HP RP9 G1 9118 Montageanleitung

EL-MF877-00 Page 1

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: External Options

Marketing Name / Model

[List multiple models if applicable.]

HP RP9 G1 AiO Retail System, Model 9118

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the

plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description

Notes

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button style

batteries Battery pack;RTC

Li-Ion batteries. Include all Li-Ion batteries if more than

one is provided with the product (such as a detachable

notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[ ] screws

[ ] snaps

[ ] adhesive

[ ] other. Explain

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater than

100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater

than 2.5 cm in diameter or height

External electrical cables and cords

DC Cable for External Power Supply

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

EL-MF877-00 Page 2

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity of

items

included in

product

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing refractory

ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Philips Screwdriver

T15 2.55-

3.00kgf.cm

Slotted Screwdriver

2# 2.55-

3.00kgf.cm

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure:

1. Removed the base by loosening the latch.

2. Tore off the label of the case.

3. Pried open the case.

4. Removed the plastic frame.

5. Removed the metal sheet and tape of the plastic frame.

6. Loosened 10 screws of the case.

7. Removed the plastic case.

8. Removed the metal parts of the case.

9. Removed the metal frame.

10. Removed the metal frame by loosening 5 screws.

11. Removed the fan by loosening 3 screws.

12. Removed the metal frame for HDD by loosening 2 screws.

13. Removed the plastic parts of the metal frame by loosening 4 screws.

14. Removed the button cell.

15. Removed the side of PCB assembly by loosening 3 screws.

16. Removed the cable of the PCB assembly.

17. Removed the speaker.

18. Removed the antenna by loosened 2 screws.

19. Tore off sticker of the metal frame.

20. Loosened 9 screws of the PCB assembly.

21. Removed the PCB assembly.

EL-MF877-00 Page 3

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

22. Tore off the thermal pad of the metal frame.

23. Loosened 18 screws of the metal frame.

24. Removed the metal frame.

25. Separated the PCB assembly and plastic frame by removing cable.

26. Tore off the tape of LCD.

27. Removed the plastic frame of the panel.

28. Separated the touch panel and LCD.

29. Removed the FPC of the touch panel.

30. Removed the latch of the base by loosening 4 screws

31. Removed the bracket of base by loosening 4 screws.

32. Separated the metal and plasitc frame of the base- bracket.

33. Removed the plastic component of the joint part by loosening 2 screws.

34. Removed the tip pad by loosening 4 screws.

35. Opened the bottom cover by loosening 1 screw.

36. Tore off the thermal pad of the base.

37. Removed the side cover of the base.

38. Separated the base and stander by loosening 10 screws.

39. Pried open the plastic case of the joint parts.

40. Completed disassembly.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 4

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

EL-MF877-00 Page 5

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

EL-MF877-00 Page 6

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

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