Quectel M10 Bedienungsanleitung

M10

Quectel Cellular Engine

M10 User Guide

M10_User_Guide_V1.00 -1-

Document Title M10 User Guide

Version 1.00

Date 2009-07-07

Status Release

Document Control ID M10_User_Guide_V1.00

General Notes

Quectel offers this information as a service to its customers, to support application and

engineering efforts that use the products designed by Quectel. The information provided is

based upon requirements specifically provided to Quectel by the customers. Quectel has not

undertaken any independent search for additional relevant information, including any

information that may be in the customer’s possession. Furthermore, system validation of this

product designed by Quectel within a larger electronic system remains the responsibility of the

customer or the customer’s system integrator. All specifications supplied herein are subject to

change.

This document contains proprietary technical information which is the property of Quectel

Limited., copying of this document and giving it to others and the using or communication of

the contents thereof, are forbidden without express authority. Offenders are liable to the

utility model or design. All specification supplied herein are subject to change without notice at

any time.

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1 .EVB kit introduction

1.1 EVB top and bottom view

EVB top view

EVB bottom view

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A: Debug port

B: Main UART port

C: Test points

D: Adapter interface

E: Module operating status indication LEDs

F: PWRKEY button

G: EMERG_OFF button

H: VBAT switch

I: VCHG switch (charge function)

J: Download switch

K: Connector for M10-TE-A board

L: Screw holes for fixing the M10-TE-A

M: Headset socket

N: Handset socket of audio channel 2

O: Handset socket of audio channel 1

P: Antenna connector fixing hole

Q: Screw holes for EVB placement

R: SIM card socket

1.2 EVB accessory

Accessory introduction

A: 5V DC switching adapter

B: USB to UART converter cable

C: Antenna

D: RF cable

E: Headset

F: Bolts and nuts for fixing module and EVB

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EVB and accessories

2. Operational description

2.1 Tune up procedure

Firstly，please equip the module and accessories as the figure 4.

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Then ,switching the H switch to ON state, J switch to ON state；Press the Fbutton PWRKEY for about

2 second, then the LED glint，and the module is tuningup successfully；( the location of All Switches and

buttons please see the Figure 1)

2.2 Serial interfaces

The module provides two unbalanced asynchronous serial ports. One is the serial port ,the other is the

debug port. The module is designed as a DCE (Data Communication Equipment), following the traditional

DCE-DTE (Data Terminal Equipment) connection. The module and the client (DTE) are connected

through the following signal (as following figure shows). Autobauding supports baud rate from 4800bps to

115200bps.

Serial port

zTXD: Send data to the RXD signal line of the DTE

zRXD: Receive data from the TXD signal line of the DTE

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TXD

RXD

RTS

CTS

DTR

DCD

TXD

RXD

RTS

CTS

DTR

DCD

/RING

DBG_TX

DBG_RX

/TXD

/RXD

MODULE (DCE) CUSTOMER (DTE)

Serial port1

Serial port

Debug port Serial port2

Connection of serial interfaces

Note: The RTS PIN must be connected to the GND in the customer circuit when only the TXD and RXD are

used in the SerialPort communication.

2.3 Antenna interface

The Pin 43 is the RF antenna pad. The RF interface has an impedance of 50Ω.

2.3.1 Antenna installation

M10 provides an RF antenna PAD for customer’s antenna installation. The customer’s antenna should be

located in the customer’s main board and connect to module’s antenna pad through microstrip line or other

type RF trace which the impendence must be controlled in 50Ω. To help the customer to ground the

antenna, M10 comes with 2 grounding pads located close to the antenna pad.

Pin definition of the RF_ANT

Name Pin Function

RF_ANT 43 RF antenna pad

GND 42

GND 44

If the customer installs the antenna via a soldered microwave coaxial cable, we would suggest the customer

to choose RF cable carefully so as to minimize the loss on the RF cable. And the recommended insertion

loss should try to meet the following requirements:

zGSM850/EGSM900<0.5dB

zDCS1800/PCS1900<1dB

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2.3.2 RF output power

The module conducted RF output power

Frequency Max Min

GSM850 33dBm ±2dB 5dBm±5dB

EGSM900 33dBm ±2dB 5dBm±5dB

DCS1800 30dBm ±2dB 0dBm±5dB

PCS1900 30dBm ±2dB 0dBm±5dB

2.3.3 RF receiving sensitivity

The module conducted RF receiving sensitivity

Frequency Receive sensitivity

GSM850 < -107dBm

EGSM900 < -107dBm

DCS1800 < -107dBm

PCS1900 < -107dBm

2.3.4 Operating frequencies

The module operating frequencies

Frequency Receive Transmitting channel

GSM850 869 ～894MHz 824 ～849MHz 128 ～251

EGSM900 925 ～960MHz 880 ～915MHz 0～124, 975～1023

DCS1800 1805 ～1880MHz 1710 ～1785MHz 512 ～885

PCS1900 1930 ～1990MHz 1850 ～1910MHz 512 ～810

2.3.5 Recommended impedance matching circuit

The impedance of M10’s RF_ANT port is 50Ω. If the impedance of antenna is close to 50Ωin all working

frequency bands, the antenna could be connected to the RF_ANT port directly via 50Ωtransmission line.

But if the impedance of antenna is not close to 50Ω, a T-type or π-type matching circuit should be inserted

between transmission line and antenna. The matching components should be placed as close as possible to

the antenna’s feed point.

The following 2 figures show the reference designs of T-type and π-type matching circuits.

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T‐typematchingcircuit

π‐typematchingcircuit

NOTE: The impedance of traces in Bold type must be 50Ω.

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3. M10 features

3.2.1 General specification

M10 is a Quad-band GSM/GPRS module delivers GSM/GPRS 850/900/1800/1900MHz performance for

voice, SMS, Data, and Fax in a small form factor and with low power consumption. M10 can be used for WLL

applications/M2M application and much more.

Quad- band GSM/GPRS module with a size of 29x29x3.6mm

●Customized MMI and keypad/LCD support

●An embedded Powerful TCP/IP protocol stack

●Supply voltage range 3.4 ... 4.5 V

●Normal Operation Temperature: -35°C ~80°C

●GPRS multi-slot Class 12

●GSM R99

3.2.2 Hardware Specification

The following figure shows a block diagram of the M10 module and illustrates the major functional part:

zThe GSM baseband engine

zFlash and SRAM

zThe GSM radio frequency part

zThe SMT pads interface

—LCD interface

—SIM card interface

—Audio interface

—Key board interface

—UART interface

—Power supply

—RF interface

The PCB for M10 is 6 layers.

The mechanical architecture of SIM card holder and the definition of SIM card are shown below:

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Andere Handbücher für M10

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