Lenovo 5468 Bedienungsanleitung

ThinkSystem SD650 Dual Node DWC Tray and

NeXtScale n1200 DWC Enclosure

Setup uide

Machine Type: 7X58 and 5468

Note

Before using this information and the product it supports, be sure to read and understand the safety

information and the safety instructions, which are available at:

http://thinksystem.lenovofiles.com/help/topic/safety_documentation/pdf_files.html

http://systemx.lenovofiles.com/help/topic/com.lenovo.sysx.safety.doc/safety_pdf.pdf

The server is intended for use in a system/rack always installed on the load side of Power Distribution Unit

(PDU) or Uninterruptible Power Supply (UPS) supplying a maximum 20 A branch circuit protection. The

overall system/rack connection to mains power is to be a Pluggable Type B connector.

In addition, be sure that you are familiar with the terms and conditions of the Lenovo warranty for your

solution, which can be found at:

http://datacentersupport.lenovo.com/warrantylookup

Third Edition (October 2018)

LIMITED AND RESTRICTED RIGHTS NOTICE: If data or software is delivered pursuant to a General Services

Administration (GSA) contract, use, reproduction, or disclosure is subject to restrictions set forth in Contract No

GS-35F-05925

Contents

Chapter 1 Introduction 1

Solution package contents . . . . . . . . . . . 1

Features. . . . . . . . . . . . . . . . . . . 1

Specifications . . . . . . . . . . . . . . . . 3

Upgrade existing NeXtScale nx360 M5 to

ThinkSystem SD650 . . . . . . . . . . . . 7

Management options. . . . . . . . . . . . . . 7

Chapter 2 Solution components 15

Front view . . . . . . . . . . . . . . . . . 17

Enclosure . . . . . . . . . . . . . . . 17

Tray . . . . . . . . . . . . . . . . . 17

Rear view . . . . . . . . . . . . . . . . . 18

Fan power control (FPC) module . . . . . . 19

Power supplies . . . . . . . . . . . . . 19

Internal cable routing. . . . . . . . . . . . . 21

2.5-inch drive models. . . . . . . . . . . 21

Internal Faceplate Transition (IFT) adapter. . . 21

Parts list. . . . . . . . . . . . . . . . . . 22

Power cords . . . . . . . . . . . . . . 27

Chapter 3 Solution hardware

setup 29

Solution setup checklist . . . . . . . . . . . 29

Installation uidelines . . . . . . . . . . . . 30

System reliability guidelines . . . . . . . . 31

Working inside the solution with the power

on . . . . . . . . . . . . . . . . . . 31

Handling static-sensitive devices . . . . . . 32

Install solution hardware options . . . . . . . . 32

Remove a DWC tray from the enclosure . . . 32

Remove the tray cover . . . . . . . . . . 34

Remove a DIMM. . . . . . . . . . . . . 34

Remove a drive . . . . . . . . . . . . . 37

Remove the M.2 backplane . . . . . . . . 39

Remove an adapter . . . . . . . . . . . 40

Remove an Internal Faceplate Transition (IFT)

adapter . . . . . . . . . . . . . . . . 42

Memory module installation . . . . . . . . 44

Install an M.2 drive into the M.2 backplane . . 51

Install the M.2 backplane . . . . . . . . . 54

Install a drive . . . . . . . . . . . . . . 55

Install an adapter . . . . . . . . . . . . 57

Install an Internal Faceplate Transition (IFT)

adapter . . . . . . . . . . . . . . . . 59

Install the tray cover . . . . . . . . . . . 61

Install a DWC tray in the enclosure. . . . . . 63

Install the enclosure in a rack . . . . . . . . . 64

Cable the enclosure . . . . . . . . . . . . . 64

Power on nodes . . . . . . . . . . . . . . 64

Power off nodes . . . . . . . . . . . . . . 65

Chapter 4 System configuration 67

Set the network connection for the Lenovo XClarity

Controller . . . . . . . . . . . . . . . . . 67

Update the firmware . . . . . . . . . . . . . 68

Configure the firmware . . . . . . . . . . . . 71

Memory configuration . . . . . . . . . . . . 71

RAID configuration . . . . . . . . . . . . . 72

Install the operating system . . . . . . . . . . 72

Back up the solution configuration . . . . . . . 73

Chapter 5 Resolving installation

issues 75

Appendix A Getting help and

technical assistance 79

Before you call . . . . . . . . . . . . . . . 79

Collecting service data . . . . . . . . . . . . 80

Contacting Support . . . . . . . . . . . . . 81

Index 83

ii ThinkSystem SD650 Dual Node DWC Tray and NeXtScale n1200 DWC Enclosure Setup uide

Chapter 1 Introduction

The ThinkSystem SD650 Dual Node DWC Tray and NeXtScale n1200 DWC Enclosure is a 6U solution

designed for high-volume network transaction processing. This solution includes a single enclosure that can

contain up to six ThinkSystem SD650 trays, which are designed to deliver a dense, scalable platform for

distributed enterprise and hyperconverged solutions.

Figure 1. Enclosure with six ThinkSystem SD650 trays installed

The solution comes with a limited warranty. For details about the warranty, see:

https://support.lenovo.com/us/en/solutions/ht503310

For details about your specific warranty, see:

http://datacentersupport.lenovo.com/warrantylookup

Solution package contents

When you receive your solution, verify that the shipment contains everything that you expected to receive.

The solution package includes the following items:

Note: Some of the items listed are available on select models only.

• DWC tray

• Enclosure

• Rail installation kit (optional). Detailed instructions for installing the rail installation kit are provided in the

package with the rail installation kit.

• Material box, including items such as power cords, rack installation template, and accessory kit.

Features

Performance, ease of use, reliability, and expansion capabilities were key considerations in the design of

your solution. These design features make it possible for you to customize the system hardware to meet your

needs today and provide flexible expansion capabilities for the future.

Your solution implements the following features and technologies:

• Features on Demand

If a Features on Demand feature is integrated in the solution or in an optional device that is installed in the

solution, you can purchase an activation key to activate the feature. For information about Features on

Demand, see:

https://fod.lenovo.com/lkms

• Lenovo XClarity Controller (XCC)

The Lenovo XClarity Controller is the common management controller for Lenovo ThinkSystem solution

hardware. The Lenovo XClarity Controller consolidates multiple management functions in a single chip on

the node system board.

Some of the features that are unique to the Lenovo XClarity Controller are enhanced performance, higher-

resolution remote video, and expanded security options. For additional information about the Lenovo

XClarity Controller, see:

http://sysmgt.lenovofiles.com/help/topic/com.lenovo.systems.management.xcc.doc/product_page.html

• UEFI-compliant server firmware

Lenovo ThinkSystem firmware is Unified Extensible Firmware Interface (UEFI) 2.5 compliant. UEFI

replaces BIOS and defines a standard interface between the operating system, platform firmware, and

external devices.

Lenovo ThinkSystem solutions are capable of booting UEFI-compliant operating systems, BIOS-based

operating systems, and BIOS-based adapters as well as UEFI-compliant adapters.

Note: The solution does not support DOS (Disk Operating System).

• Active Memory

The Active Memory feature improves the reliability of memory through memory mirroring. Memory

mirroring mode replicates and stores data on two pairs of DIMMs within two channels simultaneously. If a

failure occurs, the memory controller switches from the primary pair of memory DIMMs to the backup pair

of DIMMs.

• Large system-memory capacity

The solution supports synchronous dynamic random-access memory (SDRAM) registered dual inline

memory modules (DIMMs) with error correcting code (ECC). For more information about the specific types

and maximum amount of memory, see “Specifications” on page 3.

• Integrated network support

The tray comes with an integrated 1-port igabit Ethernet controller with RJ-45 connector, which

supports connection to a 1000 Mbps network.

• Integrated Trusted Platform Module (TPM)

This integrated security chip performs cryptographic functions and stores private and public secure keys.

It provides the hardware support for the Trusted Computing roup (TC ) specification. You can

download the software to support the TC specification.

Trusted Platform Module (TPM) has two versions - TPM 1.2 and TPM 2.0. You can change the TPM

version from 1.2 to 2.0 and back again.

For more information on TPM configurations, see “Enable TPM/TCM” in the Maintenance Manual.

Note: For customers in the People’s Republic of China, a Lenovo-qualified TPM 2.0 adapter or a Trusted

Cryptographic Module (TCM) adapter (sometimes called a daughter card) may be pre-installed.

• Large data-storage capacity

The simple-swap solution models support the following drives:

– Supports up to four 2.5-inch simple-swap Serial ATA (SATA) hard disk drives per tray

– Supports up to two 2.5-inch simple-swap Serial ATA (SATA) NVMe solid-state drives per tray

2ThinkSystem SD650 Dual Node DWC Tray and NeXtScale n1200 DWC Enclosure Setup uide

• Light path diagnostics

Light path diagnostics provides LEDs to help you diagnose problems. For more information about the light

path diagnostics, see Light path diagnostics panel and Light path diagnostics LEDs.

• Mobile access to Lenovo Service Information website

The solution provides a QR code on the system service label, which is on the cover of the solution, that

you can scan using a QR code reader and scanner with a mobile device to get quick access to the Lenovo

Service Information website. The Lenovo Service Information website provides additional information for

parts installation, replacement videos, and error codes for solution support.

• Active Energy Manager

Lenovo XClarity Energy Manager is a power and temperature management solution for data centers. You

can monitor and manage the power consumption and temperature of Converged, NeXtScale, System x,

ThinkServer solutions and ThinkServer servers, and improve energy efficiency using Lenovo XClarity

Energy Manager.

• Optional power capabilities

The solution supports a maximum of six 1300-watt, 1500-watt or 2000-watt hot-swap power supplies.

Note: You cannot mix 1300-watt, 1500-watt and 2000-watt power supplies in the solution.

• ThinkSystem RAID support

The ThinkSystem RAID provides software RAID supports for RAID levels 0 and 1 while integrated on-

board hardware RAID supports for RAID levels 1.

Specifications

The following information is a summary of the features and specifications of the solution. Depending on the

model, some features might not be available, or some specifications might not apply.

Enclosure specifications

Ta le 1. Enclosure specifications

Specification Description

Power supply Supports six hot-swap ac power supplies

• 1300-watt ac

• 1500-watt ac

• 2000-watt ac

Important: Power supplies and redundant power supplies in the enclosure must be

with the same power rating, wattage or efficiency Level .

Fan power control (FPC)

module • Hot-swappable

Size 6U enclosure

• Height: 263.3 mm (10.37 inches)

• Depth: 914.5 mm (36 inches)

• Width: 447 mm (17.6 inches)

• Weight:

– Fully configured (stand-alone): approximately 135.5 kg (298 lbs)

– Empty enclosure (with midplane, FPC, and cables): approximately 25 kg (55 lbs)

Chapter 1.Introduction 3

Ta le 1. Enclosure specifications (continued)

Specification Description

Acoustical noise emissions Note: The following readings are worst case for the air cooling. The water cooling

results would be significantly less.

• Operation: 7.0 bels

• Idle: 6.5 bels

Heat output Approximate heat output:

• Minimum configuration (with one minimal configuration tray): 433 BTU per hour

(127 watts)

• Maximum configuration (with six maximal configuration trays): 40946 BTU per

hour (12000 watts)

Electrical input • Sine-wave input (50-60 Hz) required

• Input voltage range:

– Minimum: 200 V AC

– Maximum: 240 V AC

Water requirement • Minimum water flow rate: 6.0 liters per minute per enclosure, assuming 1.0 lpm

per compute tray with 6 trays per enclosure (1 tray consists of 2 compute nodes)

– For processors below 205 W: 6.0 liters per minute per enclosure, assuming 1.0

lpm per compute tray with 6 trays per enclosure (1 tray consists of 2 compute

nodes)

• Maximum pressure: 4.4 bars

Note: The water required to initially fill the system side cooling loop must be

reasonably clean, bacteria- free water (<100 CFU/ml) such as de-mineralized water,

reverse osmosis water, de-ionized water, or distilled water. The water must be

filtered with an in-line 50 micron filter (approximately 288 mesh). The water must be

treated with anti-biological and anti-corrosion measures.

4ThinkSystem SD650 Dual Node DWC Tray and NeXtScale n1200 DWC Enclosure Setup uide

Tray specifications

Ta le 2. Tray specifications

Specification Description

Size Tray

• Height: 41.0 mm (1.6 inches)

• Depth: 742.0 mm (29.2 inches)

• Width: 438.0 mm (17.25 inches)

• Weight estimation: 17.2 kg (38 lb)

Environment The SD650 tray complies with ASHRAE class A2 specifications.

The SD650 tray is supported in the following environment:

• Water Temperature:

– Operating: ASHRAE class W4: 2 - 45°C (35.6 - 113°F)

• Air temperature:

– Operating: ASHRAE class A2: 10 - 35°C (50 - 95°F); when the altitude exceeds

900 m (2953 ft), the maximum ambient temperature value decreases by 1°C

(1.8°F) with every 300 m (984 ft) of altitude increase.

– Solution off: 5 - 45°C (41 - 113°F)

– Shipping/storage: -40 - 60°C (-40 - 140°F)

• Maximum altitude: 3048 m (10 000 ft)

• Relative Humidity (non-condensing):

– Operating:

– ASHRAE Class A2: 8% - 80%, maximum dew point : 21°C (70°F)

– Shipment/storage: 8% - 90%

• Particulate contamination:

Airborne particulates and reactive gases acting alone or in combination with other

environmental factors such as humidity or temperature might pose a risk to the

solution. For information about the limits for particulates and gases, see

Particulate contamination .

Chapter 1.Introduction 5

Node specifications

Ta le 3. Node specifications

Specification Description

Processor (depending on the

model) • Supports up to two Intel Xeon series multi-core processors per node (1 tray

consists of 2 nodes)

• Level-3 cache

Notes:

1. Use the Setup utility to determine the type and speed of the processors in the

node.

2. For a list of supported processors, see http://www.lenovo.com/us/en/

serverproven/.

3. With certain processors installed, if UEFI Boot Mode is set to Legacy then PXE

Boot from the onboard igabit Ethernet port may not work as expected and is

not supported. The affected processors are all processors with embedded Omni

Path fabric. These are processors models that have an F at the end of the model

name and include (but not limited to) the following processor models:

• Intel Xeon old 6126F Processor

• Intel Xeon old 6130F Processor

• Intel Xeon old 6138F Processor

• Intel Xeon old 6142F Processor

• Intel Xeon old 6148F Processor

• Intel Xeon Platinum 8160F Processor

• Intel Xeon Platinum 8176F Processor

Memory • Slots: 12 DIMM slots per node (1 tray consists of 2 nodes)

• Minimum: 8 B (single DDR4 DIMM per processor)

• Maximum: 768 B

– 384 B (12 x 32 B RDIMM)

– 768 B (12 x 64 B LRDIMM)

• Type:

– PC4-21300 (dual-rank), 2666 MT/s, error correcting code (ECC), double-data-

rate 4 (DDR4) registered DIMM (RDIMM) or load reduced DIMM (LRDIMM)

• Supports (depending on the model):

– 8 B, 16 B, and 32 B size DIMMs

– 64 B LRDIMM

Drive bays Supports up to two 2.5-inch simple-swap SATA/NVMe drive bays per node (1 tray

consists of 2 nodes).

Attention: As a general consideration, do not mix standard 512-byte and advanced

4-KB format drives in the same RAID array because it might lead to potential

performance issues.

Supports the following 2.5-inch simple-swap drive:

• Two 2.5-inch 7mm SATA solid-state drives per node (1 tray consists of 2 nodes)

• One 2.5-inch 15mm SATA/NVMe hard disk drive/solid-state drive per node (1 tray

consists of 2 nodes)

6ThinkSystem SD650 Dual Node DWC Tray and NeXtScale n1200 DWC Enclosure Setup uide

Dieses Handbuch passt für folgende Modelle

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