JVC KD-LHX555 Bedienungsanleitung

SERVICE MANUAL

2005/3

CD/SD RECEIVER

MA15920053

KD-LHX555

TABLE OF CONTENTS

1 PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3

2 SPECIFIC SERVICE INSTRUCTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6

3 DISASSEMBLY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7

4 ADJUSTMENT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-23

5 TROUBLESHOOTING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-34

Area suffix

KD-LHX555

DISP

UT ------------------------- Taiwan

UH ----------------------- Thailand

UN ---------------------- Indonesia

U --------------------- Other Areas

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1-2 (No.MA159)

SPECIFICATION

Design and specifications are subject to change without notice.

AUDIO AMPLIFIER SECTION

Maximum Power Output Front 52 W per channel

Rear 52 W per channel

Continuous Power Output (RMS) Front 19 W per channel into 4 Ω, 40 Hz to 20 000 Hz at no more

than 0.8% total harmonic distortion.

Rear 19 W per channel into 4 Ω, 40 Hz to 20 000 Hz at no more

than 0.8% total harmonic distortion.

Load Impedance 4 Ω(4 Ωto 8 Ωallowance)

Equalizer Control Range Frequencies 60 Hz, 150 Hz, 400 Hz, 1 kHz, 2.4 kHz, 6 kHz, 12 kHz

Level ±10 dB

Frequency Response 40 Hz to 20 000 Hz

Signal-to-Noise Ratio 70 dB

Line-Out Level/Impedance 5.0 V/20 kΩload (full scale)

Output Impedance 1 kΩ

Subwoofer-Out Level/Impedance 5.0 V/20 kΩload (full scale)

Other Terminals LINE IN, CD changer

TUNER SECTION

Frequency Range FM 87.5 MHz to 108.0 MHz

AM 531 kHz to 1 602 kHz

FM Tuner Usable Sensitivity 11.3 dBf (1.0 µV/75 Ω)

50 dB Quieting Sensitivity 16.3 dBf (1.8 µV/75 Ω)

Alternate Channel Selectivity (400 kHz) 65 dB

Frequency Response 40 Hz to 15 000 Hz

Stereo Separation 35 dB

Capture Ratio 1.5 dB

AM Tuner Sensitivity 20 µV

Selectivity 65 dB

CD/SD PLAYER SECTION

Type Compact disc player

Signal Detection System Non-contact optical pickup (semiconductor laser)

Number of Channels 2 channels (stereo)

Frequency Response 5 Hz to 20 000 Hz

Dynamic Range 98 dB

Signal-to-Noise Ratio 102 dB

Wow and Flutter Less than measurable limit

MP3 (MPEG Audio Layer 3) Max. Bit Rate 320 kbps

WMA (Windows Media Audio) Max. Bit Rate 192 kbps

Playable SD Card Format Fat 12/16

Storage Up to 512 MB

Playable Audio Format for SD Card MP3/WMA

GENERAL

Power Requirement Operating Voltage DC 14.4 V (11 V to 16 V allowance)

Grounding System Negative ground

Allowable Operating Temperature 0°C to +40°C

Dimensions (W ×H ×D) Installation Size (approx.) 182 mm ×52 mm ×159 mm

Panel Size (approx.) 188 mm ×58 mm ×13 mm

Mass (approx.) 1.9 kg (excluding accessories)

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(No.MA159)1-3

SECTION 1

PRECAUTIONS

1.1 Safety Precautions

!Burrs formed during molding may be left over on some parts of the chassis. Therefore,

pay attention to such burrs in the case of preforming repair of this system.

!Please use enough caution not to see the beam directly or touch it in case of an

adjustment or operation check.

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1.2 Preventing static electricity

Electrostatic discharge (ESD), which occurs when static electricity stored in the body, fabric, etc. is discharged, can destroy the laser

diode in the traverse unit (optical pickup). Take care to prevent this when performing repairs.

1.2.1 Grounding to prevent damage by static electricity

Static electricity in the work area can destroy the optical pickup (laser diode) in devices such as CD players.

Be careful to use proper grounding in the area where repairs are being performed.

(1) Ground the workbench

Ground the workbench by laying conductive material (such as a conductive sheet) or an iron plate over it before placing the

traverse unit (optical pickup) on it.

(2) Ground yourself

Use an anti-static wrist strap to release any static electricity built up in your body.

(3) Handling the optical pickup

• In order to maintain quality during transport and before installation, both sides of the laser diode on the replacement optical

pickup are shorted. After replacement, return the shorted parts to their original condition.

(Refer to the text.)

• Do not use a tester to check the condition of the laser diode in the optical pickup. The tester's internal power source can easily

destroy the laser diode.

1.3 Handling the traverse unit (optical pickup)

(1) Do not subject the traverse unit (optical pickup) to strong shocks, as it is a sensitive, complex unit.

(2) Cut off the shorted part of the flexible cable using nippers, etc. after replacing the optical pickup. For specific details, refer to the

replacement procedure in the text. Remove the anti-static pin when replacing the traverse unit. Be careful not to take too long a

time when attaching it to the connector.

(3) Handle the flexible cable carefully as it may break when subjected to strong force.

(4) It is not possible to adjust the semi-fixed resistor that adjusts the laser power. Do not turn it.

1.4 Attention when traverse unit is decomposed

*Please refer to "Disassembly method" in the text for the CD pickup unit.

• Apply solder to the short land before the flexible wire is disconnected from the connector on the CD pickup unit.

(If the flexible wire is disconnected without applying solder, the CD pickup may be destroyed by static electricity.)

• In the assembly, be sure to remove solder from the short land after connecting the flexible wire.

(caption)

Anti-static wrist strap

Conductive material

(conductive sheet) or iron plate

CN601

Short sections

Flexible wire

Mechanism control board

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1.5 Important for laser products

1.CLASS 1 LASER PRODUCT

2.DANGER : Invisible laser radiation when open and inter

lock failed or defeated. Avoid direct exposure to beam.

3.CAUTION : There are no serviceable parts inside the

Laser Unit. Do not disassemble the Laser Unit. Replace

the complete Laser Unit if it malfunctions.

4.CAUTION : The CD,MD and DVD player uses invisible

laser radiation and is equipped with safety switches which

prevent emission of radiation when the drawer is open and

the safety interlocks have failed or are defeated. It is

dangerous to defeat the safety switches.

5.CAUTION : If safety switches malfunction, the laser is able

to function.

6.CAUTION : Use of controls, adjustments or performance of

procedures other than those specified here in may result in

hazardous radiation exposure.

REPRODUCTION AND POSITION OF LABELS

Please use enough caution not to

see the beam directly or touch it

in case of an adjustment or operation

check.

WARNING LABEL

CAUTION : Visible and Invisible

laser radiation when open and

interlock failed or defeated.

AVOID DIRECT EXPOSURE TO

BEAM. (e)

VARNING : Synlig och

osynling laserstrålning när

den öppnas och spärren är

urkopplad. Betrakta ej

strålen. (s)

VARO : Avattaessa ja suojalukitus

ohitettuna tai viallisena olet alttiina

näkyvälle ja näkymättömälle

lasersäteilylle. Vältä säteen

kohdistumista suoraan itseesi. (f)

ADVARSEL : Synlig og usynlig

laserstråling når maskinen er

åben eller interlocken fejeler.

Undgå direkte eksponering til

stråling. (d)

CLASS 1

LASER PRODUCT

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1-6 (No.MA159)

SECTION 2

SPECIFIC SERVICE INSTRUCTIONS

This service manual does not describe SPECIFIC SERVICE INSTRUCTIONS.

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SECTION 3

DISASSEMBLY

3.1 Main body section

3.1.1 Removing the front panel assembly

(See Fig.1)

(1) Push the detach button in the lower right part of the front

panel assembly.

(2) Remove the front panel assembly.

Fig.1

3.1.2 Removing the heat sink

(See Fig.2)

Reference:

Remove the front panel assembly as required.

(1) From the left side of the main body, remove the two screws

Aand three screws Battaching the heat sink.

(2) Remove the heat sink from the main body.

Fig.2

Front panel assembly

Detach button

Heat sink

AAB

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3.1.3 Removing the top chassis assembly

(See Figs.3 to 6)

• Prior to performing the following procedures, remove the heat

sink.

Reference:

Remove the front panel assembly as required.

(1) From the bottom side of the main body, remove the two

screws Cattaching the top chassis assembly to the bottom

chassis assembly. (See Fig.3.)

(2) From the both and rear sides of the main body, remove the

four screws Dattaching the top chassis assembly to the

bottom chassis assembly. (See Figs.4 to 6.)

(3) Remove the two screws Eattaching the IC heat sink. (See

Fig.5.)

(4) Lift the top chassis assembly in the direction of the arrow,

disconnect the connector CN503 on the mechanism con-

trol board from the connector CN721 on the main board.

(See Figs.4 to 6.)

(5) Take out the top chassis assembly from the bottom chassis

assembly.

Fig.3

Fig.4

Fig.5

Fig.6

Top chassis assembly

Bottom chassis assembly

Top chassis assembly

CN503

CN721

Main board

Mechanism control board

Top chassis assembly

Bottom chassis assembly

Mechanism control board

IC heat sink

Top chassis assembly

Bottom chassis assembly Rear bracket

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3.1.4 Removing the front chassis assembly

(See Figs.7 and 8)

• Prior to performing the following procedure, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the both sides of the top chassis assembly, remove

the two screws Fattaching the front chassis assembly.

(2) Remove the front chassis assembly from the top chassis

assembly.

Fig.7

Fig.8

3.1.5 Removing the CD mechanism assembly

(See Fig.9)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

Reference:

Remove the front chassis assembly as required.

(1) From the inside of the top chassis assembly, remove the

three screws Gattaching the CD mechanism assembly.

(2) Release the mecha heat sink from the joints aon the mech-

anism control board and remove the heat sink from the

main body.

(3) Take out the CD mechanism assembly from the top chas-

sis.

Fig.9

Top chassis assembly

Front chassis assembly

Top chassis assembly

Front chassis assembly

Top chassis

Mecha heat sink

G G

CD mechanism assembly

Mechanism control board

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1-10 (No.MA159)

3.1.6 Removing the main board

(See Figs.10 and 11)

• Prior to performing the following procedures, remove the front

panel assembly, heat sink and top chassis assembly.

(1) From the rear side of the bottom chassis assembly, remove

the two screws Hattaching the rear bracket to the bottom

chassis assembly. (See Fig.10.)

(2) From the top side of the bottom chassis assembly, remove

the two screws Jattaching the main board to the bottom

chassis assembly. (See Fig.11.)

(3) Release the stopper of the connector CN701 on the main

board in an upward direction, disconnect the card wire from

the connector CN701. (See Fig.11.)

(4) Disconnect the wire from the connector of the front door

mechanism assembly. (See Fig.11.)

(5) Disconnect the wire from the connector CN991 on the main

board. (See Fig.11.)

Reference:

After connecting the wires, fix the wires with the wire

holders.

(6) Take out the main board from the bottom chassis assem-

bly.

Fig.10

Fig.11

Rear bracket

Bottom chassis assembly

Connector

Wire holders CN701

Stopper

Bottom chassis assembly

CN991

Wires

Main board

Card wire

Front door mechanism assembly

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