JVC KD-AR5500 Bedienungsanleitung

SERVICE MANUAL

2005/1

CD / SD RECEIVER

MA14020051

KD-AR5500,KD-LHX550

TABLE OF CONTENTS

1 PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-22

5 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-33

Area suffix

J --------------- Northern America

KD-AR5500 LHX550

KD-LHX550

KD-AR5500

ARSENAL

Telephone muting

1-2 (No.MA140)

SPECIFICATION

Design and specifications are subject to change without notice.

AUDIO AMPLIFIER SECTION

Power Output 22 W RMS ×4 Channels at 4 Ωand [< or =] 1% THD+N

Signal to Noise Ratio 80 dBA (reference: 1 W into 4 Ω)

Load Impedance 4 Ω(4 Ωto 8 Ωallowance)

Equalizer Control Range Frequencies 60 Hz, 150 Hz, 400 Hz, 1 kHz, 2.4 kHz, 6 kHz, 12 kHz

Level ±10 dB

Frequency Response 40 Hz to 20 000 Hz

Line-Out Level/Impedance 5.0 V/20 kΩload (full scale)

Output Impedance 1 kΩ

Subwoofer-Out Level/Impedance 5.0 V/20 kΩload (full scale)

Other terminals LINE IN, CD changer, Steering wheel remote input

TUNER SECTION

Frequency Range FM 87.5 MHz to 107.9 MHz (with channel interval set to 200

kHz)

87.5 MHz to 108.0 MHz (with channel interval set to 50 kHz)

AM 530 kHz to 1 710 kHz (with channel interval set to 10 kHz)

531 kHz to 1 602 kHz (with channel interval set to 9 kHz)

[FM Tuner] Usable Sensitivity 11.3 dBf (1.0 µV/75 Ω)

50 dB Quieting Sensitivity 16.3 dBf (1.8 µV/75 Ω)

Alternate Channel Selectivity (400 kHz) 65 dB

Frequency Response 40 Hz to 15 000 Hz

Stereo Separation 35 dB

Capture Ratio 1.5 dB

[AM Tuner] Sensitivity 20 µV

Selectivity 65 dB

CD/SD PLAYER SECTION

Type Compact disc player

Signal Detection System Non-contact optical pickup (semiconductor laser)

Number of channels 2 channels (stereo)

Frequency Response 5 Hz to 20 000 Hz

Dynamic Range 98 dB

Signal-to-Noise Ratio 102 dB

Wow and Flutter Less than measurable limit

MP3 (MPEG Audio Layer 3) Max. Bit Rate 320 kbps

WMA (Windows Media Audio) Max. Bit Rate 192 kbps

Playable SD Card Format Fat 12/16

Storage Up to 512 MB

Playable Audio Format for SD Card MP3/WMA

GENERAL

Power Requirement Operating Voltage DC 14.4 V (11 V to 16 V allowance)

Grounding System Negative ground

Allowable Operating Temperature 0°C to +40°C (32°F to 104°F)

Dimensions (W ×H ×D) Installation Size (approx.) 182 mm ×52 mm ×159 mm (7-3/16" ×2-1/16" ×6-5/16")

Panel Size (approx.) 188 mm ×58 mm ×13 mm (7-7/16" ×2-5/16" ×9/16")

Mass (approx.) 1.9 kg (4.2 lbs) (excluding accessories)

(No.MA140)1-3

SECTION 1

PRECAUTIONS

1.1 Safety Precautions

!Burrs formed during molding may be left over on some parts of the chassis. Therefore,

pay attention to such burrs in the case of preforming repair of this system.

!Please use enough caution not to see the beam directly or touch it in case of an

adjustment or operation check.

1-4 (No.MA140)

1.2 Preventing static electricity

Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser

diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.

1.2.1 Grounding to prevent damage by static electricity

Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players.

Be careful to use proper grounding in the area where repairs are being performed.

(1) Ground the workbench

Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the

traverse unit (optical pickup) on it.

(2) Ground yourself

Use an anti-static wrist strap to release any static electricity built up in your body.

(3) Handling the optical pickup

• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical

pickup are shorted. After replacement, return the shorted parts to their original condition.

(Refer to the text.)

• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily

destroy the laser diode.

1.3 Handling the traverse unit (optical pickup)

(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.

(2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the

replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a

time when attaching it to the connector.

(3) Handle the flexible cable carefully as it may break when subjected to strong force.

(4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

1.4 Attention when traverse unit is decomposed

*Please refer to "Disassembly method" in the text for the CD pickup unit.

• Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit.

(If the flexible wire is disconnected without applying solder, the CD pickup may be destroyed by static electricity.)

• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.

(caption)

Anti-static wrist strap

Conductive material

(conductive sheet) or iron plate

CN601

Short sections

Flexible wire

Mechanism control board

(No.MA140)1-5

SECTION 2

SPECIFIC SERVICE INSTRUCTIONS

This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS.

1-6 (No.MA140)

SECTION 3

DISASSEMBLY

3.1 Main body section

3.1.1 Removing the front panel assembly

(See Fig.1)

(1) Push the detach button in the lower right part of the front

panel assembly.

(2) Remove the front panel assembly.

Fig.1

3.1.2 Removing the heat sink

(See Fig.2)

Reference:

Remove the front panel assembly as required.

(1) From the left side of the main body, remove the two screws

Aand three screws Battaching the heat sink.

(2) Remove the heat sink from the main body.

Fig.2

Front panel assembly

Detach button

Heat sink

AAB

(No.MA140)1-7

3.1.3 Removing the top chassis assembly

(See Figs.3 to 6)

• Prior to performing the following procedures, remove the heat

sink.

Reference:

Remove the front panel assembly as required.

(1) From the bottom side of the main body, remove the two

screws Cattaching the top chassis assembly to the bottom

chassis assembly. (See Fig.3.)

(2) From the both and rear sides of the main body, remove the

four screws Dattaching the top chassis assembly to the

bottom chassis assembly. (See Figs.4 to 6.)

(3) Remove the two screws Eattaching the IC heat sink. (See

Fig.5.)

(4) Lift the top chassis assembly in the direction of the arrow,

disconnect the connector CN503 on the mechanism con-

trol board from the connector CN721 on the main board.

(See Figs.4 to 6.)

(5) Take out the top chassis assembly from the bottom chassis

assembly.

Fig.3

Fig.4

Fig.5

Fig.6

Top chassis assembly

Bottom chassis assembly

Top chassis assembly

CN503

CN721

Main board

Mechanism control board

Top chassis assembly

Bottom chassis assembly

Mechanism control board

IC heat sink

Top chassis assembly

Bottom chassis assembly Rear bracket

1-8 (No.MA140)

3.1.4 Removing the front chassis assembly

(See Figs.7 and 8)

• Prior to performing the following procedure, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the both sides of the top chassis assembly, remove

the two screws Fattaching the front chassis assembly.

(2) Remove the front chassis assembly from the top chassis

assembly.

Fig.7

Fig.8

3.1.5 Removing the CD mechanism assembly

(See Fig.9)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

Reference:

Remove the front chassis assembly as required.

(1) From the inside of the top chassis assembly, remove the

three screws Gattaching the CD mechanism assembly.

(2) Release the mecha heat sink from the joints aon the mech-

anism control board and remove the heat sink from the

main body.

(3) Take out the CD mechanism assembly from the top chas-

sis.

Fig.9

Top chassis assembly

Front chassis assembly

Top chassis assembly

Front chassis assembly

Top chassis

Mecha heat sink

G G

CD mechanism assembly

Mechanism control board

(No.MA140)1-9

3.1.6 Removing the main board

(See Figs.10 and 11)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the rear side of the bottom chassis assembly, remove

the two screws Hattaching the rear bracket to the bottom

chassis assembly. (See Fig.10.)

(2) From the top side of the bottom chassis assembly, remove

the two screws Jattaching the main board to the bottom

chassis assembly. (See Fig.11.)

(3) Release the stopper of the connector CN701 on the main

board in an upward direction, disconnect the card wire from

the connector CN701. (See Fig.11.)

(4) Disconnect the wire from the connector of the front door

mechanism assembly. (See Fig.11.)

(5) Disconnect the wire from the connector CN991 on the main

board. (See Fig.11.)

Reference:

After connecting the wires, fix the wires with the wire

holders.

(6) Take out the main board from the bottom chassis assem-

bly.

Fig.10

Fig.11

Rear bracket

Bottom chassis assembly

Connector

Wire holders CN701

Stopper

Bottom chassis assembly

CN991

Wires

Main board

Card wire

Front door mechanism assembly

1-10 (No.MA140)

3.1.7 Removing the rear bracket

(See Fig.12)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink, top chassis assembly and main

board.

(1) From the rear side of the main board, remove the wires

from the rear bracket in the direction of the arrow.

(2) Remove the screw K, screw Land four screws Mattaching

the rear bracket to the main board.

Reference:

After attaching the rear bracket to the main board, pass the

wires through the wire holder and insert them into the slots of

the rear bracket.

Fig.12

3.1.8 Removing the front door mechanism assembly

(See Fig.13)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink, top chassis assembly and main

board.

(1) From the top side of the bottom chassis assembly, remove

the screw Nattaching the FPC guide to the bottom chassis.

(2) Remove the five screws Pattaching the front door mecha-

nism assembly to the bottom chassis.

Reference:

When attaching the screws Nand P, apply a locking

agent them.

(3) Take out the front door mechanism assembly from the bot-

tom chassis.

Fig.13

Rear bracket

M M

Main board

Wire holder

Slots

Rear bracket

Wires

Bottom chassis

FPC guide

Front door mechanism assembly

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