HP Rp5800 Montageanleitung

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PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP rp5800 Point of Sale System

Name / Model #2

Name / Model #3

Name / Model #4

Name / Model #5

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

863291-90026 Recycle Passport: Philips SureSigns Central 863291 and Efficia CMS200 Central

Monitoring System

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screwdriver

T-15

Micro shear

170II

Screwdriver

PH1

SW5 x 125

5.0

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove the access panel.(see Figure 1 below)

2. Remove fan duct and clapboard from chassis.(see Figure 2-6 below)

3. Remove front PSU fan from ODD cage.(see Figure 7-8 below)

4. Remove PSU from chassis.(see Figure 9-10 below)

5. Remove the Riser card from the MB(see Figure 11-15 below)

6. Remove SATA cable and HDD from chassis (see Figure 16-22 below)

7. Remove front bezel from chassis.(see Figure 23 below)

8. Remove front system fan from chassis.(see Figure 24-26 below)

9. Remove FIO and speaker from chassis.(see Figure 27-29 below)

10. Remove the Memory from the board.(see Figure 30 below)

11. Remove the CPU from the board .(see Figure 31-33 below)

12. Remove the battery from the system board.(see Figure 34 below)

13. Remove the COMB card from the MB.(see Figure 35 below)

14. Remove M/B from chassis.(see Figure 36-37 below)

15. Remove PSU cover.(see Figure 38-39 below)

16. Disconnect all the cables and remove the Electrolytic Capacitors.(see Figure 40-50 below)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 1 Remove the access panel

Figure 2 Rotate the HDD cage up

Figure 3 Disconnect the cables from fan duct

Figure 4 Remove fan duct from the board

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 5 Loose the clapboard from chassis

Figure 6 Remove the clapboard from chassis

Figure 7 Disconnect front PSU fan cable from MB

Figure 8 Remove front PSU fan from ODD cage

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 9 Disconnect MB main power and PSU fan cable

from

Figure 10 Remove CPU power cable from MB

Figure 11 Remove PSU from MB

Figure 12 Loose PCI latch cover from chassis

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 13 Remove two FH vent PCI slot from chassis

Figure 14 Disconnect hood sensor from MB

Figure 15 Remove the riser card form MB and chassis

Figure 16 Disconnect SATA power cable from MB

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Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 17 Remove SATA power cable from HDD

Figure 18 Loose the cable tie and ODD cage and remove

SATA power cable from

chassis

Figure 19 Remove SATA data cable from MB

Figure 20 Remove SATA data cable from HDD

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 21 Press the HDD’s latch on HDD cage.

Figure 22 Remove the HDD from cage

Figure 23 Remove front panel

Figure 24 Disconnect front system fan cable from MB

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 25 Loose the front system fan holder hook from

chassis

Figure 26 Remove front system fan holder

Figure 27 Disconnect FIO cables from MB

Figure 28 Loose screw of FIO and remove FIO

EL-MF877-00 Page 10

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Figure 29 Loose screws of speaker and remove

speaker

Figure 30 Remove the Memory from MB

Figure 31 Loose the screws and remove heat sink

Figure 32 Rotate CPU socket handle and open it up

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