Digi XBee 3 Kurzanleitung

Digi XBee® 3

RF Module

Hardware Reference Manual

Revision history—90001543

Revision Date Description

J October

2018

Added Brazilian certifications.

K March

2019

Added BLE power output specifications. Added I2C pin specifications. Added a

new antenna. Added XBee3 USB Adapter information.

L April 2019 Added XBIB-C board information.

M May 2019 Added FCC publication 996369 related information.

N December

2019

Added antennas.

Trademarks and copyright

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property of their respective owners.

Disclaimers

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any kind, expressed or implied, including, but not limited to, the implied warranties of fitness or

merchantability for a particular purpose. Digi may make improvements and/or changes in this manual

or in the product(s) and/or the program(s) described in this manual at any time.

Warranty

To view product warranty information, go to the following website:

www.digi.com/howtobuy/terms

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Gather support information: Before contacting Digi technical support for help, gather the following

information:

Product name and model

Product serial number (s)

Firmware version

Operating system/browser (if applicable)

Logs (from time of reported issue)

Trace (if possible)

Digi XBee® 3 RF Module Hardware Reference Manual 2

Description of issue

Steps to reproduce

Contact Digi technical support: Digi offers multiple technical support plans and service packages.

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Digi XBee® 3 RF Module Hardware Reference Manual 3

Contents

Digi XBee® 3 RF Module Hardware Reference Manual

General XBee 3 specifications

General specifications 9

Regulatory conformity summary 9

Serial communication specifications 10

UART pin assignments 10

SPI pin assignments 10

GPIO specifications 10

Electro Static Discharge (ESD) 11

IEEE 802.15.4-specific specifications

Performance specifications 13

Power requirements 13

Networking and security specifications 13

Communication interface specifications 14

Mechanical drawings

XBee 3 surface-mount antennas 16

XBee 3 surface-mount - U.FL/RF pad antenna 16

XBee 3 surface-mount - embedded antenna 17

XBee 3 micro antennas 18

XBee 3 micro (U.FL/RF Pad) 18

XBee 3 micro (chip antenna) 19

XBee 3 through-hole antennas 20

XBee 3 through-hole - PCB antenna 20

XBee 3 through-hole - U.FL antenna 20

XBee 3 through-hole - RPSMA antenna 21

Pin signals

Pin signals for the XBee 3 surface-mount module 23

Pin signals for the XBee 3 micro module 26

Pin signals for the XBee 3 through-hole module 29

Recommended pin connections 30

Digi XBee® 3 RF Module Hardware Reference Manual 4

Digi XBee® 3 RF Module Hardware Reference Manual 5

Design notes

Power supply design 32

Board layout 32

Antenna performance 32

Design notes for PCB antenna and chip antenna devices 33

Surface-mount embedded antenna keepout area 33

XBee 3 Micro chip antenna keepout area 34

Through-hole embedded antenna keepout area 35

Design notes for RF pad devices 35

Copper keepout for test points 38

Regulatory information

United States (FCC) 41

OEM labeling requirements 41

FCC notices 41

FCC-approved antennas (2.4 GHz) 42

RF exposure 50

XBee 3 USB Adapter 50

FCC publication 996369 related information 50

Europe (CE) 51

Maximum power and frequency specifications 51

OEM labeling requirements 51

Declarations of conformity 52

Antennas 52

ISED (Innovation, Science and Economic Development Canada) 53

Labeling requirements 53

For XBee 3 53

RF Exposure 53

Australia (RCM)/New Zealand 54

Japan (TELEC) 54

Brazil ANATEL 54

Modelo: XBee 3 55

South Korea 55

XBIB-C development boards

XBIB-C Micro Mount reference 57

XBIB-C SMT reference 59

XBIB-CU TH reference 61

XBIB-C-GPS reference 63

Interface with the XBIB-C-GPS module 65

I2C communication 66

UART communication 66

Manufacturing information

Recommended solder reflow cycle 68

Handling and storage 68

Recommended footprint 68

Flux and cleaning 70

Reworking 71

Digi XBee® 3 RF Module Hardware Reference Manual 6

Troubleshooting

Brownout issue 73

Voltage brownout 73

Voltage ramp up discontinuities 73

How to distinguish revision B parts 73

Digi XBee® 3 RF Module Hardware Reference Manual

This manual provides information for the XBee 3 RF Module hardware. The XBee 3 RF Module can be

any of the following form factors:

nMicro-mount

nThrough-hole

nSurface-mount

For more information about the operation and programming functions of the device, see:

nXBee 3 DigiMesh RF Module User Guide

nXBee 3 Zigbee RFModule User Guide

nXBee 3 802.15.4 RFModule User Guide

Digi XBee® 3 RF Module Hardware Reference Manual 7

General XBee 3 specifications

The following tables provide general specifications for the hardware.

General specifications 9

Regulatory conformity summary 9

Serial communication specifications 10

GPIO specifications 10

Electro Static Discharge (ESD) 11

Digi XBee® 3 RF Module Hardware Reference Manual 8

General XBee 3 specifications General specifications

Digi XBee® 3 RF Module Hardware Reference Manual 9

General specifications

The following table describes the general specifications for the devices.

Specification

XBee 3/XBee 3-PRO

micro-mount

XBee 3/XBee 3-PRO

surface-mount

XBee 3/XBee 3-PRO

through-hole

Operating frequency

band

ISM 2.4 – 2.4835 GHz

Form factor Micro-mount Surface-mount Through-hole

Dimensions Micro-mount: 1.36 cm x

1.93 cm x 0.241 cm (0.534

in x 0.760 in x 0.095 in)

Surface-mount: 2.199

x 3.4 x 0.368 cm (0.866

x 1.33 x 0.145 in)

Through-hole: 2.438

x 2.761 cm (0.960 x

1.087 in)

Operatingtemperature -40 to 85 °C (industrial)

Antenna options RF pad, chip antenna, or

U.FL connector

RF pad, embedded

antenna, or U.FL

connector

RPSMA connector,

embedded antenna,

or U.FL connector

Analog-to-digital

converter (ADC)

4 10-bit analog inputs 4 10-bit analog inputs 4 10-bit analog

inputs

Regulatory conformity summary

This table describes the agency approvals for the devices.

Approval XBee 3 XBee 3-PRO

United States (FCC Part 15.247) FCC ID: MCQ-XBEE3 FCC ID: MCQ-XBEE3

Innovation, Science and Economic Development

Canada (ISED)

IC: 1846A-XBEE3 IC: 1846A-XBEE3

FCC/IC Test Transmit Power Output range -6.8 to +8 dBm -6.8 to +19.9 dBm

Bluetooth® (XBee 3 Zigbee only) Declaration ID:

D042514

QDID: 121268

Declaration ID:

D042514

QDID: 121268

Australia RCM RCM

Brazil ANATEL 06329-18-

01209

ANATEL 06329-18-

01209

Europe (CE) Yes No

Japan (TELEC) R210-119309 No

RoHS Compliant

South Korea (KCC) R-C-DIG-XBEE3 No

General XBee 3 specifications Serial communication specifications

Digi XBee® 3 RF Module Hardware Reference Manual 10

Serial communication specifications

The XBee 3 RF Module supports Universal Asynchronous Receiver / Transmitter (UART) and Serial

Peripheral Interface (SPI)serial connections.

UART pin assignments

UART pins Device pin number

XBee 3 micro-mount XBee 3 surface-mount XBee 3 through-hole

DOUT/DIO13 3 3 2

DIN / CONFIG/DIO14 4 4 3

CTS / DIO7 24 25 12

RTS/ DIO6 27 29 16

SPI pin assignments

SPI pins Device pin number

XBee 3 micro-mount XBee 3 surface-mount XBee 3 through-hole

SPI_CLK 13 14 18

SPI_SSEL 14 15 17

SPI_MOSI 15 16 11

SPI_MISO 16 17 4

SPI_ATTN 11 12 19

GPIO specifications

XBee 3 RF Modules have 15 General Purpose Input / Output (GPIO) ports available. The exact list

depends on the device configuration as some GPIO pads are used for purposes such as serial

communication.

GPIO electrical specification Value

Voltage - supply 2.1 - 3.6 V

Low switching threshold 0.3 x VCC

High switching threshold 0.7 x VCC

Input pull-up resistor value 40 kΩ(typical)

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