Panasonic SA-XR700EG Bedienungsanleitung

nAMPLIFIER SECTION

Power output (at AC 230-240 V)

DIN 1 kHz (T.H.D. 1%) 2 x 145 W (4 Ω)

20 Hz-20 kHz continuous power

output both channels driven

2x80W(6Ω)

Total harmonic distortion

rated power at 20 Hz-20 kHz 0.09 % (6 Ω)

Power bandwidth

both channels driven, -3 dB 4Hzto88kHz

(6 Ω,0.9%)

Power output each channel driven (at AC 230-240 V)

DIN 1kHz (T.H.D. 1%)

Front (L/R) 100 W (6 Ω)

Center 100 W (6 Ω)

Surround (L/R) 100 W (6 Ω)

Surround Back (L/R) 100 W (6 Ω)

Load impedance

Front (L/R)

AorB 4to16Ω

A and B 6to16Ω

BI-WIRE 4to16Ω

Center 6to16Ω

Surround (L/R) 6to16Ω

Surround Back (L/R) 6to16Ω

Frequency response

CD, AUX, TV/STB, VCR, DVD

RECORDER, BD/DVD

4Hzto88kHz,±3dB

DVD 6CH 4Hzto44kHz,±3dB

rights reserved. Unauthorized copying and

distribution is a violation of law.

SA-XR700EG

Colour

(S)... Silver Type

Input sensitivity and impedance

CD, AUX, TV/STB, VCR, DVD

RECORDER, BD/DVD/DVD 6CH

200 mV/22 kΩ

S/N at rated power (6 Ω

ΩΩ

Ω)

CD, TV/STB, BD/DVD PLAYER, DVD

RECORDER (Digital Input)

90 dB

(IHF, A: 103dB)

Tone controls

BASS 50 Hz, +10 to -10 dB

TREBLE 20kHz,+10to-10dB

Channel balance (250 Hz-6.3 kHz) ±1 dB

Channel separation 55 dB

Subwoofer frequency response (-6 dB) 7 Hz to 200 Hz

Digital input

(Optical) 2

(Coaxial) 2

HDMI (version 1.2a)

(Input) 2

(Output) 1

nFM TUNER SECTION

Frequency range 87.5 to 108.00 MHz

Sensitivity

S/N 30 dB 1.5 µV/75 Ω

S/N 26 dB 1.3 µV/75 Ω

S/N 20 dB 1.2 µV/75 Ω

IHF usable sensitivity (IHF ‘58) 1.5 µV/75 Ω

IHF 46 dB stereo quieting sensitivity 22 µV/75 Ω

AV Control Receiver

Specification

ORDER NO. MD0608274CE

Total harmonic distortion

MONO 0.2%

STEREO 0.3%

S/N

MONO 60 dB

STEREO 58 dB

Frequency response 20 Hz to 15 kHz,

+1 dB, -2dB

Alternate channel selectivity ±400 kHz, 65 dB

Capture ratio 1.5 dB

Image rejection at 98 MHz 40 dB

IF rejection at 98 MHz 70 dB

Spurious response rejection at 98 MHz 70 dB

AM suppression 50 dB

Stereo separation 1kHz,40dB

Carrier leak 19 kHz, -30 dB

38 kHz, -50 dB

Channel balance (250 Hz-6.3 kHz) ±1.5 dB

Limiting point 1.2 µV

Bandwidth

IF amplifier 180 kHz

FM demodulator 1000 kHz

Antenna terminal 75 Ω(unbalanced)

nAM TUNER SECTION

Frequency range

522 to 1611 kHz (9 kHz steps)

530 to 1620 kHz (10 kHz steps)

Sensitivity 20 µV, 330 µV/m

Selectivity (at 999 kHz) 55 dB

1 Safety Precautions 4

1.1. GENERAL GUIDELINES 4

1.2. Caution for AC Cord 5

1.3. Before Repair and Adjustment 6

1.4. Protection Circuitry 7

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices 8

3 Service caution based on legal restrictions 9

3.1. General description about Lead Free Solder (PbF) 9

4 Accessories 10

5 Operating Instructions Procedures 11

5.1. Remote Control Operation 11

5.2. Main Unit Operation 12

5.3. Main Unit Connections 13

6 Self Diagnosis Display Function 21

IF rejection (at 999 kHz) 50 dB

nVIDEO SECTION

Output voltage at 1 V input (unbalanced) 1±0.1 Vp-p

Maximum input voltage 1.5 Vp-p

Input/output impedance 75 Ω(unbalanced)

S-Video

Input TV/STB, BD/DVD

PLAYER, DVD

RECORDER, AUX

Output TV MONITOR

Component Video

Input TV/STB,

DVD RECORDER

Output TV MONITOR

nGENERAL

Power supply AC 230 to 240 V, 50

Power consumption 140 W

Dimensions (W × H × D) 430 mm × 107.5 mm ×

390 mm

Mass Approx 5.3 kg

Power consumption in standby mode: 0.9 W

Power consumption in HDMI off mode: 0.45 W

Notes:

1. Specifications are subject to change without notice.

2. Total harmonic distortion is measured by the digital spectrum

analyzer.

6.1. Automatically Displayed Error Codes 21

6.2. Display Details 21

6.3. Overload/Shutdown Detection intenal Condition 21

6.4. Overload/Thermal Detection Display 21

6.5. Activating Self Diagnosis Function (Servicing Mode) 21

6.6. Returning to Normal Display 22

6.7. Activating Self Diagnosis Function (Doctor Mode) 22

7 HDMI Checking Method 25

7.1. What is HDMI? 26

7.2. Advanced Digital Pictures 27

7.3. Advanced Digital Sound 27

7.4. Easy to Use 27

7.5. HDMI Compatible Products 28

7.6. Main features and benefits 28

7.7. Other features and benefits 28

CONTENTS

Page Page

SA-XR700EG

8 Assembling and Disassembling 30

8.1. Caution 30

8.2. Disassembly flow chart 31

8.3. Main Parts Location Diagram 32

8.4. Disassembly of Top Cabinet 33

8.5. Disassembly and Checking the DSP P.C.B. (Side A/B)

and Main P.C.B. (Side A) 33

8.6. Disassembly of Tuner Pack and Tuner Extent P.C.B. 34

8.7. Disassembly and Checking of Speaker P.C.B. 35

8.8. Disassembly and Checking of HDMI P.C.B. (Side A/B)

8.9. Disassembly Support Bar 36

8.10. Disassembly and Checking of Video & Optical P.C.B. 37

8.11. Disassembly of Rear Panel 38

8.12. Disassembly and Checking of Input P.C.B. 38

8.13. Disassembly and Checking of Main P.C.B. (Side B) 39

8.14. Disassembly and Checking of Power P.C.B. 40

8.15. Disassembly of Front Panel 41

8.16. Disassembly and Checking of Panel P.C.B., Volume

P.C.B., Headphone P.C.B., Selector P.C.B. and Front

Jack P.C.B. 41

8.17. Insert wire & Wire dressing 43

9 Voltage Measurement & Waveform Chart 44

9.1. Voltage Measurement 44

9.2. Waveform Chart 61

10 Wiring Connection Diagram 63

11 Block Diagram 65

12 Notes Of Schematic Diagram 75

13 Schematic Diagram 77

13.1. DSP CIRCUIT 77

13.2. MAIN (DIG1) CIRCUIT 80

13.3. MAIN (DIG2) CIRCUIT 86

13.4. MAIN (DIG3) CIRCUIT 90

13.5. INPUT CIRCUIT 92

13.6. PANEL CIRCUIT 94

13.7. SPEAKER CIRCUIT 95

13.8. TUNER EXTENT CIRCUIT, HEADPHONE CIRCUIT,

VOLUME CIRCUIT and SELECTOR CIRCUIT 96

13.9. POWER CIRCUIT 97

13.10. HDMI CIRCUIT 100

13.11. VIDEO & OPTICAL CIRCUIT 104

13.12. FRONT JACK CIRCUIT 106

14 Printed Circuit Board Diagrams 107

14.1. DSP P.C.B 107

14.2. MAIN P.C.B 108

14.3. INPUT P.C.B 110

14.4. TUNER EXTENT P.C.B, SPEAKER P.C.B, HEADPHONE

P.C.B, VOLUME P.C.B, SELECTOR P.C.B and FRONT

JACK P.C.B 111

14.5. PANEL P.C.B and VIDEO & OPTICAL P.C.B 112

14.6. POWER P.C.B 113

14.7. HDMI P.C.B 114

15 Illustration of IC's, Transistors and Diodes 117

16 Terminal Function of IC's 118

16.1. IC6801 (C2CBKJ000204) IC MICROPROCESSOR 118

16.2. IC6901 (C2CBKJ000205) IC SUB MICRO-P 118

17 Exploded Views 121

17.1. Cabinet Parts Location 121

17.2. Packaging 123

18 Replacement Parts List 125

SA-XR700EG

1 Safety Precautions

1.1. GENERAL GUIDELINES

1. When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2. After servicing, ensure that all the protective devices such as insulation barriers, insulation papers shields are properly installed.

3. After servicing, check for leakage current checks to prevent from being exposed to shock hazards.

1.1.1. LEAKAGE CURRENT COLD CHECK

1. Unplug the AC cord and connect a jumper between the two prongs on the plug.

2. Using an ohmmeter measure the resistance value, between the jumpered AC plug and each exposed metallic cabinet part on

the equipment such as screwheads, connectors, control shafts, etc. When the exposed metallic part has a return path to the

chassis, the reading should be between 1MΩand 5.2Ω.

When the exposed metal does not have a return path to the chassis, the reading must be .

Figure. 1

1.1.2. LEAKAGE CURRENT HOT CHECK (See Figure 1.)

1. Plug the AC cord directly into the AC outlet. Do not use an isolation transformer for this check.

2. Connect a 1.5kΩ, 10 watts resistor, in parallel with a 0.15µF capacitors, between each exposed metallic part on the set and a

good earth ground such as a water pipe, as shown in Figure 1.

3. Use an AC voltmeter, with 1000 ohms/volt or more sensitivity, to measure the potential across the resistor.

4. Check each exposed metallic part, and measure the voltage at each point.

5. Reverse the AC plug in the AC outlet and repeat each of the above measurements.

6. The potential at any point should not exceed 0.75 volts RMS. A leakage current tester (Simpson Model 229 or equivalent) may

be used to make the hot checks, leakage current must not exceed 1/2 milliamp. should the measurement is outside of the limits

specified, there is a possibility of a shock hazard, and the equipment should be repaired and re-checked before it is returned

to the customer.

SA-XR700EG

1.2. Caution for AC Cord

SA-XR700EG

1.3. Before Repair and Adjustment

Disconnect AC power, discharge Power Supply Capacitors C707, C717, C718, C725 and C924 through a 10Ω, 1W resistor to

ground.

DO NOT SHORT-CIRCUIT DIRECTLY (with a screwdriver blade, for instance), as this may destroy solid state devices.

After repairs are completed, restore power gradually using a variac, to avoid overcurrent.

Current consumption at AC 230 - 240 V, 50 Hz in NO SIGNAL mode (at volume minimun) should be 200 ~ 600 mA.

SA-XR700EG

1.4. Protection Circuitry

The protection circuitry may have operated if either of the following conditions are noticed:

No sound is heard when the power is turned on.

Sound stops during a performance.

The function of this circuitry is to prevent circuitry damage if, for example, the positive and negative speaker connection wires are

"shorted", or if speaker systems with an impedance less than the indicated rated impedance of the amplifier are used.

If this occurs, follow the procedure outlines below:

1. Turn off the power.

2. Determine the cause of the problem and correct it.

3. Turn on the power once again after one minute.

Note:

When the protection circuitry functions, the unit will not operate unless the power is first turned off and then on again.

SA-XR700EG

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor “chip” components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1. Immediately before handling any semiconductor component or semiconductor-equiped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equiped with ES devices, place the assembly on a conductive surface such as aluminium

foil, to prevent electrostatic charge build up or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as “anti-static (ESD protected)” can

generate electrical charge to damage ES devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminium foil or

comparable conductive material).

7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the

brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD)

sufficient to damage an ES device).

SA-XR700EG

3 Service caution based on legal restrictions

3.1. General description about Lead Free Solder (PbF)

The lead free solder has been used in the mounting process of all electrical components on the printed circuit boards used for this

equipment in considering the globally environmental conservation.

The normal solder is the alloy of tin (Sn) and lead (Pb). On the other hand, the lead free solder is the alloy mainly consists of tin

(Sn), silver (Ag) and Copper (Cu), and the melting point of the lead free solder is higher approx.30 degrees C (86°F) more than that

of the normal solder.

Definition of PCB Lead Free Solder being used

The letter of “PbF” is printed either foil side or components side on the PCB using the lead free solder.

(See right figure)

Service caution for repair work using Lead Free Solder (PbF)

The lead free solder has to be used when repairing the equipment for which the lead free solder is used.

(Definition: The letter of “PbF” is printed on the PCB using the lead free solder.)

To put lead free solder, it should be well molten and mixed with the original lead free solder.

Remove the remaining lead free solder on the PCB cleanly for soldering of the new IC.

Since the melting point of the lead free solder is higher than that of the normal lead solder, it takes the longer time to melt

the lead free solder.

Use the soldering iron (more than 70W) equipped with the temperature control after setting the temperature at 350±30

degrees C (662±86°F).

Recommended Lead Free Solder (Service Parts Route.)

The following 3 types of lead free solder are available through the service parts route.

RFKZ03D01K-----------(0.3mm 100g Reel)

RFKZ06D01K-----------(0.6mm 100g Reel)

RFKZ10D01K-----------(1.0mm 100g Reel)

Note

* Ingredient: tin (Sn), 96.5%, silver (Ag) 3.0%, Copper (Cu) 0.5%, Cobalt (Co) / Germanium (Ge) 0.1 to 0.3%

SA-XR700EG

4 Accessories

Note : Refer to Packing Materials & Accessories Parts List (Section 18) for the part number.

Remote

control

AC cord

(For the United

Kingdom and

Republic of

Ireland)

FM antenna

wire

AM loop antenna

Calibration MIC

ANT

Adapter

(For the

United

Kingdom

and

Republic

of Ireland)

SA-XR700EG

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