Microchip Technology RN4020 Bedienungsanleitung

2014-2022 Microchip Technology Inc. DS50002279D-page 1

RN4020

Features

• Fully certified Bluetooth®version 4.1 module

• On-board Bluetooth Low Energy 4.1 stack

• ASCII command interface API over UART

• Device Firmware Upgrade (DFU) over UART or Over

the Air (OTA)

• Microchip Low-energy Data Profile (MLDP) for serial

data applications

• Remote commands over-the-air

• 64 KB internal flash

• Compact form factor: 11.5 mm x 19.5 mm x 2.5 mm

• Castellated SMT pads for easy and reliable PCB

mounting

• Environmentally friendly, RoHS compliant

• Certifications: FCC, ISED, CE, QDID, VCCI, KCC

and NCC

Operational

• Single operating voltage: 1.8V to 3.6V (3.3V typical)

• Temperature range: -30°C to 85°C

• Low-power consumption

• Simple, UART interface

• Integrated Crystal, I2C Interface, Internal Voltage

Regulator, Matching Circuitry, and PCB Antenna

• Multiple IOs for control and status

• GPIO, ADC

• Three Pulse Width Modulation (PWM) outputs

RF/Analog Features

• ISM Band 2.402 to 2.480 GHz operation

• Channels 0-39

• RX Sensitivity: -92.5 dBm at 0.1% BER

• TX Power: -19.0 dBm to +7.5 dBm

• RSSI Monitor

MAC/Baseband/Higher Layer Features

• Secure AES128 encryption

• GAP, GATT, SM, L2CAP, and integrated public

profiles

• Create custom services using command API

• Keyboard I/O Authentication

• Software configurable role as peripheral or central

and client or server

• Built-in scripting capabilities for hostless operation

Applications

• Health/Medical Devices

- Glucose meters

- Heart rate

-Scale

• Sports Activity and Fitness

- Pedometer

- Cycling computer

- Heart rate

• Retail

- Point of Sale (POS)

- Asset tagging and tracking

- Proximity advertising

• Beacon Applications

• Internet of Things (IoT) Sensor tag

• Remote Control

- Embedded Device Control

- AV consoles and game controllers

• Wearable Smart Devices and Accessories

• Industrial Control

- Private (custom) services

- Low bandwidth cable replacement

• Smart Energy/Smart Home

Description

Microchip’s RN4020 Bluetooth Low Energy Module pro-

vides a highly integrated solution for delivering low-power

Bluetooth 4.1 solutions. The advanced command inter-

face offers rapid time to market. The RN4020 module

complies with Bluetooth specification version 4.1. The

module integrates RF, a baseband controller, and a com-

mand API processor, making it a complete Bluetooth Low

Energy solution. The RN4020 can be used with ultra-low

cost microcontroller for intelligent Bluetooth Low Energy

applications. For simple sensor applications, the RN4020

internal scripting capabilities enable basic functions to be

implemented without the need for external host MCU or

software development tools.

Bluetooth®Low Energy Module

RN4020

DS50002279D-page 2 2014-2022 Microchip Technology Inc.

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Most Current Data Sheet

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http://www.microchip.com

You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.

The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).

Errata

An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current

devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision

of silicon and revision of document to which it applies.

To determine if an errata sheet exists for a particular device, please check with one of the following:

• Microchip’s Worldwide Web site; http://www.microchip.com

• Your local Microchip sales office (see last page)

When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are

using.

Customer Notification System

Table of Contents

1.0 Device Overview........................................................................................................................................................................... 3

2.0 General Specifications.................................................................................................................................................................. 6

3.0 Microcontroller to RN4020 Interface ............................................................................................................................................. 7

4.0 Physical Dimensions .................................................................................................................................................................... 8

5.0 Typical Application Schematic .................................................................................................................................................... 11

6.0 ASCII Command API .................................................................................................................................................................. 12

7.0 Supported Services .................................................................................................................................................................... 13

8.0 Regulatory Approval ................................................................................................................................................................... 15

9.0 Ordering Information................................................................................................................................................................... 21

Appendix A: Revision History ............................................................................................................................................................... 23

The Microchip Web Site ....................................................................................................................................................................... 25

Customer Change Notification Service ................................................................................................................................................ 25

Customer Support ................................................................................................................................................................................ 25

2014-2022 Microchip Technology Inc. DS50002279D-page 3

RN4020

1.0 DEVICE OVERVIEW

The RN4020 Bluetooth Low Energy RF module

integrates Bluetooth 4.1 radio baseband, MCU, digital

analog I/O, on-board stack, and ASCII command API.

Figure 1-1 shows the top view of the module. The

pinout of the module is shown in Figure 1-2, and the

description is presented in Tab l e 1 - 1 . Figure 1-3 lists all

the key components of the module.

FIGURE 1-1: RN4020 TOP VIEW

FIGURE 1-2: RN4020 PIN DIAGRAM

FIGURE 1-3: RN4020 BLOCK DIAGRAM

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High-Performance

Integrated Antenna

128b AES Encryption

GPIO

10-bit ADC

UART

BTLE v 4.1 Core

with BT SIG Certified

Firmware GATT/GAP

UART Interface

3x Analog I/O

4 PWM I/O, I2C Comm.

1.8 –3.6V

Radio

Modem

64KB serial

Flash for

User profiles

and scripts

Crystal

RN4020 Bluetooth©4.1 Low Energy Module

VReg

RN4020

DS50002279D-page 4 2014-2022 Microchip Technology Inc.

TABLE 1-1: PIN DESCRIPTION

Pin Name Description Function

1 GND Ground Ground

2 AIO2 Bi-directional with programmable analog I/O 1.35V and 30 mA max out

3 AIO1 Bi-directional with programmable analog I/O 1.35V and 30 mA max out

4 AIO0 Bi-directional with programmable analog I/O 1.35V and 30 mA max out

5 UART TX UART Transmit (TX) Output

6 UART RX UART Receive (RX) Input

7 WAKE_SW

Deep Sleep Wake; active-high to wake module from

Deep Sleep. If the module runs without a host micro-

controller, connect the UART_RX pin to VDD via a

10K resistor to conserve power in Deep Sleep.

Input; weak pull down

8CMD/MLDP

Command or MLDP mode – In Command mode,

UART traffic is sent to the command interpreter. In

MLDP mode, UART traffic is routed to the MLDP

Bluetooth®LED connection, if active.

Input; Edge triggered; Change

from High to Low to enter CMD

mode from MLDP mode

9 GND Ground Ground

CONNECTION

LED

PIO[1]

SCK

PWM1

Default state is output. Active-high indicates the

module is connected to a remote device. Active-low

indicates a disconnected state. Configurable as

PIO[1] via software command. SCK for Diagnostics

and Factory Calibration if pin 17 is asserted.

• Connection Status Indicator

(Green LED)

• PIO[1]

•SCK

•PWM1

MLDP_EV

PIO[2]

PWM2

Default function is output used for MLDP data event

indicator (Red LED). Active-high indicates MLDP

data received or UART console data pending. Low

level indicates no events. Event is only triggered in

MLDP mode, when CMD/MLDP (pin 8) is high.

Configurable as PIO[2] via “|I” and “|O” commands.

CS for Diagnostics and Factory Calibration if pin 17

is asserted.

• MLDP Data Indicator (Red

LED)

• PIO[2]

•CS

•PWM2

PIO[3]

MOSI

PWM3

Default function is an output used for Activity

Indicator (Blue LED). High level indicates module is

awake and active. Low level indicates module is in a

Sleep state. Accessible as PIO[3] via “|>” and “|<”

commands. MOSI for Diagnostics and Factory

Calibration if pin 17 is asserted.

• WS (Blue LED)

• PIO[3]

•MOSI

•PWM3

13 PIO[4]

MISO

MISO for Diagnostics and Factory Calibration if pin

17 asserted.

• PIO[4]

•MISO

14 CTS

PIO[5]

Reserved for CTS if hardware flow control is enabled

on the UART; active-low.

• CTS (input)

• PIO[5]

2014-2022 Microchip Technology Inc. DS50002279D-page 5

RN4020

15 WAKE_HW

Hardware wake from Dormant state. Setting the

WAKE_HW (pin15) high wakes the module from Dor-

mant mode. During the module power up, if

WAKE_HW pin is flipped high and low for three

cycles (putting the WAKE_HW pin into high, low, and

then high again is considered as one flip cycle) in the

first five seconds, then the module performs a factory

Reset. If the WAKE_SW pin is high when a factory

Reset is performed, the factory Reset is a full reset.

Otherwise, it is a partial reset that retains the device

name, private service and scripts. Set WAKE_HW

pin to low in order to lower power consumption in

Deep Sleep and Dormant modes.

Active-high; internal pull down

16 GND Ground Ground

17 SPI/PIO SPI/PIO for pins 10-13; active-high Input with internal pull down;

selects SPI on pins 10-13

18 RTS

PIO[6]

Reserved for RTS if hardware flow control on UART

is enabled. If the data transmission to RN4020 must

be halted, assert RTS to high. RTS pin operates

independently from the CTS (pin 14).

• RTS (output)

• PIO[6]

19 PWM4

PIO[7] Spare PIO PIO[7]; Spare PIO configurable as

input or output

20 RSVD Do not connect. Factory diagnostics. No Connect

21 SDA SDA Data line of the I2C interface. The RN4020

always acts as the I2C Host. SDA

22 SCL I2C Clock SCL

23 VDD Supply voltage 1.8 to 3.6V

24 GND Ground Ground

TABLE 1-1: PIN DESCRIPTION (CONTINUED)

Pin Name Description Function

CAUTION

A full factory Reset erases scripts and sets the

device name to the serialized name. For more

information, refer to the SF Command in the

RN4020 Bluetooth Low Energy User's Guide

(DS70005191).

RN4020

DS50002279D-page 6 2014-2022 Microchip Technology Inc.

2.0 GENERAL SPECIFICATIONS

Table 2-1 provides the general specifications of the

module. Tab l e 2-2 and Tab l e 2-3 shows the weight and

dimensions, and electrical characteristics of the mod-

ule. Table 2-4 and Table 2-5 specify the current con-

sumption of the module.

TABLE 2-1: GENERAL SPECIFICATIONS

Specification Description

Standard Bluetooth®4.1

Frequency Band 2.4 ~ 2.48 GHz

Modulation Method GFSK

Maximum Data Rate 1 Mbps

Antenna PCB

Interface UART, PIO, AIO, SPI

Operation Range 100 meters(1)

Sensitivity -92.5 dBm at 0.1% BER

RF TX Power -19.0 dBm to +7.5 dBm

Temperature (operating) -30°C to +85°C

Temperature (storage) -40°C to +85°C

Humidity 10% ~ 90%

non-condensing

Note 1: Maximum range under ideal conditions

such as RF matching, line of sight, maxi-

mum power. Actual results may vary

depending on the customer’s design.

TABLE 2-2: WEIGHT AND DIMENSIONS

Specification Description

Dimensions 11.5 mm x 19.5 mm x 2.5 mm

Weight 1.2g

TABLE 2-3: ELECTRICAL

CHARACTERISTICS

Specification Description

Supply Voltage 1.8 to 3.6V DC

Working current Depends on profiles, 12 mA

typical

TABLE 2-4: CURRENT CONSUMPTION

Mode Typical Current at 3V

Dormant <900 nA

Deep Sleep <5.0 µA

Idle <1.5 mA

TX/RX active 16 mA

TABLE 2-5: CURRENT CONSUMPTION VS

RF TX POWER

RN4020, VDD = 3.3V, 25°C

TX Power (dBm) Id (mA)

-19.1 14.0

-15.1 14.4

-10.9 15.0

-6.9 15.9

-2.5 17.6

1.6 20.7

5.8 26.9

7.5 33.6

2014-2022 Microchip Technology Inc. DS50002279D-page 7

RN4020

3.0 MICROCONTROLLER TO

RN4020 INTERFACE

Figure 3-1 illustrates the interface between PIC

microcontroller and the RN4020 module.

The minimum interface consists of UART and

WAKE_HW lines. This enables the microcontroller to

communicate with the RN4020 module using ASCII

command API. The command API is described in

Section 6.0 “ASCII Command API”.

3.1 CTS/RTS Hardware Flow Control

For customer applications using the Microchip Low-

energy Data Profile, Pin 8 (CMD/MLDP) is required.

CTS/RTS hardware control is also required for this

service to avoid buffer overruns.

3.2 Microchip Low-energy Data Profile

(MLDP)

The Microchip Low-energy Data Profile is a private

BTLE service that provides a 50 kbps serial data trans-

port over Bluetooth Low Energy on the RN4020. Pin 8

(CMD/MLDP) is required. CTS/RTS hardware control

is also highly recommended for this service to avoid

data loss.

For more information on how to use the MLDP data ser-

vice, refer to RN4020 Bluetooth Low Energy

Module User’s Guide (DS70005191).

FIGURE 3-1: INTERFACE DESCRIPTION

Note: If the RN4020 is operated in a hostless mode (without a microcontroller), set the UART_RX pin to high

via a 10K resistor to reduce power consumption in Deep Sleep mode.

RN4020

DS50002279D-page 8 2014-2022 Microchip Technology Inc.

4.0 PHYSICAL DIMENSIONS

Figure 4-1 shows the physical dimensions for RN4020

module. Figure 4-2 illustrates the recommended PCB

layout. It is recommended that when laying out the

carrier board for the RN4020 module, the areas under

the antenna, RF test point (semi-circular pad), and

shielding connections do not contain surface traces,

ground planes, or exposed vias.

Figure 4-3 specifies the recommended mounting

details. For optimal radio performance, it is recom-

mended that the antenna end of the RN4020 module

protrudes at least 31 mm beyond any metal enclosure.

Figure 4-4 shows an example of good and acceptable

positioning of the RN4020 on the host PCB.

FIGURE 4-1: RN4020 MODULE DIMENSIONS

2014-2022 Microchip Technology Inc. DS50002279D-page 9

RN4020

FIGURE 4-2: RN4020 RECOMMENDED PCB FOOTPRINT

FIGURE 4-3: RN4020 MODULE MOUNTING DETAILS

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DS50002279D-page 10 2014-2022 Microchip Technology Inc.

FIGURE 4-4: RN4020 HOST PCB EXAMPLE LAYOUT

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