Intel WiFi Link 5100 Leitfaden

Order Number: 318676-003US

Intel®5100 Memory Controller Hub

Chipset for Communications,

Embedded, and Storage Applications

Thermal/Mechanical Design Guide

July 2008

Revision 003US

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG July 2008

2Order Number: 318676-003US

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Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008 TDG

Order Number: 318676-003US 3

Intel®5100 MCH Chipset

Contents

1.0 Introduction..............................................................................................................6

1.1 Design Flow........................................................................................................6

1.2 Definition of Terms..............................................................................................7

1.3 Related Documents .............................................................................................8

1.4 Thermal Simulation .............................................................................................9

2.0 Packaging Technology...............................................................................................9

2.1 Package Mechanical Requirements....................................................................... 11

3.0 Thermal Specifications ............................................................................................ 12

3.1 Thermal Design Power (TDP) .............................................................................. 12

3.2 Case Temperature............................................................................................. 12

4.0 Thermal Solution Requirements............................................................................... 12

4.1 Characterizing the Thermal Solution Requirement.................................................. 12

5.0 Thermal Metrology .................................................................................................. 15

5.1 MCH Case Measurement..................................................................................... 15

5.1.1 Supporting Test Equipment...................................................................... 15

5.1.2 Thermal Calibration and Controls.............................................................. 16

5.1.3 IHS Groove ........................................................................................... 16

5.1.4 Thermocouple Conditioning and Preparation............................................... 18

5.1.5 Thermocouple Attachment to IHS ............................................................. 18

5.1.6 Curing Process....................................................................................... 22

5.1.7 Thermocouple Wire Management.............................................................. 23

5.2 Power Simulation Software ................................................................................. 24

6.0 Reference Thermal Solution..................................................................................... 24

6.1 AdvancedTCA* Reference Heatsink...................................................................... 25

6.1.1 Thermal Performance.............................................................................. 25

6.1.2 Mechanical Design Envelope .................................................................... 25

6.1.3 Board-level Components Keepout Dimensions ............................................ 26

6.1.4 Torsional Clip Heatsink Thermal Solution Assembly ..................................... 26

6.1.5 Heatsink Orientation............................................................................... 27

6.1.6 Extruded Heatsink Profiles.......................................................................27

6.1.7 Mechanical Interface Material................................................................... 27

6.1.8 Thermal Interface Material....................................................................... 27

6.1.8.1 Effect of Pressure on TIM Performance......................................... 28

6.1.9 Heatsink Clip ......................................................................................... 28

6.1.10 Clip Retention Anchors............................................................................ 28

6.1.11 Reliability Guidelines............................................................................... 28

6.2 CompactPCI* Reference Heatsink ........................................................................ 29

6.2.1 Component Overview.............................................................................. 29

6.2.2 Thermal Solution Performance Characteristics ............................................ 30

7.0 Reliability Guidelines............................................................................................... 30

A Mechanical Drawings............................................................................................... 31

B Thermal Solution Component Suppliers ...................................................................40

Intel®5100 MCH Chipset

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG July 2008

4Order Number: 318676-003US

Figures

1 Thermal Design Process ............................................................................................. 7

2 MCH Package Dimensions (Top View)..........................................................................10

3 MCH Package Dimensions (Side View) .........................................................................10

4 MCH Package Dimensions (Bottom View).....................................................................11

5 Processor Thermal Characterization Parameter Relationships..........................................13

6 IHS Groove Dimensions.............................................................................................17

7 Orientation of Thermocouple Groove Relative to Package Pin..........................................18

8 Bending Tip of Thermocouple .....................................................................................18

9 Securing Thermocouple Wires with Kapton Tape Prior to Attach ......................................19

10 Thermocouple Bead Placement...................................................................................20

11 Positioning Bead on Groove .......................................................................................20

12 Using 3D Micromanipulator to Secure Bead Location......................................................21

13 Measuring Resistance between Thermocouple and IHS ..................................................21

14 Applying Adhesive on Thermocouple Bead....................................................................22

15 Thermocouple Wire Management in Groove..................................................................23

16 Removing Excess Adhesive from IHS...........................................................................23

17 Filling Groove with Adhesive ......................................................................................24

18 Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity .............25

19 AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink ..................26

20 Torsional Clip Heatsink Assembly................................................................................27

21 Isometric View of the CompactPCI* Reference Heatsink.................................................29

22 CompactPCI* Reference Heatsink Thermal Performance.................................................30

23 AdvancedTCA* Heatsink Assembly Drawing .................................................................32

24 AdvancedTCA* Heatsink Drawing................................................................................33

25 AdvancedTCA* Component Keepout Zone....................................................................34

26 CompactPCI* Heatsink Assembly Drawing ...................................................................35

27 CompactPCI* Heatsink Drawing..................................................................................36

28 CompactPCI* Component Keepout Zone......................................................................37

29 Torsional Clip Heatsink Clip Drawing ...........................................................................38

30 TIM2 Drawing ..........................................................................................................39

Tables

1 Definition of Terms .................................................................................................... 7

2 Related Documents.................................................................................................... 8

3Intel

®5100 Memory Controller Hub Chipset Thermal Specifications.................................12

4 Required Heatsink Thermal Performance (ΨCA).............................................................15

5 Thermocouple Attach Support Equipment ....................................................................16

6 Honeywell* PCM45F TIM Performance as Function of Attach Pressure ..............................28

7 Reliability Guidelines.................................................................................................29

8 Reliability Requirements............................................................................................30

9 Mechanical Drawing List ............................................................................................31

10 MCH Torsional Clip Heatsink Thermal Solution ..............................................................40

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008 TDG

Order Number: 318676-003US 5

Intel®5100 MCH Chipset

Revision History

Date Revision Description

July 2008 003 Added the CompactPCI* reference solution

Added Figure 26, Figure 27, and Figure 28

Updated the supplier information

February 2008 002 Updated the TDPMax config value to 25.7 W in Table 3

November 2007 001 Initial release

Revision Number Descriptions

Revision Associated Life Cycle Milestone Release Information

0.0 POP L3 Closure Initial Documentation - Typically Internal Only

0.1–0.4 When Needed Project Dependent - Typically Internal Only

0.5 Design Win Phase First, Required Customer Release

0.6–0.7 When Needed Project Dependent

0.7 Simulations Complete Second, Recommended Customer Release

0.8–0.9 When Needed Project Dependent

1.0 First Silicon Samples Required Customer Release

1.1–1.4 When Needed Project Dependent (Recommended)

1.5 Qualification Silicon Samples Project Dependent

1.6–1.9 When Needed Project Dependent

NDA - 2.0

Public - XXXXXX-001 First SKU Launch Required Customer Release - Product Launch

2.1 and up When Needed Project Dependent

Note: Rows highlighted in gray are required revisions.

Intel®5100 MCH Chipset

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG July 2008

6Order Number: 318676-003US

1.0 Introduction

As the complexity of computer systems increases, so do the power dissipation

requirements. Care must be taken to ensure that the additional power is properly

dissipated. Typical methods to improve heat dissipation include selective use of

ducting, and/or passive heatsinks.

The goals of this document are to:

• Outline the thermal and mechanical operating limits and specifications for the

Intel®5100 Memory Controller Hub Chipset (Intel®5100 MCH Chipset)

• Describe reference thermal solutions that meet the specification of the Intel®5100

MCH Chipset

Properly designed thermal solutions provide adequate cooling to maintain the Intel®

5100 MCH Chipset die temperatures at or below thermal specifications. This is

accomplished by providing a low local-ambient temperature, ensuring adequate local

airflow, and minimizing the die to local-ambient thermal resistance. By maintaining the

Intel®5100 MCH Chipset die temperature at or below the specified limits, a system

designer can ensure the proper functionality, performance, and reliability of the

chipset. Operation outside the functional limits can degrade system performance and

may cause permanent changes in the operating characteristics of the component.

The simplest and most cost effective method to improve the inherent system cooling

characteristics is through careful chassis design and placement of fans, vents, and

ducts. When additional cooling is required, component thermal solutions may be

implemented in conjunction with system thermal solutions. The size of the fan or

heatsink can be varied to balance size and space constraints with acoustic noise.

This document addresses thermal design and specifications for the Intel®5100 MCH

Chipset components only. For thermal design information on other chipset components,

refer to the respective component datasheet. For the ICH9R, refer to the Intel®I/O

Controller Hub 9 (ICH9) Family Thermal and Mechanical Design Guidelines.

Note: Unless otherwise specified, the term “MCH” refers to the Intel®5100 MCH Chipset.

1.1 Design Flow

To develop a reliable, cost-effective thermal solution, several tools have been provided

to the system designer. Figure 1 illustrates the design process implicit to this document

and the tools appropriate for each step.

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008 TDG

Order Number: 318676-003US 7

Intel®5100 MCH Chipset

1.2 Definition of Terms

Figure 1. Thermal Design Process

Table 1. Definition of Terms

Term Definition

FC-BGA

Flip Chip Ball Grid Array. A package type defined by a plastic substrate where

a die is mounted using an underfill C4 (Controlled Collapse Chip Connection)

attach style. The primary electrical interface is an array of solder balls

attached to the substrate opposite the die.

Note: The device arrives at the customer with solder balls attached.

BLT Bond line thickness. Final settled thickness of the thermal interface material

after installation of heatsink.

ICH9 I/O Controller Hub 9

IHS Integrated Heat Spreader

MCH Memory controller hub. The chipset component that contains the processor

interface, the memory interface, the PCI Express* interface and the ESI

interface.

Tcase_max Maximum allowed component temperature. This temperature is measured at

the geometric center of the top of the package IHS.

Tcase_min Minimum allowed component temperature. This temperature is measured at

the geometric center of the top of the package IHS.

TDP Thermal design power. Thermal solutions should be designed to dissipate

this target power level. TDP is not the maximum power that the chipset can

dissipate.

TIM Thermal Interface Material

ΨCA Case-to-ambient thermal characterization parameter. A measure of the

thermal solution thermal performance including TIM using the thermal

design power. Defined as (TCASE - TLA) / TDP

ΨCS Case-to-sink thermal characterization parameter. A measure of the TIM

thermal performance using the thermal design power. Defined as (TCASE -

TLA) / TDP

ΨSA Sink-to-ambient thermal characterization parameter. A measure of heatsink

thermal performance using the thermal design power. Defined as (TCASE -

TLA) / TDP

•Package Level Thermal Models

•Thermal Model User’s Guide

Step 1: Thermal Simulation

•Reference Heatsinks

•Reference Mounting Hardware

•Vendor Contacts

Step 2: Heatsink Design

and Selection

Step 3: Thermal Validation

•Thermal Testing Software

•Thermal Test Vehicle

•User Guides

Intel®5100 MCH Chipset

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG July 2008

8Order Number: 318676-003US

1.3 Related Documents

Intel®Electronic Design Kits (EDKs) provide online, real-time collateral updates. The

following links take you to the EDK server and require you to log into Intel®Business

Link (IBL).

•Quad-Core and Dual-Core Intel® Xeon® Processor 5000 Sequence with Intel®

5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage

Applications

•Intel® Core™2 Duo Processors T9400 and SL9400 and Intel® 5100 Memory

Controller Hub Chipset for Communications and Embedded Applications

The reader of this specification should also be familiar with material and concepts

presented in the documents listed in Table 2.

Table 2. Related Documents (Sheet 1 of 2)

Document Document Number/URL

BGA/OLGA Assembly Development Guide Note 1

Dual-Core Intel®Xeon®Processor 5100 Series Datasheet http://www.intel.com/ (313355)

Dual-Core Intel®Xeon®Processor 5100 Series Specification

Update http://www.intel.com/ (313356)

Dual-Core Intel®Xeon®Processor 5100 Series Thermal/

Mechanical Design Guidelines http://www.intel.com/ (313357)

Dual-Core Intel®Xeon®Processor 5200 Series Datasheet http://www.intel.com/ (318590)

Dual-Core Intel®Xeon®Processor 5200 Series Specification

Update http://www.intel.com/ (318586)

Dual-Core Intel®Xeon®Processor 5200 Series Thermal/

Mechanical Design Guidelines http://www.intel.com/ (318675)

Dual-Core Intel®Xeon®Processor LV 5138 in Embedded

Applications Thermal/Mechanical Design Guidelines http://www.intel.com/ (315225)

Intel®5000 Series Chipset Memory Controller Hub (MCH)

Thermal/Mechanical Design Guide http://www.intel.com/ (313067)

Intel®5100 Memory Controller Hub Chipset (embedded) –

External Design Specification (EDS) Addendum Note 1

Intel®5100 Memory Controller Hub Chipset (embedded) –

Maximum Power Application Note 1

Intel®5100 Memory Controller Hub Chipset Datasheet http://www.intel.com/ (318378)

Intel®5100 Memory Controller Hub Chipset Specification Update http://www.intel.com/ (318385)

Intel®Core™2 Duo Processor, Intel®Core™2 Solo Processor and

Intel®Core™2 Extreme Processor on 45-nm Process Datasheet http://www.intel.com/ (320120)

Intel®Core™2 Duo Processor, Intel®Core™2 Solo Processor and

Intel®Core™2 Extreme Processor on 45-nm Process

Specification Update http://www.intel.com/ (320121)

Intel®Core™2 Duo Processors on 45-nm process for Embedded

Applications Thermal Design Guide http://www.intel.com/ (320028)

Intel®Core™2 Duo Processors T9400 and SL9400 and Intel®

5100 Memory Controller Hub Chipset for Communications and

Embedded Applications – Platform Design Guide Note 1

Intel®I/O Controller Hub 9 (ICH9) Family Datasheet http://www.intel.com/ (316972)

Intel®I/O Controller Hub 9 (ICH9) Family Specification Update http://www.intel.com/ (316973)

Notes:

1. Contact your Intel sales representative. Some documents may not be available at this time.

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

July 2008 TDG

Order Number: 318676-003US 9

Intel®5100 MCH Chipset

1.4 Thermal Simulation

Intel provides thermal simulation models of the Intel®5100 MCH Chipset and

associated user’s guides to aid system designers in simulating, analyzing, and

optimizing their thermal solutions in an integrated, system-level environment. The

models are for use with the commercially available Computational Fluid Dynamics

(CFD)-based thermal analysis tools Flomerics* FLOTHERM* (version 5.1 or higher) and

Fluent* Icepak* (version 4.3.10 or higher). Contact your Intel field sales representative

to order the thermal models and user’s guides.

2.0 Packaging Technology

Intel®5100 MCH Chipset-based platforms consist of two individual components: the

Intel®5100 MCH Chipset and the ICH9R. The Intel®5100 MCH Chipset uses a 42.5

mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2, Figure 3, and

Figure 4). For information on the ICH9R package, refer to the Intel®I/O Controller Hub

9 (ICH9) Family Thermal and Mechanical Design Guidelines.

Intel®I/O Controller Hub 9 (ICH9) Family Thermal and

Mechanical Design Guidelines http://www.intel.com/ (316974)

Quad-Core and Dual-Core Intel®Xeon®Processor 5000

Sequence with Intel®5100 Memory Controller Hub Chipset for

Communications, Embedded, and Storage Applications –

Platform Design Guide

Note 1

Quad-Core Intel®Xeon®Processor 5300 Series Datasheet http://www.intel.com/ (315569)

Quad-Core Intel®Xeon®Processor 5300 Series Specification

Update http://www.intel.com/ (315338)

Quad-Core Intel®Xeon®Processor 5300 Series Thermal/

Mechanical Design Guidelines http://www.intel.com/ (315794)

Quad-Core Intel®Xeon®Processor 5400 Series Datasheet http://www.intel.com/ (318589)

Quad-Core Intel®Xeon®Processor 5400 Series Specification

Update http://www.intel.com/ (318585)

Quad-Core Intel®Xeon®Processor 5400 Series Thermal/

Mechanical Design Guidelines http://www.intel.com/ (318611)

Quad-Core Intel®Xeon®Processor L5318 in Embedded

Applications Thermal and Mechanical Design Guidelines http://www.intel.com/ (318474)

Various system thermal design suggestions http://www.formfactors.org

Table 2. Related Documents (Sheet 2 of 2)

Document Document Number/URL

Notes:

1. Contact your Intel sales representative. Some documents may not be available at this time.

Intel®5100 MCH Chipset

Intel®5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications

TDG July 2008

10 Order Number: 318676-003US

Figure 2. MCH Package Dimensions (Top View)

Figure 3. MCH Package Dimensions (Side View)

MCH

IHS

Handling

Exclusion

Area

42.5 mm.

42.5 mm.38.5 mm.

38.5 mm,

0.20 –C–

IHS Substrate

0.435 ± 0.025 mm

See note 3

Seating Plane

2.44 ± 0.071 mm

See note 1.

Notes:

1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)

2. All dimensions and tolerances conform to ANSI Y14.5M-1994

3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm

4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)

orientation after reflow

0.20 See note 4.

3.79 ± 0.144 mm

4.23 ± 0.146 mm

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