Panasonic KX-TS2365RUB Bedienungsanleitung
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Table Of Contents
COVER
1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
1.1 Suggested PbF Solder
1.2 How to recognize that Pb Free solder is used
2 FOR SERVICE TECHNICIANS
3 CAUTION
4 BATTERY
4.1 Installing the Batteries
4.2 Battery Replacement
5 LOCATION OF CONTROLS
6 DISPLAY
7 CONNECTION
7.1 Connecting the Handset/Telephone Line Cord
7.2 Connecting a Communication Device
8 SETTINGS
8.1 Selecting the Dialing Mode
8.2 Setting the PIN Code
8.3 Dial Lock
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8.3.1 To Set the Dial Lock
8.3.2 To Cancel the Dial Lock
8.4 Call Restriction
8.4.1 To Set the Call Restriction
8.5 How to Release the Establishment of Dial Lock
9 OPERATIONS
9.1 Making Calls
9.2 Answering Calls
9.3 FLASH Button
10 DISASSEMBLY INSTRUCTIONS
11 TROUBLE SHOOTING GUIDE
11.1 Service Hints
11.2 Pulse Dialing Problems
11.3 Tone Dialing Problems (Handset)
11.4 No Ringing Sound When Ring Signal is Input.
12 BLOCK DIAGRAM
13 CIRCUIT OPERATION
13.1 Bell Detector Circuit
13.2 Line Interface
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13.3 Speakerphone Circuit
13.3.1 Function
13.3.2 Circuit Operation
13.4 Telephone Line Interface
13.4.1 Circuit operation
13.5 Tone Detect
13.5.1 Circuit operation
13.6 Initializing Circuit
13.6.1 Function
13.6.2 Circuit operation
14 CPU DATA
14.1 IC801
15 HOW TO SET THE FLASH TIME AND REDIAL TIME
15.1 Flash Time
15.2 Redial Time
15.3 Speakerphone IC Data
16 BLOCK DIAGRAM (IC 1)
16.1 Communication ICs
17 MODULE BLOCK DIAGRAM
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17.1 MODULE BLOCK DIAGRAM
17.2 CONNECTOR PIN ASSIGNMENT
18 HOW TO REPLACE A FLAT PACKAGE IC
18.1 Preparation
18.2 Procedure
18.3 Removing Solder from Between Pins
19 TERMINAL GUIDE OF THE ICs, TRANSISTORS AND DIODES
20 CABINET AND ELECTRICAL PARTS LOCATION
21 ACCESSORY AND PACKING MATERIALS
22 REPLACEMENT PARTS LIST
22.1 Base Unit
22.1.1 Cabinet and Electrical Parts
22.1.2 Main P.C. Board Parts
22.2 ACCESSORIES AND PACKING MATERIALS
23 FOR SCHEMATIC DIAGRAM (SCHEMATIC DIAGRAM)
24 SCHEMATIC DIAGRAM
25 CIRCUIT BOARD
25.1 Component View
25.2 Flow Solder Side View
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1 ABOUT LEAD FREE SOLDER (PbF: Pb free)
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Note:
In the information below, Pb, the symbol for lead in the periodic table of elements, will refer to standard
solder or solder that contains lead.
We will use PbF solder when discussing the lead free solder used in our manufacturing process which is
made from Tin (Sn), Silver (Ag), and Copper (Cu).
This model, and others like it, manufactured using lead free solder will have PbF stamped on the PCB.
For service and repair work we suggest using the same type of solder although, with some precautions,
standard Pb solder can also be used.
Caution
●PbF solder has a melting point that is 50°F ~ 70° F (30°C ~ 40°C) higher than Pb solder. Please
use a soldering iron with temperature control and adjust it to 700°F ± 50° F (370°C ± 10°C).In
case of using high temperature soldering iron, please be careful not to heat too long.
●PbF solder will tend to splash if it is heated much higher than its melting point, approximately
1100°F (600°C).
●If you must use Pb solder on a PCB manufactured using PbF solder, remove as much of the
original PbF solder as possible and be sure that any remaining is melted prior to applying the Pb
solder.
●When applying PbF solder to double layered boards, please check the component side for excess
which may flow onto the opposite side (See the figure below).
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1.1 Suggested PbF Solder
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There are several types of PbF solder available commercially. While this product is manufactured using
Tin, Silver, and Copper (Sn+Ag+Cu), you can also use Tin and Copper (Sn+Cu), or Tin, Zinc,
andBismuth (Sn+Zn+Bi). Please check the manufac turer’s specific instructions for the melting points of
their products and any precautions for using their product with other materials.
The following lead free (PbF) solder wire sizes are recommended for service of this product: 0.3mm,
0.6mm and 1.0mm.
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