Murata GRM32ER61E226ME15 Series Bedienungsanleitung

GRM32ER61E226ME15_ (1210, X5R:EIA, 22uF, DC25V)

_: packaging code Reference Sheet

1.Scope

2.MURATA Part NO. System

(Ex.)

3. Type & Dimensions

(Unit:mm)

4.Rated value

5.Package

Product specifications in this catalog are as of Mar.7,2016,and are subject to change or obsolescence without notice.

Please consult the approval sheet before ordering.

Please read rating and !Cautions first.

1.0 min.

(1)-1 L

3.2±0.3

(1)-2 W

2.5±0.2

Chip Monolithic Ceramic Capacitor for General

mark

(4)

Rated

Voltage

Packaging Unit

DC 25 V

Temp. Range

(Ref.Temp.)

(8) Packaging

Temp. coeff

or　Cap. Change

This product specification is applied to Chip Monolithic Ceramic Capacitor used for General Electronic equipment.

(2) T

2.5±0.2

-55 to 85 °C

-15 to 15 %

-55 to 85 °C

(25 °C)

(6)

Capacitance

Tolerance

22 uF

Specifications and Test

Methods

(Operating

Temp. Range)

±20 %

(3) Temperature Characteristics

(Public STD Code):X5R(EIA)

0.3 min.

(5) Nominal

Capacitance

f180mm Reel

EMBOSSED W8P4

1000 pcs./Reel

f330mm Reel

EMBOSSED W8P4

4000 pcs./Reel

(1)L/W

Dimensions

(2)T

Dimensions

(3)Temperature

Characteristics

(4)Rated

Voltage

(5)Nominal

Capacitance

(6)Capacitance

Tolerance

(8)Packaging Code



Code

GRM 32 ER6 1E 226 M E15 L

GRM32ER61E226ME15-01 1

■Specifications and Test Methods

1 Rated Voltage Shown in Rated value. The rated voltage is defined as the maximum voltage which may be

applied continuously to the capacitor.

When AC voltage is superimposed on DC voltage, VP-P or VO-P,

whichever is larger, should be maintained within the rated voltage

range.

2 Appearance No defects or abnormalities. Visual inspection.

3 Dimension Within the specified dimensions. Using calipers. (GRM02 size is based on Microscope)

4 Voltage proof No defects or abnormalities.

Measurement Point　　 :

Between the terminations

Test Voltage 　　　　　　 :

250% of the rated voltage

Applied Time :

1 to 5 s

Charge/discharge current :

50mA max.

5 Insulation Resistance(I.R.) 

Measurement Point 　　: Between the terminations

Measurement Voltage :

DC Rated Voltage

Charging Time :

1 min

Charge/discharge current :

50mA max.

Measurement Temperature :

Room Temperature

6 Capacitance Shown in Rated value.

Measurement Temperature :

Room Temperature

7 Dissipation Factor (D.F.) B1,R1,B3,R6,R7,C6,C7,C8,E7,D7 : 0.1 max.

D8,GRM31CR60J107 : 0.15 max

GRM31CR71E106 : 0.125

max

*1 For items listed in Table 1 on the left, the capacitance should

be measured using a voltage of 0.5+/-0.1Vrms instead of

1.0+/-0.2Vrms.

*2 For item GRM188R70J105, the capacitance should be measured

using a voltage of 1.0+/-0.2Vrms instead of 0.5+/-0.1Vrms.

Temperature No bias B1,B3 : Within +/-10% (-25°C to +85°C) The capacitance change should be measured after 5 min.

Characteristics R1,R7 : Within +/-15% (-55°C to +125°C) at each specified temp. stage.

of Capacitance R6 : Within +/-15% (-55°C to +85°C) In case of applying voltage, the capacitance change should be

C6 : Within +/-22% (-55°C to +85°C) measured after 1 min. with applying voltage in equilibration of

C7 : Within+/-22% (-55°C to +125°C) each temp. stage.

C8 : Within +/-22% (-55°C to +105°C) Capacitance value as a reference is the value in step 3.

E7 : Within +22/-56% (-55°C to +125°C)

D7 : Within +22/-33% (-55°C to +125°C) · Measurement Voltage

D8 : Within +22/-33% (-55°C to +105°C) GRM152 B3 0J 104/224, GRM155 B1 0J 124 to 334,

GRM155 B3 0J 394 to 824, GRM155 B3 1A 124 to 105,

GRM188B10G106, GRM21BB10J106 　only : 0.20+/-0.05Vrms

50% of B1: Within +10/-30% 　GRM21B R7 1A/1C 475 K/M E51, GRM219 R7 1A/1C 225

the rated R1: Within +15/-40% only : 0.5+/-0.1Vrms

voltage GRM188R61H474 only : 1.5+/-0.3Vrms

･Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

9 Adhesive Strength No removal of the terminations or other defect Solder the capacitor on the test substrate shown in Fig.3.

of Termination should occur.

Holding Time : 10+/-1s

Applied Direction : In parallel with the test substrate and vertical with the

capacitor side.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

SolderResist

ChipCapacitor

Land

Capacitance

Frequency

Voltage

*1 C≦

(10V min.)

1.0+/-0.1kHz

1.0+/-0.2Vrms

*2 C≦

(6.3V max.)

1.0+/-0.1kHz

0.5+/-0.1Vrms

C＞

120+/-24Hz

0.5+/-0.1Vrms

Step

Temperature(C)

Applying Voltage(VDC)

Reference Temp.+/-2

No bias

Min.Operating Temp. +/-3

Reference Temp. +/-2

Max.Operating Temp. +/-3

Reference Temp. +/-2

50% of

the rated voltage

(For B1,R1)

Min.Operating Temp. +/-3

Reference Temp. +/-2

Max.Operating Temp.+/-3

*Table 1

GRM033 B3/R6 1A 123 to 823

GRM033 B3/R6 1A 104

GRM155 B3/R6 1A124 to 105

GRM185 B3/R6 1C/1A105

GRM185 C8/D7 1A 105

GRM188 B3/R6 1C/1A225

GRM188 R7/C8/D7 1A 225

GRM188 B3/R6 1A 335

GRM219 B3/R6 1C/1A475

GRM219 C8 1A 475

GRM219 B3/R6 1A 106

GRM21B B3/R6 1C/1A 106

GRM21B R7/C8 1A 106

GRM319 B3/R6 1C/1A106

JEMCGS-0052AM 2

10 Vibration  Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Capacitance Within the specified initial value.

D.F. Within the specified initial value.

Kind of Vibration :

A simple harmonic motion

10Hz to 55Hz to 10Hz (1min)

Total amplitude :

1.5mm

This motion should be applied for a period of 2h in each 3 mutually

perpendicular directions(total of 6h).

11 Substrate Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.1.

Bending test

Capacitance Within +/-10% Pressurization method : Shown in Fig.2

Change Flexure　　　　: 1mm

Holding Time 　 :

5+/-1s

Soldering Method :

Reflow soldering

12 Solderability 95% of the terminations is to be soldered evenly and

Test Method :

Solder bath method

continuously. Flux Solution of rojin ethanol 25(wt)%

Preheat :

80℃to 120℃for 10s to 30s

Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

245+/-5℃

Immersion time

2+/-0.5s

Resistance Appearance No defects or abnormalities. <GRM03 size min.>

to Test Method : Solder bath method

Soldering Solder : Sn-3.0Ag-0.5Cu

Heat Solder Temp. :

270+/-5℃

Immersion time

10+/-0.5s

Capacitance B1,R1,B3,R6,R7,C6,C7,C8,E7,D7,D8 　: Within +/-7.5% Exposure Time : 24+/-2h

Change GRM188B30J106M : Within +/-12.5% Preheat : GRM31 size max.: 120℃to 150℃for 1 min

　GRM32 size　　　 : 100℃to 120℃for 1 min

and 170℃to 200℃for 1 min

· Initial measurement

D.F. Within the specified initial value. Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Test Method : Reflow soldering (hot plate)

I.R. Within the specified initial value. Solder : Sn-3.0Ag-0.5Cu

Solder Temp. :

270+/-5℃

Reflow Time : 10+/-0.5s

Test Substrate : Glass epoxy PCB

Voltage proof No defects. Exposure Time : 24+/-2h

Preheat :

120℃to 150℃for 1 min

· Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Temperature Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Sudden Change Perform the five cycles according to the four heat treatments

shown in the following table.

Capacitance B1,R1,B3,R6,R7,C6,C7,C8,D7,D8 : Within +/-7.5%

Change E7 : Within +/-30%

D.F. Within the specified initial value.

I.R. Within the specified initial value. Exposure Time : 24+/-2h

· Initial measurement

Voltage proof No defects. Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

·GRM188B30J106M Measurement after test:

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

15 High Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Temperature

Test Temperature :

40+/-2℃

High

Test Humidity :

90%RH to 95%RH

Humidity Capacitance Within +/-12.5%

Test Time :

500+/-12h

(Steady) Change

Applied Voltage :

DC Rated Voltage

Charge/discharge current : 50mA max.

D.F. 0.2 max.

Exposure Time :

24+/-2h

· Initial measurement

I.R.

∙F Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

· Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Item

Specification

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

SolderResist

ChipCapacitor

Land

Step

Temp.(C)

Time

(min)

Min.Operating Temp.+0/-3

30+/-3

Room Temp

2 to 3

Max.Operating Temp.+3/-0

30+/-3

Room Temp

2 to 3

JEMCGS-0052AM 3

16 Durability Appearance No defects or abnormalities. Solder the capacitor on the test substrate shown in Fig.3.

Test Temperature :

Max. Operating Temp. +/-3℃

Capacitance Within +/-12.5%

Test Time :

1000+/-12h

Change

Applied Voltage :

150% of the rated voltage

Charge/discharge current : 50mA max.

Exposure Time :

24+/-2h

D.F. 0.2 max. · Initial measurement

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

I.R.  · Measurement after test

Perform a heat treatment at 150+0/-10°C for 1h and then

let sit for 24+/-2h at room temperature,then measure.

Test method : Substrate Bending test

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm (GRM02/GRM03/GRM15: t:0.8mm)

Copper foil thickness : 0.035mm

: Solder resist

(Coat with heat resistant resin for solder)

Fig.1 (in mm)

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Pressurization method

Fig.2 (in mm)

Adhesive Strength of Termination, Vibration, Temperature Sudden Change, Resistance to Soldering Heat (Reflow method)

High Temperature High Humidity(Steady) , Durability

・Test substrate

Material : Copper-clad laminated sheets for PCBs

(Glass fabric base, epoxy resin)

Thickness : 1.6mm or 0.8mm

Copper foil thickness : 0.035mm

・Kind of Solder : Sn-3.0Ag-0.5Cu

・Land Dimensions

　Fig.3

Test Method

(Ref. Standard:JIS C 5101, IEC60384）

Item

Specification

Type Applied Force(N)

GRM02 1

GRM03 2

GRM15/GRM18 5

GRM21/GRM31/GRM32 10

SolderResist

ChipCapacitor

Land

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

100

Land

f4.5

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

Flexure

Capacitance meter

Pressurization

speed

1.0mm/s

Support

Capacitor

Pressurize

50 min.

Type

Dimension (mm)

GRM02

0.2

0.56

0.23

GRM03

0.3

0.9

0.3

GRM15

0.4

1.5

0.5

GRM18

1.0

3.0

1.2

GRM21

1.2

4.0

1.65

GRM31

2.2

5.0

2.0

GRM32

2.2

5.0

2.9

JEMCGS-0052AM 4

1.Tape Carrier Packaging(Packaging Code:D/E/W/L/J/F/K)

1.1 Minimum Quantity(pcs./reel)

1.2 Dimensions of Tape

(1)GRM01/02 (W4P1 CODE:L) (in:mm)

*3 Nominal value

10000(W8P2)

50000(W8P2)

4000

GRM55

GRM43

GRM32

GRM31

GRM21

GRM15

5(LW Dimensions Tolerance:±0.2

and T Dimensions:0.5 +0/-0.1)

5(LWT Dimensions Tolerance:±0.1min.)

5(LWT Dimensions Tolerance:±0.05)

R/D/E

GRM01

GRM02

3/X

5 (LW Dimensions Tolerance:±0.1min.

and T Dimensions Tolerance:±0.05)

GRM03

GRM18

A/B

6/9

M/X

10000(W8P2)

4000

N/R/D

4000

50000(W4P1)

N/C/R/D

A/M

Package

GRM Type

15000(W8P2)

20000(W8P2)

10000(W8P2)

Paper Tape

Plastic Tape

Paper Tape

Plastic Tape

4000

30000(W8P1)

20000(W8P1)

40000(W4P1)

3000

2000

3000

300

50000(W8P2)

2000

1000

10000

500

1000

500

1000

500

3000

10000

40000(W8P2)

50000(W8P2)

10000

1500

Code:D/E

Code:W

Code:L

Code:J/ F

Code:K

8000

6000

4000

10000

6000

10000





Type

1500

5000

4000

5000

4000

2000

0.145

0.27

0.4 max.

0.2±0.02

0.23

0.43

0.125±0.013

0.4±0.05

0.25±0.013

Type

0.2±0.05

0.26

GRM02

GRM01

0.4±0.02

15000(W8P2)

50000(W8P2)

0.5 max.

0.46

Dimensions(Chip)

A *3

B *3

2.0±0.04

＊2

＊1

φ0.8±0.04

0.9±0.05

4.0±0.05

1.8±0.02

＊1,2：1.0±0.02

0.05以下

Ａ

Ｂ

0.15～0.4

*1,2：1.0±0.02

2.0±0.04

0.9±0.05

4.0±0.05

1.8±0.02

Ａ

Ｂ

0.05 max.

φ0.8±0.04

0.15～0.25

JEMCGP-01796E 5

　(2)GRM03/15(W8P2 CODE:D/E/J/F)

(in:mm)

L W

2 0.2 +0.02/-0.04

0.3±0.03 0.5 max.

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.3±0.09 0.6 max.

5 0.5±0.05

2 0.2 +0.02/-0.04

X 0.25±0.05

1.0±0.2 0.5±0.2 0.78 1.29

1.0±0.05 0.5±0.05 0.5±0.05

1.0±0.07 0.5±0.07 0.5±0.07

1.0±0.1 0.5±0.1 0.5±0.1 0.70 1.20

1.0±0.15 0.5±0.15 0.5±0.15 0.72 1.25

0.5 +0/-0.1

0.5±0.2

0.5±0.05 *3 Nominal value

　(3)GRM033/155(W8P1 CODE:W) (in:mm)

L W

0.6±0.03 0.3±0.03 0.3±0.03 0.37 0.67

0.6±0.05 0.3±0.05 0.3±0.05 0.39 0.69

0.6±0.09 0.3±0.09 0.3±0.09 0.44 0.74 0.6 max.

GRM15 5 1.0±0.05 0.5±0.05 0.5±0.05 0.65 1.15 0.8 max.

*3 Nominal value

0.5 max.

Dimensions(Chip)

A *3

B *3

1.0±0.2

0.5±0.2

0.65

0.78

1.15

1.29

0.74

0.8 max.

0.5±0.05

0.3±0.03

0.65

1.15

Type

Dimensions(Chip)

0.6±0.03

GRM03

0.6±0.09

0.3±0.03

0.3±0.09

Package

GRM Type

A *3

B *3

0.37

0.67

GRM03

GRM15

1.0±0.05

Type

0.44

*1,2：2.0±0.05

＊2

4.0±0.1

8.0±0.3

3.5±0.05

0.05以下

＊1

φ1.5

+0.1

-0

Ａ

*1,2：2.0±0.05

1.75±0.1

Ｂ

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

0.05 max.

1.0±0.05

4.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

1.0±0.05

JEMCGP-01796E 6

　(4)GRM18/21/31/32 (in:mm)

L W

1.6±0.1 0.8±0.1 1.05±0.10 1.85±0.10

50.5±0.05

6 0.6 +0/-0.1

7 0.7±0.1

1.6±0.1 0.8±0.1 0.8±0.1

8 1.6±0.15 0.8±0.15 0.8±0.15

1.6±0.2 0.8±0.2 0.8±0.2 1.10±0.10 2.00±0.10

0.6±0.1

0.6 +0/-0.15

0.85±0.05

0.85±0.1

0.85 +0.15/-0.1

0.85 +0/-0.2

2.0±0.15 1.25±0.15

0.85 +0.15/-0.05 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.0 +0/-0.2 1.45±0.20 2.25±0.20

2.0±0.2 1.25±0.2 1.0±0.2 1.50±0.20 2.30±0.20

2.0±0.1 1.25±0.1 1.25±0.1 1.45±0.20 2.25±0.20

B 2.0±0.15 1.25±0.15 1.25±0.15

2.0±0.2 1.25±0.2 1.25±0.2

6 0.6±0.1

3.2±0.2 1.6±0.2

B 1.25±0.1

1.15±0.1

1.15±0.15

X 1.2±0.1

1.6±0.2

3.2±0.3 1.6±0.3 1.6±0.3 2.10±0.20 3.60±0.20

9 0.85 +0.15/-0.05 2.80±0.20 3.60±0.20 1.15 max.

Paper Tape

A 1.0 +0/-0.2

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2 3.7 max.

Dimensions

of Tape

Package

GRM Type

1.15 max.

2.0±0.1

2.0±0.2

1.25±0.1

0.85±0.1

1.7 max.

Plastic Tape

Type

Dimensions(Chip)

1.6±0.2

Plastic Tape

2.5 max.

3.0 max.

2.5 max.

3.2±0.3

1.6±0.15

1.6±0.2

2.5±0.2

GRM32

2.80±0.20

3.50±0.20

1.7 max.

GRM31

2.00±0.20

3.60±0.20

1.15 max.

0.85±0.1

1.6±0.15

Paper Tape

1.90±0.20

3.50±0.20

1.7 max.

Plastic Tape

2.0 max.

1.50±0.20

2.30±0.20

3.2±0.15

3.2±0.2

GRM21

1.55±0.15

2.30±0.15

Paper Tape

1.05±0.10

1.85±0.10

1.25±0.2

0.8±0.2

0.8 max.

0.5 +0/-0.1

GRM18

1.10±0.10

2.00±0.10

4.0±0.1

2.0±0.1

φ1.5

+0.1

-0

1.75±0.1

8.0±0.3

3.5±0.05

Ａ

Ｂ

8.0±0.3

4.0±0.1

3.5±0.05

1.75±0.1

Ａ

Ｂ

2.0±0.1

φ1.5

+0.1

-0

4.0±0.1

0.25±0.1(T≦2.0mm)

0.3±0.1(T：2.5mm)

JEMCGP-01796E 7

(5)GRM43/55 (in:mm)

L W

M 1.15±0.1

N 1.35±0.15

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

S 2.8±0.2 4.7 max.

M 1.15±0.1

N 1.35±0.15

C 1.6±0.2

R 1.8±0.2

D 2.0±0.2

E 2.5±0.2

F 3.2±0.2 4.7 max.

*1 Nominal value

3.7 max.

4.5±0.4

3.2±0.3

5.7±0.4

5.0±0.4

GRM55

5.2

6.1

2.5 max.

3.7 max.

Package

GRM Type

GRM43

3.6

4.9

2.5 max.

Type

Dimensions(Chip)

A *1

B *1

φ1.5

+0.1

-0

4.0±0.1

8.0±0.1

φ1.5

+0.2

-0

12.0±0.3

5.5±0.1

1.75±0.1

Ａ

2.0±0.1

4.0±0.1

Ｂ

*：2.0±0.1

0.3±0.1

JEMCGP-01796E 8

Package

GRM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)



ｗ1

Top Tape : Thickness 0.06

Feeding Hole :As specified in 1.2.

Hole for Chip : As specified in 1.2.

Base Tape : As specified in 1.2.

Bottom Tape :Thickness 0.05

(Only a bottom tape existence )

GRM01/02

8.0 max.

5±1.5

GRM03/15/18/21/31/32

16.5 max.

10±1.5

GRM43/55

20.5 max.

14±1.5

-3.0



 min.



2.0±0.5

Chip

(in:mm)

Fig.1 Package Chips

Fig.2 Dimensions of Reel

Fig.3 Taping Diagram

JEMCGP-01796E 9

1.3 Tapes for capacitors are wound clockwise shown in Fig.3.

(The sprocket holes are to the right as the tape is pulled toward the user.)

1.4 Part of the leader and part of the vacant section are attached as follows.

(in:mm)

1.5 Accumulate pitch : 10 of sprocket holes pitch = 20±0.3mm(GRM01/02)

40±0.3mm(GRM03 min.)

1.6 Chip in the tape is enclosed by top tape and bottom tape as shown in Fig.1.

1.7 The top tape and base tape are not attached at the end of the tape for a minimum of 5 pitches.

1.8 There are no jointing for top tape and bottom tape.

1.9 There are no fuzz in the cavity.

1.10 Break down force of top tape : 5N min.

Break down force of bottom tape : 5N min. (Only a bottom tape existence )

1.11 Reel is made by resin and appeaser and dimension is shown in Fig 2.

There are possibly to change the material and dimension due to some impairment.

1.12 Peeling off force : 0.1N to 0.6N*in the direction as shown below.

* GRM01/02/03:0.05N～0.5N

1.13 Label that show the customer parts number, our parts number, our company name, inspection

number and quantity, will be put in outside of reel.

Package

GRM Type

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

Tail vacant Section

Chip-mounting Unit

Leader vacant Section

Leader Unit

(Top Tape only)

Direction

of Feed

160 min.

190 min.

210 min.

図

ﾁｯﾌﾟ詰め状態

(

単位：

mm)

165～180°

Top tape

JEMCGP-01796E 10

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