan

3. Refer to 7~8 to disassemble Thermal module

4. Refer to 9~12 to disassemble HDD and ODD

5. Refer to 13~14 to disassemble Webcam module

6. Refer to 15~16 to disassemble WLAN card and SSD card

7. Refer to 17~18 to disassemble Power supply and Audio jack cable

8. Refer to 19 to disassemble IO shielding

9. Refer to 20~22 to disassemble Power button board and Finger print

10. Refer to 23~25 to disassemble MB and CPU and Memory

11. Refer to 26~27 to disassemble Thermal pad and Base pan

12. Refer to 28 to disassemble Speaker and Antenna

13. Refer to 29 to disassemble LVDS and Backlight cable and Touch cable

14. Refer to 30 to disassemble LCD

15.

16.

17.

18.

19.

20.

21.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

AIO system disassembly

1. Place the system

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2. Remove the stand ,push the button on red circle location

3. Remove rear cove ,pull up the rear cover on red circle location then remove rear cover

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4. Remove IO pocket , release 2 screws on red circle location remove IO pocket

Tool: Star(Torx) screwdriver OD 3.3mm

5. Remove VESA bracket with Fan , release 5 screws on red circle location to remove VESA bracket with Fan

Tool: Star(Torx) screwdriver OD 3.3mm

EL-MF877-00 Page 5

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6. Remove Fan from VESA bracket ,release 4 screws on red circle location remove Fan from VESA bracket

Tool: Star(Torx) screwdriver OD 3.3mm

7. Remove thermal module(GPU SKU) , release 8 screws on red circle location to remove thermal module

Tool: Star(Torx) screwdriver OD 3.3mm

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8. Remove HDD with HDD cage , release 1 screw on red circle location and remove the DC power cable from the

hook on red circle location to remove HDD with HDD cage

Tool: Star(Torx) screwdriver OD 3.3mm

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9. Remove HDD from cage , slide HDD out from the cage then release 4 gromet to remove HDD from cage

Tool: Cross(Philips) screwdriver OD 3.0mm

10. Remove ODD , push the ODD latch on red circle location to slide out the ODD

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11. Remove ODD latch and bazel

EL-MF877-00 Page 9

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12. Remove Webcam module box , release 3 screws on red circle to remove Fan dust then release 4 screws on

yellow screws and unplug webcam connector on yellow circle location from MB

Tool: Star(Torx) screwdriver OD 3.3mm

Cross(Philips) screwdriver OD 3.0mm

13. Remove Webcam and Dmic , release 3 screws to remove Webcam box cover then remove Webcam and Dmic

EL-MF877-00 Page 10

Template Revision B

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Tool:Cross(Philips) screwdriver OD 2.0mm

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