Texas Instruments LDC3114 Bedienungsanleitung

LDC3114 4-Channel Hybrid Inductive Touch and Inductance to Digital Converter

1 Features

• Multiple modes of operation:

– Raw data mode: access pre-processed

inductance measurement data to enable

advanced algorithms on MCU for linear sensing

– Button mode: button press detection with

baseline tracking and advanced on-chip post

processing

– Force level measurement of touch buttons

• Pin and register compatible to LDC2114

• Robust EMI performance allows for CISPR 22 and

CISPR 24 compliance

• Four independent channel operation

• Configurable scan rates:

– 0.625 SPS to 160 SPS

– Continuous scanning option

• Advanced button press detection algorithms:

– Adjustable force threshold per button

– Environmental shift compensation

– Simultaneous button press detection

• Low current consumption:

– One button: 6 µA at 0.625 SPS

– Two buttons: 72 µA at 20 SPS

• Temperature range

– TSSOP (16) : –40°C to +125°C

• Interface:

– 1.8-V and 3.3-V compliant I2C and INTB

– 1.8-V logic output per channel for buttons

2 Applications

• Consumer Electronics:

– Wearables

– Smart Speakers

– Sound Bars

• Industrial Applications:

– HMI Panels and Keypads

– Home Appliances

3 Description

The LDC3114 is an inductive sensing device that

enables touch button design for human machine

interface (HMI) on a wide variety of materials by

measuring small deflections of conductive targets

using a coil that can be implemented on a small

printed circuit board (PCB) located behind the panel.

This technology can be used for precise linear

position sensing of metal targets for automotive,

consumer and industrial applications by allowing

access to the raw data representing the inductance

value. Inductive sensing solution is insensitive to

humidity or non-conductive contaminants such as oil

and dirt.

The button mode of LDC3114 is able to automatically

correct for any deformation in the conductive targets.

The LDC3114 offers well-matched channels, which

allow for differential and ratiometric measurements

which enable compensation of environmental and

aging conditions such as temperature and mechanical

drift. The LDC3114 includes an ultra-low power mode

intended for power on/off buttons or position sensors

in battery powered applications.

The LDC3114 is easily configured through an I2C

interface. The LDC3114 is available in a 16-pin

TSSOP package.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

LDC3114 TSSOP (16) 5.00 mm × 4.40 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Inductive

Sensing Core

IN0

LP Mode &

Data

Processing

GND

SCL

SDA

I2C

LPWRB

IN3

COM

Digital

Button Press

Algorithm

VDD

Resonant

Circuit

Driver

OUT0

IN1

IN2

OUT1

OUT2

OUT3

Raw Data

& Config

INTB

3.3 V

LDC3114 Simplified Schematic

LDC3114

SNOSDD0 – DECEMBER 2021

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Pin Configuration and Functions...................................3

6 Specifications.................................................................. 4

6.1 Absolute Maximum Ratings........................................ 4

6.2 ESD Ratings............................................................... 4

6.3 Recommended Operating Conditions.........................4

6.4 Thermal Information....................................................4

6.5 Electrical Characteristics.............................................4

6.6 Digital Interface........................................................... 5

6.7 I2C Interface................................................................6

6.8 Timing Diagram...........................................................6

6.9 Typical Characteristics................................................ 7

7 Detailed Description........................................................9

7.1 Overview..................................................................... 9

7.2 Functional Block Diagram........................................... 9

7.3 Feature Description.....................................................9

7.4 Device Functional Modes..........................................14

7.5 Register Maps...........................................................15

8 Application and Implementation.................................. 37

8.1 Application Information............................................. 37

8.2 Typical Application.................................................... 48

9 Power Supply Recommendations................................51

10 Layout...........................................................................51

10.1 Layout Guidelines................................................... 51

10.2 Layout Example...................................................... 51

11 Device and Documentation Support..........................52

11.1 Documentation Support.......................................... 52

11.2 Receiving Notification of Documentation Updates.. 52

11.3 Support Resources................................................. 52

11.4 Trademarks............................................................. 52

11.5 Electrostatic Discharge Caution.............................. 52

11.6 Glossary.................................................................. 52

12 Mechanical, Packaging, and Orderable

Information.................................................................... 52

4 Revision History

DATE VERSION NOTES

December 2021 * Initial release.

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5 Pin Configuration and Functions

LPWRB SDA

OUT1

OUT0

SCLCOM

GND

OUT2

OUT3

INTB

IN3

VDD

IN2

IN1 IN0

8 9

161

Figure 5-1. LDC3114 PW Package 16-Pin TSSOP Top View

Table 5-1. Pin Functions

PIN I/O(1) DESCRIPTION

NAME NO.

VDD 4 P Power supply

GND 2G Ground(2)

INTB 5 O Interrupt output

Polarity can be configured in Register 0x11.

LPWRB 3 I Normal / Low Power Mode select

Set LPWRB to VDD for Normal Power Mode or ground for Low Power Mode.

COM 1 A

Common return current path for all LC resonator sensors

A capacitor should be connected from this pin to GND. Refer to Setting COM Pin

Capacitor.

IN0 9 A Channel 0 LC sensor input

IN1 8 A Channel 1 LC sensor input

IN2 7 A Channel 2 LC sensor input

IN3 6 A Channel 3 LC sensor input

OUT0 15 O Channel 0 logic output

Polarity can be configured in Register 0x1C.

OUT1 13 O Channel 1 logic output

Polarity can be configured in Register 0x1C.

OUT2 12 O Channel 2 logic output

Polarity can be configured in Register 0x1C.

OUT3 11 O Channel 3 logic output

Polarity can be configured in Register 0x1C.

SCL 16 I I2C clock

SDA 14 I/O I2C data

I2C address = 0x2A.

(1) I = Input, O = Output, P=Power, G=Ground, A=Analog

(2) Both pins should be connected to the system ground on the PCB.

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6 Specifications

6.1 Absolute Maximum Ratings

Over operating temperature range unless otherwise noted.(1)

MIN MAX UNIT

VDD Supply voltage 2.2 V

Voltage on SCL, SDA. INTB –0.3 3.6 V

Voltage on any other pin –0.3 2.2(2) V

TJJunction temperature –40 135 ℃

TSTG Storage temperature –65 125 °C

(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress

ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under

Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device

reliability.

(2) Maximum voltage across any two pins (not including SCL or SDA) is VDD + 0.3 V.

6.2 ESD Ratings

VALUE UNIT

V(ESD)

Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002(2) ±250

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

Over operating temperature range unless otherwise noted.

MIN NOM MAX UNIT

VDD Supply voltage 1.71 1.89 V

TAAmbient temperature (TSSOP Package) –40 125 °C

6.4 Thermal Information

THERMAL METRIC(1)

LDC3114

UNITTSSOP

16 PINS

RθJA Junction-to-ambient thermal resistance 105.1 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 40.3 °C/W

RθJB Junction-to-board thermal resistance 50.2 °C/W

ΨJT Junction-to-top characterization parameter 3.6 °C/W

ΨJB Junction-to-board characterization parameter 49.6 °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.5 Electrical Characteristics

Over operating temperature range unless otherwise noted.

Over operating VDD range unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

POWER

VDD Supply voltage 1.71 1.8 1.89 V

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Over operating temperature range unless otherwise noted.

Over operating VDD range unless otherwise noted.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

IDDNP

Normal power mode supply

current (4 channels)(1) (2)

4 channels, 40 SPS per channel,

1 ms sampling window per channel,

LPWRB = VDD

-40℃ ≤ TA ≤ 125℃

0.46 2 mA

Normal power mode supply

current (2 channels)(1) (2)

2 channels, 40 SPS per channel,

1 ms sampling window per channel,

LPWRB = VDD

-40℃ ≤ TA ≤ 125℃

0.31 1 mA

IDDLP

Low power mode supply current (1)

(2)

1 channel, 1.25 SPS per channel,

1 ms sampling window per channel,

LPWRB = Ground

-40℃ ≤ TA ≤ 125℃

10 35 µA

IDDSB Standby supply current No button active (EN = 0x00)

-40℃ ≤ TA ≤ 125℃7 22 µA

SENSOR

ISENSOR, MAX Maximum sensor current drive Registers SENSORn_CONFIG: RPn =

0(3) 2.5 mA

RP, MIN

Minimum sensor parallel resonant

impedance 350 Ω

RP, MAX

Maximum sensor parallel resonant

impedance 10 kΩ

f SENSOR Sensor resonant frequency(4) 5 30 MHz

QSENSOR, MIN Minimum sensor quality factor 5

QSENSOR, MAX Maximum sensor quality factor 30

VSENSOR, PP

Sensor oscillation peak-to-peak

voltage

Measured on the INn (3) pins with

reference to COM. 0.9 V

CIN Sensor input pin capacitance 17 pF

CONVERTER

SRNP, MIN

Minimum normal power mode scan

rate(5) LPWRB = VDD 7 10 13 SPS

SRNP, MAX

Maximum normal power mode scan

rate(5) LPWRB = VDD 56 80 104 SPS

SRLP, MIN

Minimum low power mode scan

rate(5) LPWRB = Ground 0.438 0.625 0.813 SPS

SRLP, MAX

Maximum low power mode scan

rate(5) LPWRB = Ground 3.5 5 6.5 SPS

fREF_CLK Internal Reference clock frequency TA=25℃44 MHz

fREF_CLK_TC

Internal Reference clock frequency

variation from TA=25℃ to over

temperature

-40℃ ≤ TA ≤ 125℃3 %

(1) Sensor configuration: LSENSOR = 0.85 µH, CSENSOR = 58 pF, QSENSOR = 11, RP = 0.7 kΩ.

(2) I2C communication and pull-up resistors current is not included.

(3) The italic n is the channel index, n = 0, 1, 2, or 3 for LDC3114.

(4) For optimal performance, configure the sensor frequency to be greater than 3 MHz

(5) For typical distribution of the scan rates, refer to Figure 6-9.

6.6 Digital Interface

Over operating temperature range unless otherwise noted. Pins: LPWRB, INT_DR, OUT0, OUT1, OUT2, OUT3, and ADDR.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOLTAGE LEVELS

VIH Input high voltage, LPWRB pin 0.8 × VDD V

VIL Input low voltage, LPWRB pin 0.2 × VDD V

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Over operating temperature range unless otherwise noted. Pins: LPWRB, INT_DR, OUT0, OUT1, OUT2, OUT3, and ADDR.

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOH Output high voltage, OUTx pins ISOURCE = 400 µA 0.8 × VDD V

VOL Output low voltage, OUTx pins ISINK = 400 µA 0.2 × VDD V

ILDigital input leakage current –500 500 nA

VOL_INTB Output low voltage, INTB pin 3 mA sink current 0.4 V

6.7 I2C Interface

MIN TYP MAX UNIT

VOLTAGE LEVELS

VIH_I2C Input high voltage 0.7 × VDD V

VIL_I2C Input low voltage 0.3 × VDD V

VOL_I2C Output low voltage 3 mA sink current 0.2 × VDD V

HYSI2C Hysteresis 0.05 × VDD V

I2C TIMING CHARACTERISTICS

fSCL Clock frequency 400 kHz

tLOW Clock low time 1.3 µs

tHIGH Clock high time 0.6 µs

tHD;STA Hold time repeated START condition After this period, the first

clock pulse is generated. 0.6 µs

tSU;STA

Set-up time for a repeated START

condition 0.6 µs

tHD;DAT Data hold time 0 µs

tSU;DAT Data set-up time 100 ns

tSU;STO Set-up time for STOP condition 0.6 µs

tBUF

Bus free time between a STOP and

START condition 1.3 µs

tVD;DAT Data valid time 0.9 µs

tVD;ACK Data valid acknowledge time 0.9 µs

tSP

Pulse width of spikes that must be

suppressed by the input filter(1) 50 ns

(1) This parameter is specified by design and/or characterization and is not tested in production.

6.8 Timing Diagram

SCL

SDA

tHD;STA

tLOW

tHD;DAT

tHIGH

tSU;DAT

tSU;STA tSU;STO

START REPEATED

START

STOP

tHD;STA

START

tSP

tBUF

Figure 6-1. I2C Timing Diagram

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6.9 Typical Characteristics

Over recommended operating conditions unless specified otherwise. VDD = 1.8 V, TJ = 25°C. One channel enabled with a

button sampling window of 1 ms unless specified otherwise.

Figure 6-2. Supply Current vs Sensor RP for Normal Power

Mode. Sensor Frequency = 10 MHz. Sampling Window = 2mS.

Four Channels Enabled.

Figure 6-3. Supply Current vs Sensor RP for Normal Power

Mode. Sensor Frequency = 10 MHz. Sampling Window = 2mS.

Two Channels Enabled.

Figure 6-4. Supply Current vs Sensor RP for Low Power Mode.

Sensor Frequency = 10 MHz.

Figure 6-5. Supply Current vs Temperature. Sensor RP = 720 Ω,

Scan Rate = 40 SPS, Sensor Frequency = 20 MHz.

Figure 6-6. Supply Current vs. VDD. Sensor RP = 720 Ω, Scan

Rate = 40 SPS, Sensor Frequency = 20 MHz. Figure 6-7. Standby Current vs. Temperature

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6.9 Typical Characteristics (continued)

Over recommended operating conditions unless specified otherwise. VDD = 1.8 V, TJ = 25°C. One channel enabled with a

button sampling window of 1 ms unless specified otherwise.

Figure 6-8. Standby Current vs VDD

Percentage Offset ()

Occurrences

100

150

200

250

300

350

400

450

-12 -11 -10 -9 -8 -7 -6 -5 -4 -3 -2 -1 0 1 2 3 4

D007

Figure 6-9. Scan Rate Distribution at 30°C

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7 Detailed Description

7.1 Overview

The LDC3114 is a hybrid multichannel, low-noise, high-resolution inductance-to-digital converter (LDC)

optimized for inductive touch applications as well as linear position sensing. Button presses form micro-

deflections in the conductive targets which cause frequency shifts in the resonant sensors. The LDC3114 can

measure such frequency shifts and determine when button presses occur. With adjustable sensitivity per input

channel, the LDC3114 can reliably operate with a wide range of physical button structures and materials. The

high resolution measurement enables the implementation of force level buttons. The LDC3114 incorporates

customizable post-processing algorithms for enhanced robustness.

The LDC3114 additionally implements a raw data access mode. The MCU can read directly the data

representing the effective inductance of the sensor and implement further post processing. In this mode,

additional post processing features such as baseline tracking and algorithms for false button detection are

ignored. This mode is useful for linear or rotary position sensing with inductive sensors while having excellent

EMI performance across wide range of applications. This mode can also be used to measure the micro-

deflection for button-like applications as well.

The LDC3114 can operate in an ultra-low power mode for optimal battery life, or can be toggled into a higher

scan rate for more responsive button press detection for game play or other low latency applications. The

LDC3114 is operational from –40°C to +125°C with a 1.8 V ± 5% power supply voltage.

The LDC3114 is configured through 400-kHz I2C. Button presses can be reported through the I2C interface

or with configurable polarity dedicated push-pull outputs. Besides the LC resonant sensors, the only external

components necessary for operation are supply bypassing capacitors and a COM pin capacitor to ground.

7.2 Functional Block Diagram

Inductive

Sensing Core

IN0

LP Mode &

Data

Processing

GND

SCL

SDA

I2C

LPWRB

IN3

COM

Digital

Button Press

Algorithm

VDD

Resonant

Circuit

Driver

OUT0

IN1

IN2

OUT1

OUT2

OUT3

Raw Data

& Config

INTB

3.3 V

Figure 7-1. Block Diagram of LDC3114

7.3 Feature Description

7.3.1 Multimode Operation

LDC3114 offers two main modes of operations: raw data access mode and button algorithm mode which is

controlled by the BTN_ALG_EN field in Register INTPOL Address 0x11. Figure 7-2 shows conceptually how

these two modes are implemented.

Raw data access mode allows an external MCU to extract data from the signal after the inductance-to-digital

converter from registers through I2C (see Raw Data Output). There is no further processing on this raw data

such as baseline tracking, integrated button algorithms and button thresholding. This mode gives MCU full

control over the measured raw data to implement algorithms for linear position sensing, rotational encoder

applications, metal presence/deflection applications, smart button algorithms and for multimodal sensor fusion

applications.

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The second mode is button algorithm mode. Here further processing with parameters defined by the user (see

Baseline Tracking and Integrated Button Algorithms) is done on the data and a button thresholding as defined

by the user is applied. The processed data are available in separate registers to be read by I2C and any button

press detection is indicated on the OUTx pins (see Button Output Interfaces) This mode is used to implement

button press functionality and can also be used to implement the measurement of force applied for button press

along with detection to implement multilevel button press.

For register settings that are applicable to button mode versus raw access data mode are clearly identified in the

descriptions of the registers (see Register Maps).

L to

Digital

Converter

LC Driver

Sampler

Baseline

Tracking

Button

Press

Detection

OUTx, INTB Pins

DATAx Regs

I2C Add: 0x02-0x09

INTB Pin

RAW_DATAx Regs

I2C Add: 0x59-0x64

BTN_ALG_EN=1

BTN_ALG_EN=0

Figure 7-2. Multimode Operation in LDC3114

7.3.2 Multichannel and Single-Channel Operation

The LDC3114 provides four independent sensing channels. In the following sections, some parameters, such as

DATAn and SENSORn_CONFIG, contain a channel index n.

Any of the four channels available in the LDC3114 can be independently enabled by setting the ENn and LPENn

(n = 0, 1, 2, or 3) bit fields in Register EN (Address 0x0C). The low-power-enable bit LPENn only takes effect

if the corresponding ENn bit is also set. If only one channel is set active, the LDC3114 periodically samples the

single active channel at the configured scan rate. When several channels are set active, the LDC3114 operates

in multichannel mode, and the device sequentially samples the active channels at the configured scan rate. Each

channel of the LDC3114 can be independently enabled in Low Power Mode and Normal Power Mode.

7.3.3 Raw Data Output

Raw data mode is enabled by setting BTN_ALG_EN=0x0 field in Register INTPOL Address 0x11. Figure 7-2

shows that this operation will extract data directly from the output of the inductance-to-digital converter.

The data is read from the I2C interface of the LDC3114. The DATA_RDY field in Register OUT (Address 0x01)

indicates when new data is available for reading. In the raw data mode, the INTB pin also assserted when new

data is available and can be used by the MCU as an interrupt. The raw data can be extracted by reading, the

output RAW_DATAn_x registers (n = 0, 1, 2, or 3, for each channel, x= 1, 2, or 3 splitting 24-bit data over 3 8-bit

REF _ CLK

SENSOR

30 W f

fraw _ data

u u

(1)

where:

• fsensor is the instantaneous frequency of the inductive sensor

• fREF_CLK is the internal reference clock frequency as specified in Electrical Characteristics

• raw_data is the decimal representation of 24-bit binary data read from the RAW_DATAn_x for a particular

channel

• W calculated in Equation 2 (see Programming Button or Raw Data Sampling Window for details):

 

LCDIV

W 128 1 SENCY 2u  un

(2)

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