Panasonic DMR-EX85EC Bedienungsanleitung

Powe

supply:

C220-240 V, 50/60 Hz

Powe

consumption: 33 W ±1,3 W

Power save mode 2 W ±0,4 W

Dimensions and Mass: 430 (W) x 329 (D) x 58 (H) mm

(excluding protrusions) / 4.3 kg

Operating temperature range: +5 to +40 °C

Operating humility range: 10 to 80 % RH (no condensation)

Pickup Laser power: CLASS1

Pickup Wave length: DVD 662 nm / CD 780 nm

Laser performance: No hazardous radiation is emitted

with the safety protection

Recording system: MPEG2 (Hybrid VBR)

udio: Dolby Digital 2CH

Signal system: PAL 625/50, NTSC 525/60

DVD Region number: Region No. 2

Internal Hard Disc Drive: 250 GB

DVD Recording /

Playable discs:

DVD-RAM (12 cm 4.7 GB)

DVD-RAM (12 cm 9.4 GB)

DVD-RAM (8 cm 2.8 GB)

DVD-R (12 cm 4.7 GB)

DVD-R (8 cm 1.4 GB)

DVD-RW (12 cm 4.7GB)

DVD+R (12 cm 4.7 GB)

DVD+RW (12 cm 4.7 GB)

DVD approximate Recording

time:

XP: 10 MBps (60 min)

SP: 5 MBps (120 min)

LP: 3 MBps (240 min)

EP: 1.7 / 1.2 MBps (360 - 480 min)

rights reserved. Unauthorized copying and

distribution is a violation of law.

DMR-EX85EC

Vol.1

(S)...............Silver Type

dditional playable discs: DVD-RAM (VR format)

DVD-RW (VR format)

DVD-R

(MP3, DivX (Except EB), JPG)

DVD-R DL, DVD+R DL

DVD-Video, DVD-Audio

CD-Audio (CD-DA), Video CD

SVCD (IEC62107)

CD-R, CD-RW

(CD-DA, MP3, DivX, JPG, VCD)

TV tuner system PAL-BGH, SECAM-BG

TV tuner channel: VHF: E2-E12

UHF: CH21-CH69

CATV: S01-S05 (S1-S3)

CATV: S1-S20 (M1-U10)

CATV: S21-S41

TV digital tuner (DVB-T) VHF: CH5-CH12

UHF: CH21-CH69

ctive Antenna: 5V switched 50m

max.

RF Converter Output: not provided

SD Card Slot: JPEG (Still Picture DCF Standard)

TIFF (uncompressed)

MPEG2 (rec. by Panasonic cam)

Compatible Cards: SD Card, Multimedia Card

miniSD™ Card (with adapter)

Card format: FAT12, FAT16

Card picture pixels: 34x34 to 6144x4096

DVD Recorder

This DMR-EX85EC Service Manual describes only differences from DMR-EX75EC.

DMR-EX85EC’s RAM/Digital P.C.B. Module is RFKNEX85EC.

Order No. MAD0607020AE

Video input AV1 / AV2: 21 pin connector (1.0 Vp-p 75

)

Video input AV3 / AV4: pin jack connector (1.0 Vp-p 75

)

S-Video input AV1 / AV2: 21 pin connector

(Y: 1.0 Vp-p, C: 0.3 Vp-p 75 Ω)

S-Video input AV3 / AV4: pin jack connector

(Y: 1.0 Vp-p, C: 0.3 Vp-p 75 Ω)

RGB Video input AV3 (PAL): 21 pin connector (0.7 Vp-p 75

)

DV input: IEEE 1394 Standard 4 pin

Video output AV1 / AV2: 21 pin connector (1.0 Vp-p 75

)

FBAS Video output

(composite):

pin jack connector (1.0 Vp-p 75

)

S-Video output AV1: 21 pin connector (1.0 Vp-p 75

)

S-Video output (cinch): pin jack connector (1.0 Vp-p 75

)

S-Video output: S connector (1.0 Vp-p 75 Ω)

RGB Video output AV1: 21 pin connector (0.7 Vp-p 75

)

1 EXPLODED VIEW 3

1.1. CASING PARTS 3

Component Video output:

pin jack (1.0 Vp-p 75 Ω)

PB pin jack (0.7 Vp-p 75 Ω)

PR pin jack (0.7 Vp-p 75 Ω)

HDMI output (19 pin type A): Version 1.2a (EDID Vers. 1.3)

udio input AV1

AV2: 21 pin connector (-6 dBV 500 mV)

udio input AV3

AV4: pin jack (-6 dBV 500 mV)

udio output (cinch): pin jack (-6 dBV 500 mV)

Optical output: PCM, Dolby Digital, DTS, MPEG

Note:

Specifications are subject to change without notice.

Mass and dimensions are approximate.

nBuild-in decoders: You can play discs with following symbols

2 REPLACEMENT PARTS LIST 4

2.1. DIFFERENCE PARTS LIST 4

CONTENTS

Page Page

DMR-EX85EC

1 EXPLODED VIEW

1.1. CASING PARTS

DMR-EX85EC

Notes:

*Important safety notice:

Components identified by mark have special

characteristics important for safety.

Furthermore, special parts which have purposes of fire-

retardant (resistors), high-quality sound (capacitors), low-

noise (resistors), etc. are used.

When replacing any of components, be sure to use only

manufactures specified parts shown in the parts list.

*Warning: This product uses a laser diode.

Refer to caution statements.

*Capacity values are in microfarads (µF) unless

specified otherwise, P=Pico-farads (pF), F=Farads (F).

*Resistance values are in ohms, unless specified otherwise,

1K=1,000 (OHM), 1M=1,000k (OHM).

*The marking (RTL) indicates the retention time is limited

for this item. After the discontinuation

of this assembly in production, it will no longer be available.

*All parts except parts mentioned [SPC] in the Remarks

column are supplied from PAVCG.

*Parts mentioned [SPC] are supplied from PAVC

*The 1,2,3,4,5,6 in the Remarks column shows the models

as follows:

1 = DMR-EX75EC-S

2 = DMR-EX75EG-S

3 = DMR-EX75EB-S

4 = DMR-EX85EB-S

5 = DMR-EX85EG-S

6 = DMR-EX85EC-S ALL OTHER PARTS = 1

(same as DMREX75EC-S)

No indication = all models

2 REPLACEMENT PARTS LIST

2.1. DIFFERENCE PARTS LIST

Ref. No. Part No. Part Name & Description PCS Remarks

PC1 RPG8115 CARTON BOX 1 6

5 RGR0365C-K1 REAR PANEL 1 6

9 RFKNEX85EC RAM DIGITAL PCB MODULE 1 6

18 RYP1326-S FRONT PANEL UNIT 1 6

18-1 RGK1969-S1 FL ORNAMENT 1 6

18-3 RYF0798P-S RANEL DOOR UNIT 1 6

18-4 RYF0785-K TRAY DOOR UNIT 1 6

20 RFKV0071HDK HARD DISK DRIVE 250GB 1 6

DMR-EX85EC

rights reserved. Unauthorized copying and

distribution is a violation of law.

DMR-EX75EG

DMR-EX75EC

DMR-EX75EB

DMR-EX85EG

DMR-EX85EB

Vol.1

Colour

(S).......................Silver Type

DVD Recorder

ORDER NO.MAD0607020CE

1 SAFETY PRECAUTIONS 3

1.1. GENERAL GUIDELINES 3

2 WARNING 4

2.1. PREVENTION OF ELECTROSTATIC DISCHARGE

(ESD) TO ELECTROSTATIC SENSITIVE (ES) DEVICES4

2.2. PRECAUTION OF LASER DIODE 5

2.3. SERVICE CAUTION BASED ON LEGAL RESTRICTIONS

3 SERVICE NAVIGATION 7

3.1. SERVICE INFORMATION 7

3.2. CAUTION FOR DivX 7

4 SPECIFICATION 8

5 NEW FEATURE 9

5.1. ABOUT DivX (EXCEPT EB) 9

5.2. HDAVI CONTROL (HDMI LINK) 14

6 LOCATION OF CONTROLS AND COMPONENTS 16

7 OPERATING INSTRUCTIONS 17

7.1. TAKING OUT THE DISC FROM DVD-DRIVE UNIT WHEN

THE DISC CANNOT BE EJECTED BY OPEN/CLOSE

BUTTON 17

8 SERVICE MODE 18

8.1. SELF-DIAGNOSIS AND SPECIAL MODE SETTING 18

9 SERVICE FIXTURE AND TOOLS 28

10 ASSEMBLING AND DISASSEMBLING 29

10.1. DISASSEMBLY FLOW CHART 29

10.2. P.C.B. POSITIONS 29

10.3. TOP CASE 30

10.4. FRONT PANEL 30

10.5. SD CARD P.C.B. 30

10.6. RAM/DIGITAL P.C.B. MODULE 31

10.7. DV IN P.C.B. 32

10.8. HARD DISC DRIVE 32

10.9. POWER P.C.B. 34

10.10. REAR PANEL 34

10.11. BACK END P.C.B. 35

10.12. MAIN P.C.B. AND FRONT P.C.B. 35

10.13. TUNER P.C.B. AND TUNER 36

10.14. HDMI P.C.B. 36

11 MEASUREMENTS AND ADJUSTMENTS 37

11.1. SERVICE POSITIONS 37

11.2. CAUTION FOR REPLACING PARTS 41

11.3. STANDARD INSPECTION SPECIFICATIONS AFTER

MAKING REPAIRS 43

11.4. ABBREVIATIONS 44

12 BLOCK DIAGRAM 47

12.1. POWER BLOCK DIAGRAM 47

12.2. ANALOG VIDEO BLOCK DIAGRAM 49

12.3. ANALOG AUDIO BLOCK DIAGRAM 50

12.4. TIMER BLOCK DIAGRAM 51

12.5. HDMI BLOCK DIAGRAM 52

13 SCHEMATIC DIAGRAM 53

13.1. INTERCONNECTION DIAGRAM 53

13.2. POWER 54

13.3. MAIN NET 55

13.4. MAIN AV IO 56

13.5. MAIN TIMER 57

13.6. MAIN NICAM 58

13.7. TUNER (REPD0032A) 59

13.8. TUNER (REPD0032B) 60

13.9. SD CARD / FRONT / DV IN 61

13.10. HDMI 62

14 PRINTED CIRCUIT BOARD 63

14.1. POWER P.C.B. 63

14.2. MAIN P.C.B. 64

14.3. TUNER P.C.B. (REPD0032B) 66

14.4. TUNER P.C.B. (REPD0032A) / DV IN P.C.B.

(VEP73135A) 67

14.5. SD CARD P.C.B. / FRONT P.C.B. 68

14.6. HDMI P.C.B. 69

15 APPENDIX FOR SCHEMATIC DIAGRAM 71

15.1. VOLTAGE AND WAVEFORM CHART 71

16 EXPLODED VIEWS 76

16.1. CASING PARTS AND & MECHANISM SECTION 76

16.2. PACKING & ACCESSORIES SECTION 77

17 REPLACEMENT PARTS LIST 78

17.1. CASING PARTS & PRINTED CIRCUIT BOARDS 78

17.2. PACKING & ACCESSORIES PARTS 79

17.3. ELECTRICAL PARTS 79

17.4. SERVICE FIXTURE AND TOOLS 88

CONTENTS

Page Page

DMR-EX75EG / DMR-EX75EC / DMR-EX75EB / DMR-EX85EG / DMR-EX85EB

1.1. GENERAL GUIDELINES

1.Be careful during removing metal parts, sharp edges.

2.When servicing, observe the original lead dress. If a short

circuit is found, replace all parts which have been

overheated or damaged by the short circuit.

3.After servicing, see to it that all the protective devices such

as insulation barriers, insulation papers shields are properly

installed.

4.After servicing, make the following leakage current checks

to prevent the customer from being exposed to shock

hazards.

1.1.1. LEAKAGE CURRENT COLD

CHECK

1.Unplug the AC cord and connect a jumper between the two

prongs on the plug.

2.Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinet

part on the equipment such as screw heads, connectors,

control shafts, etc. When the exposed metallic part has a

return path to the chassis, the reading should be between

1MΩand 5.2MΩ.

When the exposed metal does not have a return path to

the chassis, the reading must be infinity.

Figure 1

1.1.2. LEAKAGE CURRENT HOT CHECK

1.Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2.Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in

Figure 1.

3.Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4.Check each exposed metallic part, and measure the

voltage at each point.

5.Reverse the AC plug in the AC outlet and repeat each of the

above measurements.

6.The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliampere. In case a

measurement is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the

customer.

1 SAFETY PRECAUTIONS

DMR-EX75EG / DMR-EX75EC / DMR-EX75EB / DMR-EX85EG / DMR-EX85EB

Some semiconductor (solid state) devices can be damaged

easily by static electricity. Such components commonly are

called Electrostatic Sensitive (ES) Devices. Examples of typical

ES devices are integrated circuits and some field-effect

transistor-sand semiconductor "chip" components. The

following techniques should be used to help reduce the

incidence of component damage caused by electrostatic

discharge (ESD).

1.Immediately before handling any semiconductor

component or semiconductor-equipped assembly, drain off

any ESD on your body by touching a known earth ground.

Alternatively, obtain and wear a commercially available

discharging ESD wrist strap, which should be removed for

potential shock reasons prior to applying power to the unit

under test.

2.After removing an electrical assembly equipped with ES

devices, place the assembly on a conductive surface such

as aluminum foil, to prevent electrostatic charge buildup or

exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder

ES devices.

4.Use only an anti-static solder removal device. Some solder

removal devices not classified as "anti-static (ESD

protected)" can generate electrical charge sufficient

to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate

electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective

package until immediately before you are ready to install it.

(Most replacement ES devices are packaged with leads

electrically shorted together by conductive foam, aluminum

foil or comparable conductive material).

7.Immediately before removing the protective material from

the leads of a replacement ES device, touch the protective

material to the chassis or circuit assembly into which the

device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and

observe all other safety precautions.

8.Minimize bodily motions when handling unpackaged

replacement ES devices. (Otherwise hamless motion such

as the brushing together of your clothes fabric or the lifting

of your foot from a carpeted floor can generate static

electricity sufficient to damage an ES device).

2 WARNING

2.1. PREVENTION OF ELECTROSTATIC DISCHARGE (ESD) TO

ELECTROSTATIC SENSITIVE (ES) DEVICES

DMR-EX75EG / DMR-EX75EC / DMR-EX75EB / DMR-EX85EG / DMR-EX85EB

2.2. PRECAUTION OF LASER DIODE

CAUTION: ACHTUNG:

This product utilizes a laser diode with the unit turned “on”,

invisible laser radiation is emitted from the pickup lens.

Wave length: 662 nm (DVDs)/780 nm (CDs)

Maximum output radiation power from pickup: 100µ W/VDE.

Laser radiation from the pickup lens is safety level, but be sure

the followings:

Dieses Produkt enthält eine Laserdiode.

Im eingeschalteten Zustand wird unsichtbare Laserstrahlung von der

Lasereinheit ausgestrahlt.

Wellenlänge: 662 nm(DVDs)/780 nm (CDs)

Maximale Strahlungsleistung der Lasereinheit: 100µ W/VDE.

Die Strahlung der eingeschalteten Lasereinheit ist ungefährlich, wenn

folgende Punkte beachtet werden:

1. Do not disassemble the optical pickup unit, since radiation

from exposed laser diode is dangerous. 1. Die Lasereinheit nicht zerlegen, da die Strahlung an der freigelegten

Laserdiode gefährlich ist.

2. Do not adjust the variable resistor on the pickup unit.

It was already adjusted. 2. Den werksseitig justierten Einstellregler der Lasereinheit nicht

verstellen.

3. Do not look at the focus lens using optical instruments. 3. Nicht in die Fokussierlinse blicken.

4. Recommend not to look at pickup lens for a long time. 4. Auch nicht mit optischen Instrumenten in die Fokussierlinse blicken.

DMR-EX75EG / DMR-EX75EC / DMR-EX75EB / DMR-EX85EG / DMR-EX85EB

2.3. SERVICE CAUTION BASED ON LEGAL RESTRICTIONS

General description about Lead Free Solder (PbF)

·The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used

for this equipment in considering the globally environmental conservation.

·The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists

of tin (Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F)

more than that of the normal solder.

Service caution for repair work using Lead Free Solder (PbF)

·The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

·To put lead free solder, it should be well molten and mixed with the original lead free solder.

·Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

·Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt

the lead free solder.

·Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature

at 350±30 degrees C (662±86°F). When soldering or unsoldering, please completely remove all of the solder

on the pins or solder area and be sure to heat the soldering points with the Pb free solder until it melts enough.

Definition of PCB Lead Free Solder being used

·The letter of “Pbf is printed either foil side or component side using the lead free solder.

Recommended Lead Free Solder (Service Parts Route.)

·The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

Note

·Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

DMR-EX75EG / DMR-EX75EC / DMR-EX75EB / DMR-EX85EG / DMR-EX85EB

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