Panasonic Transistors 2SD1819G Bedienungsanleitung
Transistors
1
Publication date: May 2007 SJC00372AED
This product complies with the RoHS Directive (EU 2002/95/EC).
2SD1819G
Silicon NPN epitaxial planar type
For general amplification
Complementary to 2SB1218G
■Features
•High forward current transfer ratio hFE
•Low collector-emitter saturation voltage VCE(sat)
•S-Mini type package, allowing downsizing of the equipment and
automatic insertion through the tape pacing and the magazine
pacing.
■Absolute Maximum Ratings Ta=25°C
Parameter Symbol Rating Unit
Collector-base voltage (Emitter open) VCBO 60 V
Collector-emitter voltage (Base open) VCEO 50 V
Emitter-base voltage (Collector open) VEBO 7V
Collector current IC100 mA
Peak collector current ICP 200 mA
Collector power dissipation PC150 mW
Junction temperature Tj150 °C
Storage temperature Tstg −55 to +150 °C
Parameter Symbol Conditions Min Typ Max Unit
Collector-base voltage (Emitter open) VCBO IC=10 µA, IE=060V
Collector-emitter voltage (Base open) VCEO IC=2 mA, IB=050V
Emitter-base voltage (Collector open) VEBO IE=10 µA, IC=07V
Collector-base cutoff current (Emitter open)
ICBO VCB =20 V, IE=0 0.1 µA
Collector-emitter cutoff current (Base open)
ICEO VCE =10 V, IB=0 100 µA
Forward current transfer ratio hFE1 *VCE = 10 V, IC= 2 mA 160 460
hFE2 VCE = 2 V, IC= 100 mA 90
Collector-emitter saturation voltage VCE(sat) IC=100 mA, IB=10 mA 0.1 0.3 V
Transition frequency fTVCB =10 V, IE=−2 mA, f =200 MHz 150 MHz
Collector output capacitance Cob VCB =10 V, IE=0, f =1 MHz 3.5 pF
(Common base, input open circuited)
■Electrical Characteristics Ta=25°C ±3°C
Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
2. *: Rank classification
Rank Q R S No rank
hFE1 160 to 260 210 to 340 290 to 460 160 to 460
Marking symbol ZQ ZR ZS Z
Product of no-rank is not classified and have no marking symbol for rank.
■Package
•Code
SMini3-F2
•Marking Symbol: Z
•Pin Name
1: Base
2: Emitter
3: Collector
2SD1819G
2SJC00372AED
This product complies with the RoHS Directive (EU 2002/95/EC).
ICVBE ICIBVCE(sat) IC
PCTaICVCE IBVBE
hFE ICfTIE
0 16040 12080
0
200
160
120
80
40
Collector power dissipation P
C
(mW)
Ambient temperature T
a
(°C)
0108264
0
60
50
40
30
20
10
T
a
=25°C
I
B
=160 µA
40 µA
20 µA
60 µA
80 µA
140 µA
120 µA
100 µA
Collector current IC(mA)
Collector-emitter voltage VCE (V)
0 1.00.80.2 0.60.4
0
1 200
1 000
800
600
400
200
VCE =10 V
Ta=25°C
Base-emitter voltage VBE (V)
Base current IB(µA)
0 2.01.60.4 1.20.8
0
200
160
120
80
40
V
CE
=10 V
T
a
=75°C−25°C
25°C
Base-emitter voltage V
BE
(V)
Collector current I
C
(mA)
0 1 000800200 600400
0
240
200
160
120
80
40
V
CE
=10 V
T
a
=25°C
Base current IB(µA)
Collector current I
C
(mA)
0.1 1 10 100
0.01
0.1
1
10
100 I
C
/ I
B
=10
25°C
−25°C
T
a
=75°C
Collector-emitter saturation voltage V
CE(sat)
(V)
Collector current I
C
(mA)
0.1 1 10 100
0
600
500
400
300
200
100
V
CE
=10 V
T
a
=75°C
25°C
−25°C
Forward current transfer ratio h
FE
Collector current I
C
(mA)
−0.1 −1−10 −100
0
300
240
120
180
60
V
CB
=10 V
T
a
=25°C
Transition frequency f
T
(MHz)
Emitter current I
E
(mA)
This product complies with the RoHS Directive (EU 2002/95/EC).
SMini3-F2 Unit: mm
0.30 +0.05
−0.02
0.13 +0.05
−0.02
2.00 ±0.20
(0.89)
0.90 ±0.10
(0.65)(0.65)
1.30 ±0.10
1.25 ±0.10
2.10 ±0.10
0.425 ±0.050
(0.49)
0 to 0.10
(5°)
(5°)
3
12
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semiconductors described in this book
(1)If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2)The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3)The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
–Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the prod-
ucts may directly jeopardize life or harm the human body.
–Any applications other than the standard applications intended.
(4)The products and product specifications described in this book are subject to change without notice for modification and/or im-
provement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5)When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6)Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7)This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd.
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