Sony XM-DS1600P5 Operating & Mounting Bedienungsanleitung

SERVICE MANUAL

US Model

Canadian Model

XM-DS1600P5

MONAURAL POWER AMPLIFIER

Other Specifications

Circuit system Class D Technology

Pulse power supply

Inputs RCA pin jacks

High level input connector

Outputs Speaker terminals

Through out pin jacks

Suitable speaker impedance

2 – 8 Ω

Maximum outputs 1,000 W (at 4 Ω)

1,600 W (at 2 Ω)

Rated outputs (supply voltage at 14.4V)

500 W (20 – 300 Hz, 0.2% THD, at 4 Ω)

900 W (20 – 300 Hz, 0.6% THD, at 2 Ω)

Frequency response 5 – 300 Hz ( dB)

Harmonic distortion 0.06% or less (at 100 Hz, 4 Ω)

Input level adjustment range

0.3 – 6.0 V (RCA pin jacks)

1.2 – 12.0 V (High level input)

Sub-sonic filter 15 Hz, –12 dB/oct

Low-pass filter 50 – 300 Hz, –12 dB/oct

Low boost 0 – 10 dB (40 Hz)

Power requirements 12 V DC car battery

(negative ground)

Power supply voltage 10.5 – 16 V

Current drain at rated output : 90 A (at 2 Ω)

Remote input : 2 mA

Dimensions Approx. 347 ×57 ×339 mm

(13 3/4 ×2 1/4 ×13 3/8 in.) (w/h/d) not incl.

projecting parts and controls

Mass Approx. 3.8 kg (8 lb. 6 oz.) not incl. accessories

Supplied accessories Mounting screws (5)

High level input cord (1)

Protection cap (1)

4P modularcable (1)

Remote level controller (1)

Screws (2)

Design and specifications are subject to change without

notice.

SPECIFICATIONS

AUDIO POWER SPECIFICATIONS (US MODEL)

POWER OUTPUTAND TOTAL HARMONIC DISTORTION

500 watts minimum continuous average power into 4 ohms,

20 Hz to 300 Hz with no more than 0.2% total harmonic

distortion per Car Audio Ad Hoc Committee standards.

+0.5

–3

Notes on Chip Component Replacement

•Never reuse a disconnected chip component.

•Notice that the minus side of a tantalum capacitor may be

damaged by heat.

Ver 1.0 2003. 12

Sony Corporation

e Vehicle Company

Published by Sony Engineering Corporation

9-961-619-01

2003L04-1

TABLE OF CONTENTS

1. GENERAL

Location and Function of Controls.......................................... 3

Connections ............................................................................. 4

2. DISASSEMBLY

2-1. Bottom Plate ........................................................................ 6

2-2. Main Board Section ............................................................. 7

2-3. Disassembly and Assembly of Ornamental Plate ................ 7

2-4. Main Board .......................................................................... 8

2-5. LED Board ........................................................................... 8

3. DIAGRAMS

3-1. IC Block Diagrams .............................................................. 9

3-2. Printed Wiring Boards –Main Section (1/2)– .................... 10

3-3. Printed Wiring Boards –Main Section (2/2)– .................... 11

3-4. Schematic Diagram –Main Section (1/2)– ........................ 12

3-5. Schematic Diagram –Main Section (2/2)– ........................ 13

4. EXPLODED VIEWS

4-1. Heat Sink (Main) Section .................................................. 15

4-2. Main Board Section ........................................................... 16

5. ELECTRICAL PARTS LIST......................................... 17

XM-DS1600P5

SAFETY-RELATED COMPONENT WARNING!!

COMPONENTS IDENTIFIED BY MARK 0OR DOTTED LINE

WITH MARK 0ON THE SCHEMATIC DIAGRAMS AND IN

THE PARTS LIST ARE CRITICAL TO SAFE OPERATION.

REPLACE THESE COMPONENTS WITH SONY PARTS WHOSE

PART NUMBERS APPEAR AS SHOWN IN THIS MANUAL OR

IN SUPPLEMENTS PUBLISHED BY SONY.

ATTENTION AU COMPOSANT AYANT RAPPORT

À LA SÉCURITÉ!!

LES COMPOSANTS IDENTIFIÉS PAR UNE MARQUE 0SUR LES

DIAGRAMMESSCHÉMATIQUES ETLALISTE DES PIÈCES SONT

CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE

REMPLACER CES COMPOSANTS QUE PAR DES PIÈCES SONY

DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU

DANS LES SUPPLÉMENTS PUBLIÉS PAR SONY.

XM-DS1600P5

SECTION 1

GENERAL This section is extracted

from instruction manual.

XM-DS1600P5

XM-DS1600P5 SECTION 2

DISASSEMBLY

Note : Follow the disassembly procedure in the numerical order given.

2-1. BOTTOM PLATE

Note : This set can be disassemble according to the following sequence.

2-1. BOTTOM PLATE

(Page 6)

2-2. MAIN BOARD SECTION

(Page 7)

2-5. LED BOARD

(Page 8)

SET

2-4. MAIN BOARD

(Page 8) 2-3. DISASSMBLY AND ASSEMBLY

OF ORNAMENTAL PLATE

(Page 7)

bottom plat

insulating sheet

three

screws

(+P 3

five

screws

(+P 3

screw

(+P 3

XM-DS1600P5

2-3. DISASSEMBLY AND ASSEMBLY OF ORNAMENTAL PLATE

2-2. MAIN BOARD SECTION

heat sink (main)

CNT2

MAIN board section

three

screws

(+BTP 3

14)

three

screws

(+BTP 3

14)

three

screws

(+BTP 3

)

screw

(+P 3

heat sink (main)

At disassembly:

At assembly:

ornamental plate

cut

welding

heat sink (main)

ornamental plate

XM-DS1600P5

2-4. MAIN BOARD

2-5. LED BOARD

panel (front)

MAIN board

two

screws

(+P 3

screw

(+P 3

LED board heat sink (main)

screw

(+P 3

XM-DS1600P5

3-1. IC BLOCK DIAGRAMS

IC6 TL494CN

SECTION 3

DIAGRAMS

•A: B+ Line.

•B: B– Line.

•Total current is measured with no-signal condition.

•Powervoltageisdc14.4Vandfedwithregulateddcpower

supply from +12V and REM terminals.

•Voltage is dc with respect to ground under no-signal

condition.

•Voltages are taken with aVOM(Inputimpedance10MΩ).

Voltage variations may be noted due to normal produc-

tion tolerances.

•Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc-

tion tolerances.

•Circled numbers refer to waveforms.

•Signal path.

F:AUDIO

for printed wiring boards:

Note:

•X: parts extracted from the component side.

•: Pattern from the side which enables seeing.

(The other layer’s patterns are not indicated.)

THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS

AND SCHEMATIC DIAGRAMS.

(In addition to this, the necessary note is

printed in each block.)

for schematic diagram:

Note:

•All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolytics

and tantalums.

•All resistors are in Ωand 1/4W or less unless otherwise

specified.

•%: indicates tolerance.

•2: nonflammable resistor.

Caution:

Pattern face side: Parts on thepatternfaceside seenfrom the

(Side B) pattern face are indicated.

Parts face side: Parts on the parts face side seen from the

(Side A) parts face are indicated.

Note:

The components identi-

fied by mark 0or dotted

linewithmark0arecriti-

cal for safety.

Replace only with part

number specified.

Note:

Lescomposantsidentifiéspar

une marque 0sont critiques

pour la sécurité.

Ne les remplacer que par une

piéce portant le numéro

spécifié.

IC10 SSM2018TP

BAL

GND

MODE

V-

COMP3

+I1 1-G

V+

-I1

COMP1

+IN

-IN

COMP2

GAIN

CORE

OSC

REF 5V

ERROR

0.1V

16 15 14 13 12 11 10 9

1 2 3 4 5 6 7 8

NON

INV

VREF

VCC

OUT

+IN

-IN

COMP EN

GND

TIME

10 10

XM-DS1600P5

3-2. PRINTED WIRING BOARDS — MAIN SECTION (1/2) — • Refer to page 9 for Common Note on Printed Wiring Boards.

2345678910111213

MAIN BOARD (SIDE A)

814

BCE

BCE BCE BCE

BCE

BCEBCE

ECB

BCE

ECB

BCE

ECB

BCE

1-861-422-

(11)

LED BOARD

(SIDE A)

1-861-423-

(11)

(POWER)

(PROTECTOR)

POWER/PROTECTOR

VOLUME

BOARD

(SIDE A)

VOLUME ASSY

(11)

1-861-424-

R302 R48 R47

C32

R66

R128

R88

R74

R75

R76

C33

R77

R67

C31

R80

R170

R97

R79

R69

R68

R104

R85

R103

R106

R152

D26

R150

R87

R82

C38

R54

C35

R81 R17 R18

CF1 R19

C49

R112

R113

R213

R129

R127 R131

R62R61

C56

C55

R108

R171

C44

R64

R65

R92

C42

C37

C18

C19

R91

Q9 Q8 Q7

Q44

Q16

Q42

Q45

D23

Q14

Q15

Q37

D11

Q35

Q43 Q10

Q17

Q48 D3

Q39

Q13

Q36

Q34

Q11

R72

C43

R180

R183

R162

R149 R84

R164

R157

R158

C20

R132

R130

R173

LED3

LED2

R172

R175

R105

C48

R159

R25

R23

IC2

IC5

IC4

IC9

IC7

IC8

IC1

R24

R50

R43

R51

R52

R126

R125

R53

R174

R15

C14

R60

C15

R59

C16

R16

C10

R12 R13

R29

RV2

R27

R28

R109 R110

R111

R211

R117

R119

R215

R115

R116

R114

R118

R14

CV2

RV1

CV6

R58

RV3

RG20

RG19

RG18

RG17

RG16

RG15

RG14

RG13

RV4

CV7

RV5

RV6

R26

C24

R169

RS4

R123

R134

R56R57

RS3

R20

RS5

C21

R3R4

RS2RS1

C26C25

C2C23

C12

C13

R11

R10

R156

C28

C50 C53

R7 C27

R136

C30

C51 C52

R163 C 2 9

RC4

RC3

RC1

RC2

C54

R96

C36

R55

R160

CF9

R71

C22

R70

C6 R78

R86

C34

R166

CF10

R98 R83

R161 R184

R154

R99

R73

R90

R202

R102

R46

R45

THR3

THR1

R120

R107

R135

R182

R181

R151

R155

D3 H-7

D9 E-4

D11 F-4

D23 G-6

D26 G-7

IC1 G-4

IC2 F-4

IC4 E-3

IC5 F-4

IC7 H-7

IC8 F-5

IC9 F-4

LED2 G-12

LED3 G-12

Q5 F-6

Q6 F-7

Q7 G-7

Q8 G-8

Q9 G-8

Q10 G-4

Q11 G-5

Q13 I-9

Q14 G-6

Q15 G-6

Q16 G-7

Q17 G-5

Q34 G-5

Q35 G-5

Q36 G-6

Q37 F-3

Q39 G-6

Q42 G-7

Q43 G-5

Q44 G-7

Q45 G-7

Q48 H-7

• Semiconductor

Location (Side A)

Ref.No. Location

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