Samsung R60 NP-R60FY series Bedienungsanleitung

If there are the Contents not included in this book, please refer to K-zone Service Manual

SAMSUNG R60 FEATURES

SERVICEManual

R60

PRAHA

NP-R60FYxx/xxx

1. Simple & Essential Note PC

-. Intel Core2 Duo/Celeron M

Processor

-. AMD RS600ME + AMD SB600

2. High Performance & Security

-. 15.4" WXGA Super Bright

Glare LCD/Non Glare LCD

-. AVS now, Bluetooth.

-CONTENTS -

1. Precautions

1) General After-Sales Service Precautions.................................................................................................................1-1

2) Safety Precautions......................................................................................................................................................1-2

3) Ground.........................................................................................................................................................................1-3

4) Static Electricity Precautions........................................................................................................................................1-3

2. Introduction and Specification

1) Introduction..................................................................................................................................................................2-1

2) Specification.................................................................................................................................................................2-2

3) System Spec Comparison..........................................................................................................................................2-3

4) Option list.....................................................................................................................................................................2-4

5) BIOS Setup..................................................................................................................................................................2-5

6) Description of Main board...........................................................................................................................................2-6

3. Disassembly and Reassembling

1) Disassembly and Re-assembly of PRAHA.................................................................................................................3-1

4. Troubleshooting

1) General......................................................................................................................................................................4-1

2) Debugging Flow Chart..............................................................................................................................................4-2

3) System Diagnosis......................................................................................................................................................4-5

4) Use of diagnostic program.......................................................................................................................................4-8

5) Hardware Troubleshooting......................................................................................................................................4-14

6) Device Settings Related Software Diagnosis........................................................................................................4-25

7) Battery Use Time....................................................................................................................................................4-26

8) Other........................................................................................................................................................................4-30

5. Exploded view

1) System Main Assy (List).................................................................................... 5-1

2) LCD Bsck Assy (List).........................................................................................5-3

3) LCD Front Assy (List)....................................................................................... 5-4

4) Assy CAP-TOP (List)..........................................................................................5-5

5) Housing Top Assy (List).................................................................................. 5-6

6) Housing Bottom Assy (List)................................................................................ 5-7

7) ODD (List)........................................................................................................5-9

6. Material list

1) SYSTEM....................................................................................................................................................................6-1

7. System Block Diagram

1) Top............................................................................................................................................................................7-1

2) Bottom.......................................................................................................................................................................7-2

3) LCD............................................................................................................................................................................7-3

8.Schematic

1)Schematicc............................................................................................................8-1

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2- 1

2. Introduction and Specification

1) Introduction

(1) High Performance Note PC

- Intel® Core™ 2 Duo Processor

- Intel® Core™ Duo Processor

- Intel® Pentium Dual Core™ Processor

- Intel® Celeron® M Processor

-Wireless LAN (Option), Bluetooth (Option).

(2) Convenient AV

-Touch Pad Under Plastic

-Wireless On/Off indicator & Button

-ASF Solution Ready

(3) Communications

-Wireless Solution (F. Option)

-AtherosAR2423 (802.11bg)

-Bluetooth V2.0

-MDC (F. Option) .

Delphi(D40)

- This Document can not be used without Samsung's authorization -

2- 2

2. Introduction and Specification

2) Specification

Processor and Motherboard Description

CPU Intel® Core™ 2 Duo Processor

Intel® Pentium Dual Core™ Processor+ AMD RS600ME + AMD SB600

Intel® Celeron® M Processor

Speed

R60 :

Intel® Core™Duo Processor T2450 (2.0GHz) ~ Intel® Core™ 2 Duo

Processor T5600 (1.83GHz)

Intel® Pentium Dual Core Processor T2080 (1.73GHz) ~ T2130

(1.86GHz)

Intel® Celeron M Processor 430 (1.73GHz) ~ 530 (1.73GHz)

R60 Plus :

Intel® Core™ 2

Duo Processor T5250 (1.5GHz) ~ T7700 (2.4GHz)

Intel® Celeron Processor 530 (1.73GHz) ~ 550 (2.0GHz)

Cache

4MB (Intel® Core™ 2 Duo Processor T7700, T7500, T7300)

2MB (Intel® Core™ 2 Duo Processor)

1MB (Intel® Pentium Dual Core Processor, Intel® Celeron®M

Processor)

Chipset RS600ME + SB600

BIOS 8 Mbit, Flash upgradable, SPI ROM

Thermal Design Performance MAX. 35W

Memory 　

Memory / Max. Memory 1GB~MAX4GB

Memory type PC2-5300(667MHz) DDR2 SODIMM

Memory Modules 1GB, 2GB, 4GB SODIMM

Sockets 2-slot SODIMM's

Display and Graphics

LCD 15.4" WXGA (Glare/NonGlare)

LCD Vendor AMLCD/CPT

ATI Internal GFx ATI Internal GFx

Video Memory ATI Radeon Xpress 1250

ATI 32MB ~ Max. 256MB Shared Memory

Max.Resolution for LFP LVDS 1280 x 800 x 32Bits color (WXGA)

Max.Resolution for External

Monitor 2048 x 1536 @ 32bps (CRT)

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2- 3

2. Introduction and Specification

Storage

Hard Disk Drive 9.5mmH 2.5" HDD, Removable

Supports SMART Ultra DMA 33/66/100, DMA Mode 2/4 ; SATA

Average Access Time 13m sec.

Speed 5400 / 7200 RPM , Hybrid HDD, TMR/PMR Type

Capacity 80GB / 100GB / 120GB / 160GB / 200GB : HGST, Hitachi, Samsung

- 80 ~ 160GB SATA 5400rpm

- 200GB SATA 4200rpm (June '07)

Optical Disk Drive DVD/CD-ROM/Combo / Super Multi (12.7mm) ; Factory Option

Type Fixed type (Factory Option)

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

Optical Driver Modules

Combo Drive 1 Factory Option

Module type Fixed 12.7mm Slim

Speed 8x DVD-ROM, 24x RW, 24x CD-R : TSST, TS-L332A

Average Access Time DVD 130ms Typ, CD 130ms Typ

Weight 176g or less

S/W Supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

Combo Drive 2 Factory Option

Module type Fixed 12.7mm Slim

Speed 8x DVD-ROM, 24x RW, 24x CD-R, 24x CD : TSST, TS-L462D

Average Access Time DVD 130ms Typ, CD 130ms Typ,.

Weight 176g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

SuperMultiDualLayer1 Factory Option

Module type Fixed 12.7mm Slim

Speed 5x DVD-RAM, 8x DVD±R 2.4x DVD+R DL, 4x DVD±RW, 24x CD-R,

16x CD-RW, 8x DVD, 24x CD : Panasonic UJ-850

Average Access Time DVD 130ms Typ., CD 130ms Typ.

Weight 190g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

SuperMultiDualLayer2 Factory Option

Module type Fixed 12.7mm Slim

Speed 5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-RW,

24x CD-R/RW, 8x DVD, 24x CD : TSSTTS-L632D

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2- 4

2. Introduction and Specification

Average Access Time DVD 130ms Typ., CD 130ms Typ.

Weight 180g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

Super MultiDual Layer 3 Factory Option

Module type Fixed 12.7mm Slim

Speed 5x DVD-RAM, 8x DVD±R, 6x DVD±R DL, 8x DVD+RW, 6x DVD-RW,

24x CD-R/RW, 8x DVD, 24x CD : TeacDV-W28EC

Average Access Time DVD 130ms Typ., CD 130ms Typ.

Weight 180g or less

S/W supplied Cyberlink DVD Solution

Security RPC-II Regional Encoding

Network Tools

Fax/Modem 56Kbps / V.92 Azalia Modem, DELPHI (D40) (Factory Opeion)

Chipset CSP1040 AGR A3 & A3 5V1

Features RJ11 Output

LAN 10/100 Ethernet UTP

Chipset Marvell 88E8039

Features Integrated PHY, MAC 10/100, RJ45 Output

802.11b/g Wireless LAN AtherosAR2423: Factory option

Type Mini card (Factory Option)

Chipset AR2423

Bluetooth BCM92045NMD : Factory Option

Type USB daughter card with integrated PIFA antenna

Chipset Broadcom BCM2045

Standard version 2.0

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2- 5

2. Introduction and Specification

I/O Interface

PC CardBus Slots PCI Express Card Slot

I/O Ports 　

USB Port 3(USB2.0)

Video (CRT) Port 1

Audio Jacks HeadPhone-out

Modem / LAN RJ11, RJ45

Power 1 DC-in (5pie)

Input Devices 　

Key board 88KEY(KR/US)

Travel length 2.6mm / Key Pitch 19.05mm

Touchpad Synaptics Touchpad (Plat type with Scroll area)

Easy Button -

Power and Power

Management

Battery (Standard) AA-PB3NC6B (6cells, Smart Li-Ion Battery)

Dimension 204 x 48 x 20mm

Weight 350g (max)

Recharge Time 2 hours to 100% with Windows on & off

Battery Life over 2.5hour ( Battery mark 4.01)

Details of Cell 6cells (2Parallel 3Serial) - Standard only

Voltage 11.1Vdc

Battery Capacity 2000mAh/cell

Battery Rating 11.1V / 4000mAh (44.4Wh)

Battery (LongLife) AA-PL2NC9B (9cells, Smart Li-Ion Battery)

Recharge Time 4 hours to 100% with Windows on & off

Battery Life over 5hour ( Battery mark 4.01)

Details of Cell 9cells (3Parallel 3Serial)

Voltage 11.1Vdc

Battery Capacity 2600mAh/cell

Battery Rating 11.1V / 7800mAh (86.58Wh)

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2- 6

2. Introduction and Specification

AC Adapter AD-9019S(2.0GHz↑)

Output Power 90Watts

Dimension 126 X 51 X 30 mm

Weight (AC Adapter) 270g (typ)

Worldwide Compatibility Auto-sensing 100 - 240VAC

Line Frequency 50 / 60Hz

Adapter Rating - Input 100V - 240V, 1.5A(Min)

Adapter Rating - Output 19.0VDC , 4.74A

Power Management Features ACPI 3.0 support, Standby(S3), Hibernate(S4)

AC Adapter AD-6019S(2.0GHz↓)

Output Power 60 Watts

Dimension 108 x 46.5 x 28mm

Weight (AC Adapter) 320g (max)

Worldwide Compatibility Auto-sensing 100 - 240VAC

Line Frequency 50 / 60Hz

Adapter Rating - Input 100V - 240V, 1.4A

Adapter Rating - Output 19.0VDC / 3.16A

Power Management Features ACPI 1.0b support, Standby(S3), Hibernate(S4)

System Dimensions

Dimensions (W X D X H) 335.9mm x 240.4mm x 28.2~38.8mm

Weight

(Full system w/4cell Battery) 2.19Kg

　Status : Combo , 4cell battery, 2.5" 80GB HDD

Materials LCD Front: PC, Back: PC/ABS

　Top: PC/ABS, Bottom: Mg

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2- 7

2. Introduction and Specification

3) Specification comparison

모델명

R40 plus R60 plus

Platform Intel Yonah (FSB667, 2MB L2) Intel Merom (FSB667,800 2MB,4MB

L2)

LCD 15.4” WXGA 15.4” WXGA

CHIP SET RS600ME + SB600 RS600ME + SB600

CPU T5600 T7700

Graphic

sInternal RadeonXPress1250M RadeonXPress1250M

Network

Modem 56Kbps F.Option 56Kbps F.Option

Ethernet 10/100 10/100

Wireless bg bg

Port PCMCIA, 4USB, TV-out, VGA,

Audio PCI Express Card, 3USB,

VGA, Audio

BATTERY 6CELL 6CELL

ODD Super-Multi Super-Multi

Size (cm) 340.4 x 259.6

31.1~38.7 335.9 x 240.4

28.2~38.8

Weight (kg) 2.46 2.46

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2- 8

2. Introduction and Specification

3) Specification comparison

모델명

LG(T1- Sony (VGN- HP(V3037TU) Samsung(X22)

CPU T2400 M760 T2300E T7100

LCD 14.0”WXGA 14.1”WXGA 14.1”WXGA 14.1”WXGA/WXGA+

Graphics Intel GMA950 Intel GMA950 Intel GMA950 ATI X2400

Memory DDR2 1024MB DDR2 512MB DDR2 512MB DDR2 1024MB

HDD 60GB 80GB 80GB 80GB

ODD COMBO DVD±RW COMBO Super-Multi

Network Modem

Gigabit, abg

Modem

10/100, bg

Modem

10/100, abg

Modem(56Kbps)

Gigabit

abg/n or abg

Battery 6Cell 6Cell 6Cell 4Cell/8Cell

PC Card Slot 4-in-1 MS, MS pro 5-in-1 6-in-1

Port 3xUSB,1394

VGA, S-Video

3xUSB,1394

VGA, S-Video

3xUSB, 1394

VGA, S-Video

3xUSB, no 1394

VGA,

Dock -Replicator- X-Dock

Size (cm) 334x240

21.5~31.5

340x253.5

21~33

334x237

26~39

335.9 x 240.4

28.2~38.8

Weight (kg) 1.93 2.4 2.4 2.19

- 이 문서는 삼성전자의 기술 자산으로 승인자만이 사용할 수 있습니다 -

- This Document can not be used without Samsung's authorization -

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